CN212701412U - Large silicon wafer grinding fluid proportioning and multi-point conveying system device - Google Patents
Large silicon wafer grinding fluid proportioning and multi-point conveying system device Download PDFInfo
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- CN212701412U CN212701412U CN202021070649.8U CN202021070649U CN212701412U CN 212701412 U CN212701412 U CN 212701412U CN 202021070649 U CN202021070649 U CN 202021070649U CN 212701412 U CN212701412 U CN 212701412U
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Abstract
The utility model relates to a silicon chip grinding and polishing technical field, in particular to big silicon chip lapping liquid ratio and multiple spot conveying system device, including at least one allotment supply tank and at least one ration bucket, ration bucket sets up with allotment supply tank one-to-one, and the feed inlet pipe connection of each ration bucket and the allotment supply tank that corresponds, the discharge gate of each allotment supply tank respectively through pipeline one with each allotment supply tank's feed inlet intercommunication, each the tank bottoms of allotment supply tank are connected with the board through pipeline two respectively. Compared with the prior art, the utility model discloses a quantitative bucket determines the addition of material, and the lapping liquid circulation back that will tentatively mix the uniformity is joined in marriage the supply tank and is realized further mixing through pipeline one, carries finished product lapping liquid to use the board through pipeline two, and the circulation flows back to allotment supply tank, realizes the multiple spot supply, and lapping liquid allotment precision, speed, stability are high, it is easy to change the prescription; can output in parallel and in sequence, and can be used as backup for each other.
Description
Technical Field
The utility model relates to a silicon chip grinding and polishing technical field, in particular to big silicon chip lapping liquid ratio and multiple spot conveying system device.
Background
In the semiconductor chip industry, the grinding and polishing technology of large silicon wafers is a very widely used technology, a large number of variables exist in the grinding process, and in order to accurately control grinding and polishing, the chemical and mechanical polishing operations of grinding fluid need to be accurately controlled, particularly the amount of various reagents used in the grinding fluid composition needs to be carefully controlled to achieve the desired result. Thus, it is very important to perform precise control. In the prior art, the used blending method is a weighing method, but the accuracy is poor.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a big silicon chip lapping liquid ratio and multiple spot conveying system device to solve the problem that the unable high-efficient accurate lapping liquid ratio of accomplishing of current lapping liquid ratio board
The utility model adopts the technical scheme as follows:
the utility model provides a big silicon chip lapping liquid ratio and multiple spot conveying system device, the key lies in: the quantitative barrel and the allocation supply tank are arranged in a one-to-one correspondence mode, each quantitative barrel is connected with a corresponding feed inlet of the allocation supply tank through a pipeline I, a discharge port of each allocation supply tank is communicated with the feed inlet of each allocation supply tank through a pipeline I, and a tank bottom of each allocation supply tank is connected with a machine table through a pipeline II.
Preferably, the first pipeline is sequentially connected with a circulating filter and an online concentration monitor. The effect of this scheme is that can carry out prefilter with the lapping liquid of circulation input allotment supply tank to and carry out online concentration monitoring to the lapping liquid, ensure that the ratio is accurate.
Preferably, the second pipeline comprises an output pipeline and an input pipeline, the output pipeline is communicated with the first pipeline, the input pipeline is directly communicated with the bottom of the blending and supplying tank, and the output pipeline is connected with a supplying pump and a supplying filter. The scheme has the effects that the finished grinding fluid can be conveyed to a using machine through the second pipeline and circularly flows back to the blending and supplying tank, so that multi-point supply is realized, the conveying efficiency of the grinding fluid is improved, and the finished grinding fluid is further filtered.
Preferably, a plurality of circulating pumps are arranged on the first pipeline, the circulating pumps are arranged in one-to-one correspondence with the allocation supply tanks, and each circulating pump is communicated with the corresponding allocation supply tank through a return pipe. The effect of this scheme can make the material in the allotment supply tank reach excellent misce bene's effect through circulation flow, avoids the tank bottoms to appear the dead angle and remain-cause and gather.
Preferably, the device further comprises a weighing device, and the blending supply tank is arranged on the weighing device. The effect of this scheme is that can input the material of allotment supply tank and carry out accurate weighing.
Preferably, the grinding fluid cooling device is arranged on the return pipe. The effect of this scheme can be cooled down to the lapping liquid, prevents that the overheated quality that influences the lapping liquid of circulation liquid temperature.
Preferably, the number of the circulating filters is two, and the two circulating filters are connected to the first pipeline in parallel. The effect of this scheme is that can improve the filtration efficiency of the primary mixed lapping liquid.
Preferably, the number of the supply filters is two, and the two supply filters are connected to the second pipeline in parallel. The effect of this scheme is that can improve the filtration efficiency of finished product lapping liquid.
Has the advantages that: compared with the prior art, the utility model provides a big silicon chip lapping liquid ratio and multiple spot conveying system device, confirm the addition of material through the ration bucket, through pipeline one with the lapping liquid circulation back blending supply tank of preliminary mixing homogeneous to realize further mixing, carry finished product lapping liquid to the use board through pipeline two, and the circulation flows back to the blending supply tank, realize the multiple spot supply, guarantee not have dead pipeline, lapping liquid blending precision, speed, stability are high, it is easy to change the prescription (realize through changing the ration bucket); can output in parallel and in sequence, and can be used as backup for each other.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
As shown in FIG. 1, a large silicon wafer grinding fluid proportioning and multi-point conveying system device comprises three proportioning supply tanks 1 and three quantitative tanks 2, wherein the quantitative tanks 2 are arranged corresponding to the proportioning supply tanks 1 one by one, the proportioning supply tanks 1 are arranged on a weighing device 3, each quantitative tank 2 is connected with a corresponding feed inlet of the proportioning supply tank 1 through a pipeline one, a discharge outlet of each proportioning supply tank 1 is respectively communicated with the feed inlet of each proportioning supply tank 1 through a pipeline one, the pipeline one is sequentially connected with two parallel circulating filters 4 and an online concentration monitor 5, the pipeline one is also provided with a plurality of circulating pumps 6, the circulating pumps 6 are arranged corresponding to the proportioning supply tanks 1 one by one, each circulating pump 6 is communicated with the corresponding proportioning supply tank 1 through a return pipe, and the return pipe is provided with a grinding fluid cooler 7, the tank bottom of the blending supply tank 1 is respectively connected with a machine a through a second pipeline, the second pipeline comprises an output pipeline 10 and an input pipeline 11, the output pipeline 10 is communicated with the first pipeline, the input pipeline 11 is directly communicated with the bottom of the blending supply tank 1, and the output pipeline 10 is connected with a supply pump 8 and two supply filters 9 connected in parallel.
Finally, it should be noted that the above description is only a preferred embodiment of the present invention, and that those skilled in the art can make various similar representations without departing from the spirit and scope of the present invention.
Claims (8)
1. The utility model provides a big silicon chip lapping liquid ratio and multiple spot conveying system device which characterized in that: the quantitative barrel (2) and the allocation supply tank (1) are arranged in a one-to-one correspondence mode, each quantitative barrel (2) is connected with a corresponding feed inlet of the allocation supply tank (1) through a pipeline I, a discharge port of each allocation supply tank (1) is communicated with a feed inlet of each allocation supply tank (1) through a pipeline I, and a tank bottom of each allocation supply tank (1) is connected with a machine table through a pipeline II.
2. The proportioning and multi-point conveying system device for silicon wafer grinding fluid as claimed in claim 1, wherein: and the first pipeline is sequentially connected with a circulating filter (4) and an online concentration monitor (5).
3. The proportioning and multi-point conveying system device for silicon wafer grinding fluid as claimed in claim 1, wherein: the second pipeline comprises an output pipeline (10) and an input pipeline (11), the output pipeline (10) is communicated with the first pipeline, the input pipeline (11) is directly communicated with the bottom of the blending supply tank (1), and the output pipeline (10) is connected with a supply pump (8) and a supply filter (9).
4. The proportioning and multi-point conveying system device for silicon wafer grinding fluid as claimed in claim 1, wherein: the first pipeline is provided with a plurality of circulating pumps (6), the circulating pumps (6) are arranged in one-to-one correspondence with the allocation supply tanks (1), and the circulating pumps (6) are communicated with the corresponding allocation supply tanks (1) through return pipes.
5. The proportioning and multi-point conveying system device for silicon wafer grinding fluid as claimed in claim 1, wherein: the device also comprises a weighing device (3), and the blending supply tank (1) is arranged on the weighing device (3).
6. The proportioning and multi-point conveying system device for large silicon wafer grinding fluid according to claim 4, wherein: the grinding fluid cooling device (7) is further included, and the grinding fluid cooling device (7) is arranged on the return pipe.
7. The proportioning and multi-point conveying system device for silicon wafer grinding fluid as claimed in claim 2, wherein: the number of the circulating filters (4) is two, and the two circulating filters (4) are connected to the first pipeline in parallel.
8. The proportioning and multi-point conveying system device for large silicon wafer grinding fluid according to claim 3, wherein: the number of the supply filters (9) is two, and the two supply filters (9) are connected to the second pipeline in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021070649.8U CN212701412U (en) | 2020-06-11 | 2020-06-11 | Large silicon wafer grinding fluid proportioning and multi-point conveying system device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021070649.8U CN212701412U (en) | 2020-06-11 | 2020-06-11 | Large silicon wafer grinding fluid proportioning and multi-point conveying system device |
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| CN212701412U true CN212701412U (en) | 2021-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021070649.8U Active CN212701412U (en) | 2020-06-11 | 2020-06-11 | Large silicon wafer grinding fluid proportioning and multi-point conveying system device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115138234A (en) * | 2022-06-27 | 2022-10-04 | 上海华力集成电路制造有限公司 | Grinding fluid mixing device and method for aluminum chemical mechanical grinding process |
| CN115282692A (en) * | 2022-07-19 | 2022-11-04 | 江阴萃科智能制造技术有限公司 | Grinding fluid filtering and circulating method of grinding and polishing equipment |
-
2020
- 2020-06-11 CN CN202021070649.8U patent/CN212701412U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115138234A (en) * | 2022-06-27 | 2022-10-04 | 上海华力集成电路制造有限公司 | Grinding fluid mixing device and method for aluminum chemical mechanical grinding process |
| CN115282692A (en) * | 2022-07-19 | 2022-11-04 | 江阴萃科智能制造技术有限公司 | Grinding fluid filtering and circulating method of grinding and polishing equipment |
| CN115282692B (en) * | 2022-07-19 | 2024-03-08 | 江阴萃科智能制造技术有限公司 | Grinding liquid filtering circulation method of grinding and polishing equipment |
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Address after: 518000 1801, block B, wisdom home, 76 Baohe Avenue, Baolong street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Jiangsu Rongke Equipment Technology Co.,Ltd. Address before: 518000 1801, block B, wisdom home, 76 Baohe Avenue, Baolong street, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN RONGKE TECHNOLOGY Co.,Ltd. |
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Address after: Floor 4, Building 5, Tianyun Square, No. 111, Wusongjiang Avenue, Guoxiang Street, Wuzhong District, Suzhou City, Jiangsu Province, 215000 Patentee after: Jiangsu Rongke Equipment Technology Co.,Ltd. Address before: 518000 1801, block B, wisdom home, 76 Baohe Avenue, Baolong street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Jiangsu Rongke Equipment Technology Co.,Ltd. |
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