SG10201913242YA - Method and system for edge-of-wafer inspection and review - Google Patents

Method and system for edge-of-wafer inspection and review

Info

Publication number
SG10201913242YA
SG10201913242YA SG10201913242YA SG10201913242YA SG10201913242YA SG 10201913242Y A SG10201913242Y A SG 10201913242YA SG 10201913242Y A SG10201913242Y A SG 10201913242YA SG 10201913242Y A SG10201913242Y A SG 10201913242YA SG 10201913242Y A SG10201913242Y A SG 10201913242YA
Authority
SG
Singapore
Prior art keywords
review
edge
wafer inspection
wafer
inspection
Prior art date
Application number
SG10201913242YA
Other languages
English (en)
Inventor
Xinrong Jiang
Christopher Sears
Harsh Sinha
David Trease
Wei Ye
David Kaz
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG10201913242YA publication Critical patent/SG10201913242YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/153—Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2255—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident ion beams, e.g. proton beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/153—Correcting image defects, e.g. stigmators
    • H01J2237/1532—Astigmatism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/153—Correcting image defects, e.g. stigmators
    • H01J2237/1534—Aberrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/153—Correcting image defects, e.g. stigmators
    • H01J2237/1536—Image distortions due to scanning

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG10201913242YA 2015-08-10 2016-08-10 Method and system for edge-of-wafer inspection and review SG10201913242YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562203276P 2015-08-10 2015-08-10
US15/231,728 US10056224B2 (en) 2015-08-10 2016-08-08 Method and system for edge-of-wafer inspection and review

Publications (1)

Publication Number Publication Date
SG10201913242YA true SG10201913242YA (en) 2020-03-30

Family

ID=57984607

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201913242YA SG10201913242YA (en) 2015-08-10 2016-08-10 Method and system for edge-of-wafer inspection and review

Country Status (8)

Country Link
US (2) US10056224B2 (enExample)
JP (1) JP6854278B2 (enExample)
KR (1) KR102315789B1 (enExample)
CN (2) CN111785602B (enExample)
IL (2) IL256858B (enExample)
SG (1) SG10201913242YA (enExample)
TW (2) TWI735458B (enExample)
WO (1) WO2017027558A1 (enExample)

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JP7344047B2 (ja) * 2019-08-22 2023-09-13 株式会社ジェーイーエル 基板の位置合わせ方法
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TWI872403B (zh) * 2022-12-05 2025-02-11 易發精機股份有限公司 用於晶圓的自動光學檢測系統及其影像處理方法
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Also Published As

Publication number Publication date
CN108419448B (zh) 2020-08-04
TWI754599B (zh) 2022-02-01
US10056224B2 (en) 2018-08-21
US10770258B2 (en) 2020-09-08
JP6854278B2 (ja) 2021-04-07
TW201715225A (zh) 2017-05-01
JP2018526778A (ja) 2018-09-13
TWI735458B (zh) 2021-08-11
WO2017027558A1 (en) 2017-02-16
IL285052B (en) 2022-03-01
CN111785602A (zh) 2020-10-16
CN108419448A (zh) 2018-08-17
KR20180030236A (ko) 2018-03-21
US20170047193A1 (en) 2017-02-16
KR102315789B1 (ko) 2021-10-20
US20190006143A1 (en) 2019-01-03
IL285052A (en) 2021-08-31
CN111785602B (zh) 2021-09-03
IL256858A (en) 2018-03-29
TW202138799A (zh) 2021-10-16
IL256858B (en) 2021-09-30

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