JP6740448B2 - 荷電粒子線装置 - Google Patents
荷電粒子線装置 Download PDFInfo
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- JP6740448B2 JP6740448B2 JP2019500947A JP2019500947A JP6740448B2 JP 6740448 B2 JP6740448 B2 JP 6740448B2 JP 2019500947 A JP2019500947 A JP 2019500947A JP 2019500947 A JP2019500947 A JP 2019500947A JP 6740448 B2 JP6740448 B2 JP 6740448B2
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- electrostatic chuck
- charged particle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/30—Accessories, mechanical or electrical features
- G01N2223/307—Accessories, mechanical or electrical features cuvettes-sample holders
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/30—Accessories, mechanical or electrical features
- G01N2223/351—Accessories, mechanical or electrical features prohibiting charge accumulation on sample substrate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/418—Imaging electron microscope
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
- G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2007—Holding mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
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- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
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- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
きる。
そこで、本実施例では、ウエハとチャック機構の温度差に起因する試料変形を抑制し得る静電チャック機構を備えた荷電粒子線装置について説明する。試料変形が抑制できれば、スループットの低減を抑制することができる。
101…真空チャンバー
104…試料ストッカー
105…観察対象の移動経路
200…ステージ
201…保持機構
202…観察対象
203…静電チャック
204…補正電極
205…ウエハ
300…電子光学系
301…電子銃
302…引き出し電極
303…コンデンサレンズ
305…走査偏向器
306…絞り
308…EクロスB偏向器
309…対物レンズ
314…二次電子検出器
316…シールド電極
318…光軸
322…一次電子線
324…加速された二次電子線
326…リターディング電源
327…分析部
329…制御部
332…二次電子線
348…電圧可変式の直流電源
349…外側の空間
350…等電位面
400…アルミ製補正電極
401…ネジ
402…チャック支持部
403…恒温装置
405…補正電極支持部
406…絶縁体
407…囲まれた空間
408…柱状の補正電極支持部
409…セラミック製の平面度補正材
500…アルミと金属シリコンの混合剤製補正電極
501…表面がNiの無電解メッキで覆われているアルミと金属シリコンの混合剤製補正電極
1000…光学系との距離
Claims (4)
- 静電チャック機構を備えた荷電粒子線装置において、
荷電粒子ビームが照射される試料を当該荷電粒子ビームの照射位置に対して相対的に移動させるステージと、
当該ステージ上に配置され、前記静電チャックの誘電層を構成する絶縁体と、
当該絶縁体を前記ステージ上で支持する第1の支持部材と、前記試料周囲を包囲すると共に前記絶縁体に非接触に設置され、所定の電圧が印加されるリング状電極と、
当該リング状電極を支持する第2の支持部材とを備え、
前記リング状電極と前記第2の支持部材との間に、平坦面を有するリング状の板状体が設置されていることを特徴とする荷電粒子線装置。 - 請求項1において、
前記リング状電極に電圧を印加する電源を制御する制御装置を備え、当該制御装置は、記憶媒体に記憶された情報に基づいて、前記荷電粒子ビームの照射位置に応じた電圧を印加することを特徴とする荷電粒子線装置。 - 請求項1において、
前記第1の支持部材と第2の支持部材は、前記ステージ上に設置された柱状部材であることを特徴とする荷電粒子線装置。 - 請求項1において、
前記リング状の板状体はセラミックを含む材料で成形されていることを特徴とする荷電粒子線装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2020125667A JP6979107B2 (ja) | 2017-02-24 | 2020-07-22 | 荷電粒子線装置 |
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PCT/JP2017/007084 WO2018154705A1 (ja) | 2017-02-24 | 2017-02-24 | 荷電粒子線装置 |
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JP2020125667A Division JP6979107B2 (ja) | 2017-02-24 | 2020-07-22 | 荷電粒子線装置 |
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JPWO2018154705A1 JPWO2018154705A1 (ja) | 2019-11-07 |
JP6740448B2 true JP6740448B2 (ja) | 2020-08-12 |
Family
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JP2019500947A Active JP6740448B2 (ja) | 2017-02-24 | 2017-02-24 | 荷電粒子線装置 |
Country Status (3)
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US (2) | US11335533B2 (ja) |
JP (1) | JP6740448B2 (ja) |
WO (1) | WO2018154705A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020207805A1 (en) | 2019-04-10 | 2020-10-15 | Asml Netherlands B.V. | Stage apparatus suitable for a particle beam apparatus |
US11902665B2 (en) | 2019-08-16 | 2024-02-13 | Protochips, Inc. | Automated application of drift correction to sample studied under electron microscope |
WO2023147406A2 (en) * | 2022-01-26 | 2023-08-03 | Protochips, Inc. | Automated application of drift correction to sample studied under electron microscope |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09275079A (ja) | 1996-04-02 | 1997-10-21 | Hitachi Ltd | 半導体製造装置 |
US6252705B1 (en) | 1999-05-25 | 2001-06-26 | Schlumberger Technologies, Inc. | Stage for charged particle microscopy system |
JP4544706B2 (ja) | 2000-06-29 | 2010-09-15 | 京セラ株式会社 | 基板ホルダー |
JP4320379B2 (ja) * | 2003-12-22 | 2009-08-26 | ハリソン東芝ライティング株式会社 | メタルハライドランプおよびメタルハライドランプ点灯装置 |
JP5380443B2 (ja) * | 2008-06-25 | 2014-01-08 | 株式会社日立ハイテクノロジーズ | 半導体検査装置 |
JP2010147095A (ja) * | 2008-12-16 | 2010-07-01 | Shinko Electric Ind Co Ltd | 基板固定装置 |
JP3155802U (ja) * | 2009-09-17 | 2009-12-03 | 日本碍子株式会社 | ウエハー載置装置 |
KR101842101B1 (ko) * | 2010-08-03 | 2018-03-26 | 가부시키가이샤 에바라 세이사꾸쇼 | 이물질 부착 방지 기능을 구비한 전자선 검사 장치 및 방법 |
US9029808B2 (en) * | 2011-03-04 | 2015-05-12 | Tel Epion Inc. | Low contamination scanner for GCIB system |
JP5914020B2 (ja) * | 2012-02-09 | 2016-05-11 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
US8819859B1 (en) * | 2013-02-01 | 2014-08-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus of analyzing a sample and a method for the same |
JP2015176683A (ja) | 2014-03-14 | 2015-10-05 | 株式会社日立ハイテクノロジーズ | 静電チャック機構、及び荷電粒子線装置 |
US10056224B2 (en) | 2015-08-10 | 2018-08-21 | Kla-Tencor Corporation | Method and system for edge-of-wafer inspection and review |
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2017
- 2017-02-24 JP JP2019500947A patent/JP6740448B2/ja active Active
- 2017-02-24 US US16/474,846 patent/US11335533B2/en active Active
- 2017-02-24 WO PCT/JP2017/007084 patent/WO2018154705A1/ja active Application Filing
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2022
- 2022-04-20 US US17/725,151 patent/US11929231B2/en active Active
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Publication number | Publication date |
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US20220246387A1 (en) | 2022-08-04 |
US11335533B2 (en) | 2022-05-17 |
WO2018154705A1 (ja) | 2018-08-30 |
JPWO2018154705A1 (ja) | 2019-11-07 |
US11929231B2 (en) | 2024-03-12 |
US20210134555A1 (en) | 2021-05-06 |
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