CN210815033U - Polishing solution preparation device - Google Patents
Polishing solution preparation device Download PDFInfo
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- CN210815033U CN210815033U CN201921459628.2U CN201921459628U CN210815033U CN 210815033 U CN210815033 U CN 210815033U CN 201921459628 U CN201921459628 U CN 201921459628U CN 210815033 U CN210815033 U CN 210815033U
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- 238000005498 polishing Methods 0.000 title claims abstract description 313
- 238000002360 preparation method Methods 0.000 title description 8
- 239000011550 stock solution Substances 0.000 claims abstract description 105
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 75
- 239000000243 solution Substances 0.000 claims abstract description 62
- 230000000694 effects Effects 0.000 claims abstract description 29
- 239000002904 solvent Substances 0.000 claims abstract description 22
- 239000004094 surface-active agent Substances 0.000 claims description 46
- 239000007788 liquid Substances 0.000 claims description 45
- 238000010438 heat treatment Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 229910052710 silicon Inorganic materials 0.000 abstract description 12
- 239000010703 silicon Substances 0.000 abstract description 12
- 239000013078 crystal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 238000009510 drug design Methods 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model provides a polishing solution configuration device, wherein a rough polishing unit comprises a rough polishing stock solution group and a rough polishing mixing barrel, the rough polishing stock solution group is communicated with the rough polishing mixing barrel, and the rough polishing mixing barrel is communicated with a polishing machine; the fine polishing unit comprises a fine polishing stock solution group and a fine polishing mixing barrel, the fine polishing stock solution group is communicated with the fine polishing mixing barrel, and the fine polishing mixing barrel is communicated with the polishing machine; the surface activity unit comprises a surface activity stock solution group and a surface activity mixing barrel, the surface activity stock solution group is communicated with the surface activity mixing barrel, and the surface activity mixing barrel is communicated with the polishing machine; the pure water unit is communicated with the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel; circulating pumps are arranged in the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel, and when the pure water solvent is completely prepared and the original solution solute begins to be titrated, the circulating pumps begin to work circularly. The utility model discloses but automatic control polishing solution configuration proportion improves silicon chip surface quality, and degree of automation is high, and production efficiency is high.
Description
Technical Field
The utility model belongs to the technical field of semiconductor silicon chip polishing, especially, relate to a polishing solution configuration device.
Background
The existing polishing solution has high overall cost due to large occupied area and complicated supply process of a supply device; the automatic level of joining in marriage liquid is low, and liquid is mainly joined in marriage to the manual work, not only can increase operator's work load but also can't guarantee the configuration precision of polishing solution, seriously influences product quality, can't satisfy current production technical requirement, restricts batch production's popularization, causes manufacturing cost higher.
Disclosure of Invention
The to-be-solved problem of the utility model is to provide a polishing solution configuration device, especially be applicable to the configuration device of polishing solution among the silicon chip polishing process, solved among the prior art polishing solution configuration process loaded down with trivial details, degree of automation is low and the configuration precision is poor technical problem, and the purpose is in order to improve silicon chip surface quality, has reduced manufacturing cost, has improved product quality.
In order to solve the technical problem, the utility model discloses a technical scheme is:
a polishing liquid preparing apparatus, comprising:
a rough polishing unit: the device comprises a rough polishing stock solution group and a rough polishing mixing barrel, and is used for mixing and preparing rough polishing solution and conveying the mixed rough polishing solution to a polishing machine for use; the rough polishing stock solution group is communicated with the rough polishing mixing barrel, and the rough polishing mixing barrel is communicated with the polishing machine;
a fine polishing unit: the polishing device comprises a fine polishing stock solution group and a fine polishing mixing barrel, wherein the fine polishing stock solution group and the fine polishing mixing barrel are used for mixing and preparing fine polishing solution and conveying the mixed fine polishing solution to a polishing machine for use; the fine polishing stock solution group is communicated with the fine polishing mixing barrel, and the fine polishing mixing barrel is communicated with the polishing machine;
surface active unit: the device comprises a surface active stock solution group and a surface active mixing barrel, and is used for mixing and preparing a surfactant and conveying the mixed surfactant to a polishing machine for use; the surface active stock solution group is communicated with the surface active mixing barrel, and the surface active mixing barrel is communicated with the polishing machine;
a pure water unit: the surface activity mixing barrel is communicated with the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel and is used for providing pure water solvent for the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel;
the output ends of the rough polishing stock solution group, the fine polishing stock solution group, the surface activity stock solution group, the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel are respectively provided with a supply pump and a control valve;
circulating pumps are arranged in the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel, and when the pure water solvent is completely prepared and the solute of the stock solution begins to be titrated, the circulating pumps begin to work circularly;
a controller: and the control valve is connected with the supply pump, the control valve and the circulating pump and is used for controlling the working states of the rough polishing unit, the fine polishing unit, the surface activity unit and the pure water unit.
Further, the rough polishing stock solution group comprises a rough polishing stock solution barrel and a KOH stock solution barrel, and the rough polishing stock solution barrel and the KOH stock solution barrel are respectively communicated with the rough polishing mixing barrel.
Further, a heater is arranged between the rough polishing mixing barrel and the polishing machine and used for heating the rough polishing liquid output from the rough polishing mixing barrel.
Further, a temperature sensor is arranged at the heater and connected with the controller to detect the temperature of the heater.
Further, the temperature of the heater is 22-26 ℃.
Furthermore, liquid level sensors are arranged in the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel to sense the height of the pure water solvent in the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel.
Furthermore, the fine polishing stock solution group comprises fine polishing stock solution barrels, and the number of the fine polishing stock solution barrels is one, and the fine polishing stock solution barrels are communicated with the fine polishing mixing barrel.
Further, the surfactant stock solution group comprises surfactant stock solution barrels, and the number of the surfactant stock solution barrels is one, and the surfactant stock solution barrels are communicated with the surfactant mixing barrel.
Further, the supply pump is a one-way dosing pump.
Furthermore, the number of the rough polishing stock solution barrel and the number of the KOH stock solution barrels are both one.
The utility model has the advantages and positive effects that:
1. compared with the prior art, the utility model provides a polishing solution configuration device, through the configuration flow of rational design rough throwing unit, the unit is thrown to the essence and surface activity unit, can whole automatic control polishing solution's configuration proportion, degree of automation is high and safe controllable, can guarantee used rough throwing liquid of burnishing machine, the liquid and the surfactant active are thrown to the essence completely, satisfy the production standard needs.
2. The temperature of the rough polishing liquid in the rough polishing unit has a great influence on the whole polishing process, so a heater is specially arranged to heat the rough polishing liquid output by the rough polishing unit to the polishing machine, and meanwhile, the temperature of the rough polishing liquid is monitored by a temperature sensor, so that the temperature of the rough polishing liquid is ensured to be constant at 22-26 ℃, and the rough polishing liquid can enable the surface of a silicon wafer to have complete crystal lattices, higher flatness and cleanness at the temperature, and the surface quality of the silicon wafer is ensured.
Drawings
Fig. 1 is a polishing solution preparing apparatus according to a first embodiment of the present invention.
In the figure:
100. rough polishing unit 101, rough polishing mixing barrel 102 and rough polishing raw liquid barrel
103. A KOH raw liquid barrel 104, a first circulating pump 105 and a first supply pump
106. A second supply pump 107, a third supply pump 108 and a first liquid level sensor
109. Heater 110, temperature sensor 200, fine polishing unit
201. A fine polishing mixing barrel 202, a fine polishing stock solution barrel 203 and a circulating pump II
204. Four supply pumps 205, five supply pumps 206 and two liquid level sensors
300. Surface active unit 301, surface active mixing barrel 302 and surface active stock solution barrel
303. Circulating pump three 304, supply pump six 305 and supply pump seven
306. Liquid level sensor III 400, pure water unit 401 and pure water pipe I
402. Pure water pipe two 403, pure water pipe three 500, polishing machine
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
A polishing solution preparing apparatus, as shown in FIG. 1, includes a rough polishing unit 100, a fine polishing unit 200, a surface active unit 300, a pure water unit 400, and a controller. The rough polishing unit 100 comprises a rough polishing stock solution group and a rough polishing mixing barrel 101, wherein the rough polishing stock solution group comprises a rough polishing stock solution barrel 102 and a KOH stock solution barrel 103, the number of the rough polishing stock solution barrels 102 and the number of the KOH stock solution barrels 103 are both one, and the rough polishing stock solution barrel 102 and the KOH stock solution barrel 103 are respectively communicated with the rough polishing mixing barrel 101 through pipelines. The output end of a pure water pipe I401 in the pure water unit 400 is communicated with the rough polishing mixing barrel 101, the output ends of the rough polishing stock solution barrel 102 and the KOH stock solution barrel 103 are communicated with the rough polishing mixing barrel 101, and the output end of the rough polishing mixing barrel 101 is communicated with the polishing machine 500. The rough polishing unit 100 is configured to mix a rough polishing solute formed by mixing a certain amount of rough polishing stock solution in the rough polishing stock solution barrel 102 and a certain amount of KOH stock solution in the KOH stock solution barrel 103, mix the rough polishing solute with a certain amount of pure water solvent output by the pure water unit 400 to form a rough polishing solution, and deliver the mixed rough polishing solution to the polishing machine 500 for use.
The fine polishing unit 200 comprises a fine polishing stock solution group and a fine polishing mixing barrel 201, the fine polishing stock solution group comprises a fine polishing stock solution barrel 202, the output end of the fine polishing stock solution barrel 202 is communicated with the fine polishing mixing barrel 201, the output end of the fine polishing mixing barrel 201 is communicated with the polishing machine 500, and the output end of a pure water pipe II 402 in the pure water unit 400 is communicated with the fine polishing mixing barrel 201. The fine polishing unit 200 is configured to mix a fine polishing solute formed by a certain amount of the fine polishing stock solution in the fine polishing stock solution tank 202 with a certain amount of pure water solvent output by the pure water unit 400 to form a fine polishing solution, and deliver the mixed fine polishing solution to the polishing machine 500 for use.
The surface active unit 300 comprises a surface active stock solution group and a surface active mixing barrel 301, the surface active stock solution group comprises a surface active stock solution barrel 302, the output end of the surface active stock solution barrel 302 is communicated with the surface active mixing barrel 301, the output end of the surface active mixing barrel 301 is communicated with the polishing machine 500, and the output end of a pure water pipe III 403 in the pure water unit 400 is communicated with the surface active mixing barrel 301. The surfactant unit 300 is configured to mix a surfactant solute formed by a surfactant stock solution in a certain amount of the surfactant stock solution 302 with a pure water solvent in a certain amount output by the pure water unit 400 to form a surfactant, and deliver the mixed surfactant to the polishing machine 500 for use.
The pure water unit 400 is sequentially communicated with the rough polishing mixing barrel 101, the fine polishing mixing barrel 201 and the surface active mixing barrel 301 through a pure water pipe I401, a pure water pipe II 402 and a pure water pipe III 403, and control valves are further arranged on the pure water pipe I401, the pure water pipe II 402 and the pure water pipe III 403 and used for controlling the pure water unit 400 to start and stop inputting pure water solvents into the rough polishing mixing barrel 101, the fine polishing mixing barrel 201 and the surface active mixing barrel 301. And a first liquid level sensor 108, a second liquid level sensor 206 and a third liquid level sensor 306 are sequentially arranged in the rough polishing mixing barrel 101, the fine polishing mixing barrel 201 and the surface activity mixing barrel 301 to respectively sense whether the heights of the pure water solvent in the rough polishing mixing barrel 101, the fine polishing mixing barrel 201 and the surface activity mixing barrel 301 meet the requirements or not.
In this embodiment, the output ends of the rough polishing raw liquid barrel 102, the KOH raw liquid barrel 103, the fine polishing raw liquid barrel 202, the surface active raw liquid barrel 302, the rough polishing mixing barrel 101, the fine polishing mixing barrel 201, and the surface active mixing barrel 301 are respectively provided with a supply pump and a control valve, and the supply pump and the control valve can control the working state of the corresponding barrel liquid in real time.
And a first circulating pump 104, a second circulating pump 203 and a third circulating pump 303 are sequentially arranged in the rough polishing mixing barrel 101, the fine polishing mixing barrel 201 and the surface activity mixing barrel 301, the first circulating pump 104, the second circulating pump 203 and the third circulating pump 303 are started and stopped by controlling the electromagnetic valves, and the circulating pumps start to circulate when the pure water solvent in the mixing barrels is completely prepared and the stock solution solute begins to be titrated.
The controller is a PLC controller (omitted from the drawing) of the polisher 500, is provided on a housing wall (omitted from the drawing) of the polisher, is connected to all of the supply pumps, the control valves, the circulation pumps, and the liquid level sensors, and controls the operation states of the rough polishing unit 100, the fine polishing unit 200, the surface active unit 300, and the pure water unit 400.
Further, a heater 109 is provided between the rough polishing mixing tub 101 and the polisher 500 for heating the rough polishing liquid output from the rough polishing mixing tub 101. A temperature sensor 110 is disposed at the heater 109, and the temperature sensor 110 is connected to the controller for detecting the temperature of the heater 109 and further controlling the temperature of the rough polishing solution delivered to the polishing machine 500. In the rough polishing unit 100, the temperature of the rough polishing solution has a great influence on the whole polishing process, so a heater 109 is specially arranged to heat the rough polishing solution delivered to the polishing machine 500 by the rough polishing unit 100, and the temperature of the rough polishing solution is monitored by the temperature sensor 110, so that the temperature of the rough polishing solution is kept at 22-26 ℃, and the rough polishing solution can enable the surface of a silicon wafer to have complete crystal lattices, high flatness and cleanness at the temperature, and ensure the surface quality of the silicon wafer. Wherein, charge pump, control valve and level sensor are common accessories, and the model of circulating pump can be decided according to the size of each tempering tank, all not specifically limit here.
In the embodiment, all the supply pumps are one-way quantitative supply pumps, so that the solution backflow caused by manual misoperation is prevented.
A control method of a polishing liquid preparing apparatus, which is used for the preparing apparatus as described in any one of the above, comprising the steps of:
s1: configuring the rough polishing unit 100
In the configuration of the rough polishing liquid in the rough polishing unit, the fine polishing unit 200 and the surfactant unit 300 may be configured at the same time, but it is required to ensure that the control valve of the output end of the fine polishing mixing tub 201 and the control valve of the output end of the surfactant mixing tub 301 are both in a closed state, and the configuration of the fine polishing unit 200 and the surfactant unit 300 will be described in detail later and will be omitted. The configuration of the rough polishing unit 100 specifically:
s11: the controller controls a control valve of a pure water pipe I401 in the pure water unit 400 to be in an open state, and the pure water solvent is input into the rough polishing mixing barrel 101; at this time, the second supply pump 106 and the output end control valve of the rough polishing stock solution barrel 102 and the third supply pump 107 and the output end control valve of the KOH stock solution barrel 103 are all in a closed state, and the first circulation pump 104, the second supply pump 106 and the output end control valve in the rough polishing mixing barrel 101 are all in a closed state. The controller controls the pure water solvent output by the pure water pipe I401 to be within the standard height range in the rough polishing mixing barrel 101 through the liquid level sensor I108, stops the water supply of the pure water pipe I401 in the pure water unit 400 when the pure water solvent reaches a certain amount, and closes the corresponding control valve of the pure water pipe I401.
S12: the controller controls the second supply pump 106 and the control valve of the second supply pump in the rough polishing stock solution barrel 102 to be opened, the rough polishing stock solution is input into the rough polishing mixing barrel 101, the first circulating pump 104 starts to work synchronously, and the first circulating pump 104 keeps working state all the time thereafter, so that the rough polishing solution in the rough polishing mixing barrel 101 is uniformly mixed and is fully stirred, and the uniformity and stability of the rough polishing solution are kept. After the second supply pump 106 finishes supplying the rough polishing stock solution in the rough polishing stock solution barrel 102 according to the configuration proportion, the second supply pump 106 stops working and the corresponding control valve is disconnected; at this time, the third supply pump 107 of the KOH raw liquid tank 103 is turned on, the KOH raw liquid starts to be input into the rough polishing mixing tank 101, and after the third supply pump 107 finishes supplying the KOH raw liquid in the KOH raw liquid tank 103 according to the configured ratio, the third supply pump 107 stops working and the corresponding control valve is turned off. And the circulating pump I104 in the rough throwing mixing barrel 101 is recycled for a certain time and then can be used. In this embodiment, the proportion of the rough polishing stock solution, the KOH stock solution, and the pure water is determined according to the actual situation, and is not specifically limited herein; accordingly, how long the mixed rough polishing solution needs to be recirculated and stirred is set according to the proportion of the rough polishing solution, and this is omitted here.
After the rough polishing solution is prepared, when the rough polishing solution is used for polishing, the controller opens the first supply pump 105 and a control valve thereof, simultaneously the heater 109 and the temperature sensor 110 are opened, the temperature of the heater 109 is ensured to be 22-26 ℃, the rough polishing solution is changed into the polishing solution in a constant temperature state when flowing through the heater 109 through a pipeline, and then flows into the polishing machine for use through the pipeline, and the first circulation pump 104 is kept in the opening state all the time. The temperature of the rough polishing solution is constant at 22-26 ℃, and the rough polishing solution can ensure that the surface of the silicon wafer has complete crystal lattices, higher planeness and cleanness and ensures the surface quality of the silicon wafer.
S2: configuring the fine polishing unit 200
In configuring the fine polishing liquid in the fine polishing unit 200, specifically:
s21: the controller controls a control valve of a pure water pipe II 402 in the pure water unit 400 to be in an open state, and the pure water solvent is input into the fine polishing mixing barrel 201; at this time, the supply pump five 205 and the output end control valve of the fine polishing stock solution barrel 202 are in a closed state, and the circulating pump two 203, the supply pump four 204 and the output end control valve in the fine polishing mixing barrel 201 are in a closed state. The controller controls the standard height of the pure water solvent output by the pure water pipe I401 in the fine polishing mixing barrel 201 through the liquid level sensor II 206, stops the water supply of the pure water pipe II 402 in the pure water unit 400 when the pure water solvent reaches a certain range, and closes the corresponding control valve of the pure water pipe II 402.
S22: after the control valve of the pure water pipe II 402 is closed, the controller controls the supply pump V205 and the control valve thereof in the fine polishing stock solution barrel 202 to be opened, the fine polishing stock solution is input into the fine polishing mixing barrel 201, the circulating pump II 203 starts to work synchronously, and the circulating pump II 203 keeps working state all the time thereafter, so as to ensure that the fine polishing solution in the fine polishing mixing barrel 201 is uniformly and stably mixed. After the supply pump five 205 finishes supplying the fine polishing stock solution in the fine polishing stock solution tank 202 according to the configured proportion, the supply pump five 205 stops working and the corresponding control valve is disconnected. At this time, the second circulation pump 203 in the fine polishing mixing barrel 201 can be used after being circulated for a certain time. In this embodiment, the proportion of the fine polishing stock solution to the pure water and how long the mixed fine polishing solution needs to be recycled and stirred are omitted, which depends on the actual situation.
After the fine polishing solution is prepared, when the fine polishing solution is used for polishing, the controller turns on the supply pump IV 204 and the control valve thereof, and meanwhile, the control valves at the output ends of the rough polishing unit 100 and the surface active unit 300 are both in a closed state, so that the polishing machine 500 does not need to be provided with a heater because the temperature of the fine polishing solution and the temperature of the surface active agent are not required, and the fine polishing solution in the fine polishing mixing barrel 201 flows into the polishing machine 500 through a pipeline for use. After the preparation process of the fine polishing solution is simplified, the preparation structure is simple in design and easy to control, the fine polishing solution is automatically prepared, the preparation proportion of the fine polishing solution completely meets the requirements, the production requirements are met, the production efficiency is improved, the resource waste is saved, and the production cost is further reduced.
S3: configuring the surface active cell 300
Specifically, the method comprises the following steps:
s31: the controller controls a control valve of the pure water pipe III 403 to be in an open state, and the pure water solvent is input into the surface active mixing barrel 301; at this time, the feed pump seven 305 and the outlet control valve of the surfactant dope tank 302 are in the closed state, and the circulation pump three 303, the feed pump six 304 and the outlet control valve in the surfactant mixing tank 301 are in the closed state. The controller controls the standard height of the pure water solvent output by the pure water pipe three 403 in the surface active mixing barrel 301 through the liquid level sensor three 306, stops the water supply of the pure water pipe three 403 in the pure water unit 400 when the pure water solvent reaches a certain range, and closes the corresponding control valve of the pure water pipe three 403.
S32: after the control valve of the deionized water pipe three 403 is closed, the controller controls the supply pump seven 305 and the control valve thereof in the surfactant stock solution tank 302 to open, the surfactant stock solution starts to be input into the surfactant mixing tank 301, the circulating pump three 303 starts to work synchronously, and the circulating pump three 303 keeps working state all the time thereafter, so as to ensure that the surfactant in the surfactant mixing tank 301 is uniformly and stably mixed. After the seventh supply pump 305 finishes supplying the surfactant stock solution in the surfactant stock solution tank 302 according to the configured ratio, the seventh supply pump 305 stops working and the corresponding control valve is turned off. At this time, the second circulation pump 203 in the surfactant mixing tank 301 is circulated for a certain time, and then the surfactant mixing tank can be used. In this embodiment, the ratio of the surfactant stock solution to the pure water and how long the surfactant after mixing needs to be recycled and stirred are omitted, depending on the actual situation.
After finishing the preparation of the surfactant, when the surfactant is used for polishing, the controller opens the supply pump six 304 and the control valve thereof, meanwhile, the control valves at the output ends of the rough polishing unit 100 and the fine polishing unit 200 are both in a closed state, and the surfactant in the surfactant mixing barrel 301 flows into the polishing machine 500 for use through a pipeline. The preparation process of the surfactant is simple and controllable, the automatically prepared surfactant completely meets the production standard requirements, the safety risk caused by manual misoperation is avoided, the production quality can be ensured, the preparation time is shortened, and the production efficiency is improved.
The utility model has the advantages and positive effects that:
1. compared with the prior art, the utility model provides a polishing solution configuration device, through the configuration flow of rational design rough throwing unit, the unit is thrown to the essence and surface activity unit, can whole automatic control polishing solution's configuration proportion, degree of automation is high and safe controllable, can guarantee used rough throwing liquid of burnishing machine, the liquid and the surfactant active are thrown to the essence completely, satisfy the production standard needs.
2. The temperature of the rough polishing liquid in the rough polishing unit has a great influence on the whole polishing process, so a heater is specially arranged to heat the rough polishing liquid output by the rough polishing unit to the polishing machine, and meanwhile, the temperature of the rough polishing liquid is monitored by a temperature sensor, so that the temperature of the rough polishing liquid is ensured to be constant at 22-26 ℃, and the rough polishing liquid can enable the surface of a silicon wafer to have complete crystal lattices, higher flatness and cleanness at the temperature, and the surface quality of the silicon wafer is ensured.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (10)
1. A polishing solution preparing apparatus, comprising:
a rough polishing unit: the device comprises a rough polishing stock solution group and a rough polishing mixing barrel, and is used for mixing and preparing rough polishing solution and conveying the mixed rough polishing solution to a polishing machine for use; the rough polishing stock solution group is communicated with the rough polishing mixing barrel, and the rough polishing mixing barrel is communicated with the polishing machine;
a fine polishing unit: the polishing device comprises a fine polishing stock solution group and a fine polishing mixing barrel, wherein the fine polishing stock solution group and the fine polishing mixing barrel are used for mixing and preparing fine polishing solution and conveying the mixed fine polishing solution to a polishing machine for use; the fine polishing stock solution group is communicated with the fine polishing mixing barrel, and the fine polishing mixing barrel is communicated with the polishing machine;
surface active unit: the device comprises a surface active stock solution group and a surface active mixing barrel, and is used for mixing and preparing a surfactant and conveying the mixed surfactant to a polishing machine for use; the surface active stock solution group is communicated with the surface active mixing barrel, and the surface active mixing barrel is communicated with the polishing machine;
a pure water unit: the surface activity mixing barrel is communicated with the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel and is used for providing pure water solvent for the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel;
the output ends of the rough polishing stock solution group, the fine polishing stock solution group, the surface activity stock solution group, the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel are respectively provided with a supply pump and a control valve;
circulating pumps are arranged in the rough polishing mixing barrel, the fine polishing mixing barrel and the surface activity mixing barrel, and when the pure water solvent is completely prepared and the solute of the stock solution begins to be titrated, the circulating pumps begin to work circularly;
a controller: and the control valve is connected with the supply pump, the control valve and the circulating pump and is used for controlling the working states of the rough polishing unit, the fine polishing unit, the surface activity unit and the pure water unit.
2. The polishing solution preparing apparatus as claimed in claim 1, wherein the rough polishing stock solution set comprises a rough polishing stock solution barrel and a KOH stock solution barrel, and the rough polishing stock solution barrel and the KOH stock solution barrel are respectively communicated with the rough polishing mixing barrel.
3. The polishing solution dispensing apparatus as claimed in claim 2, wherein a heater is provided between the rough polishing mixing barrel and the polishing machine for heating the rough polishing solution discharged from the rough polishing mixing barrel.
4. The apparatus as claimed in claim 3, wherein a temperature sensor is provided at the heater, and the temperature sensor is connected to the controller for detecting the temperature of the heater.
5. The polishing solution dispensing apparatus as recited in claim 4, wherein the heater temperature is 22-26 ℃.
6. The polishing solution dispensing apparatus as claimed in any one of claims 2 to 5, wherein liquid level sensors are provided in the rough polishing mixing barrel, the fine polishing mixing barrel and the surfactant mixing barrel to sense the pure water solvent level in the rough polishing mixing barrel, the fine polishing mixing barrel and the surfactant mixing barrel.
7. The polishing solution preparing apparatus as claimed in claim 6, wherein the fine polishing stock solution group includes a fine polishing stock solution barrel, and the number of the fine polishing stock solution barrels is one, and the fine polishing stock solution barrel is communicated with the fine polishing mixing barrel.
8. The apparatus as claimed in claim 7, wherein the surfactant stock solution tank includes a surfactant stock solution tank, and the surfactant stock solution tank is connected to the surfactant mixing tank.
9. The polishing solution dispensing apparatus according to any one of claims 2 to 5 and 7 to 8, wherein the supply pump is a one-way metering pump.
10. The apparatus as claimed in claim 6, wherein the number of the rough polishing stock solution barrels and the KOH stock solution barrels is one.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921459628.2U CN210815033U (en) | 2019-09-04 | 2019-09-04 | Polishing solution preparation device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921459628.2U CN210815033U (en) | 2019-09-04 | 2019-09-04 | Polishing solution preparation device |
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| CN210815033U true CN210815033U (en) | 2020-06-23 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449081A (en) * | 2019-09-04 | 2019-11-15 | 天津中环领先材料技术有限公司 | A kind of polishing fluid configuration device and its control method |
| CN113001379A (en) * | 2021-03-17 | 2021-06-22 | 天津中环领先材料技术有限公司 | Large-size silicon wafer double-side polishing method |
| CN114851083A (en) * | 2022-04-29 | 2022-08-05 | 无锡恒大电子科技有限公司 | Device for supplying stable SLURRY grinding fluid for CMP process |
-
2019
- 2019-09-04 CN CN201921459628.2U patent/CN210815033U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449081A (en) * | 2019-09-04 | 2019-11-15 | 天津中环领先材料技术有限公司 | A kind of polishing fluid configuration device and its control method |
| CN113001379A (en) * | 2021-03-17 | 2021-06-22 | 天津中环领先材料技术有限公司 | Large-size silicon wafer double-side polishing method |
| CN114851083A (en) * | 2022-04-29 | 2022-08-05 | 无锡恒大电子科技有限公司 | Device for supplying stable SLURRY grinding fluid for CMP process |
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