SG10201900168RA - Gas Sensor Package And Sensing Apparatus Including The Same - Google Patents
Gas Sensor Package And Sensing Apparatus Including The SameInfo
- Publication number
- SG10201900168RA SG10201900168RA SG10201900168RA SG10201900168RA SG10201900168RA SG 10201900168R A SG10201900168R A SG 10201900168RA SG 10201900168R A SG10201900168R A SG 10201900168RA SG 10201900168R A SG10201900168R A SG 10201900168RA SG 10201900168R A SG10201900168R A SG 10201900168RA
- Authority
- SG
- Singapore
- Prior art keywords
- fixing plate
- package substrate
- gas sensor
- hole
- same
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 7
- 230000001681 protective effect Effects 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/125—Composition of the body, e.g. the composition of its sensitive layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/048—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance for determining moisture content of the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/122—Circuits particularly adapted therefor, e.g. linearising circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/122—Circuits particularly adapted therefor, e.g. linearising circuits
- G01N27/123—Circuits particularly adapted therefor, e.g. linearising circuits for controlling the temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/128—Microapparatus
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/129—Diode type sensors, e.g. gas sensitive Schottky diodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Combustion & Propulsion (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Molecular Biology (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180003171A KR102520038B1 (ko) | 2018-01-10 | 2018-01-10 | 가스 센서 패키지 및 이를 포함하는 센싱 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201900168RA true SG10201900168RA (en) | 2019-08-27 |
Family
ID=64564571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201900168RA SG10201900168RA (en) | 2018-01-10 | 2019-01-08 | Gas Sensor Package And Sensing Apparatus Including The Same |
Country Status (6)
Country | Link |
---|---|
US (1) | US11067554B2 (ko) |
EP (1) | EP3511703B1 (ko) |
JP (1) | JP7210271B2 (ko) |
KR (1) | KR102520038B1 (ko) |
CN (1) | CN110018202A (ko) |
SG (1) | SG10201900168RA (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102437764B1 (ko) * | 2017-12-20 | 2022-08-30 | 삼성전자주식회사 | 센서 패키지, 센서 패키지의 제조 방법, 및 리드 구조체의 제조 방법 |
KR102466332B1 (ko) * | 2018-01-02 | 2022-11-15 | 삼성전자주식회사 | 가스 센서 패키지 |
JP7471947B2 (ja) | 2020-08-01 | 2024-04-22 | Tdk株式会社 | センサーモジュール |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59134055U (ja) * | 1983-02-24 | 1984-09-07 | 三菱電機株式会社 | 湿度センサ− |
JPH0532764Y2 (ko) * | 1987-06-17 | 1993-08-20 | ||
JPH087095B2 (ja) | 1987-06-30 | 1996-01-29 | 株式会社東芝 | 検出器 |
JPH01250747A (ja) * | 1988-03-31 | 1989-10-05 | Japan Gore Tex Inc | 水溶液中溶質濃度測定センサ |
JP3888228B2 (ja) | 2002-05-17 | 2007-02-28 | 株式会社デンソー | センサ装置 |
JP4131694B2 (ja) | 2003-10-06 | 2008-08-13 | 三洋電機株式会社 | 積層セラミックス基板及びその製造方法 |
KR100652571B1 (ko) | 2004-11-11 | 2006-12-07 | 엘지전자 주식회사 | 가스센서용 초소형 패키지 |
JP4732804B2 (ja) | 2005-05-31 | 2011-07-27 | 日本特殊陶業株式会社 | ガスセンサ及びその製造方法 |
US8333874B2 (en) * | 2005-12-09 | 2012-12-18 | Flexible Medical Systems, Llc | Flexible apparatus and method for monitoring and delivery |
JP4955349B2 (ja) | 2006-09-07 | 2012-06-20 | 新光電気工業株式会社 | 半導体装置 |
KR100782405B1 (ko) | 2006-10-27 | 2007-12-07 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
JP2008241501A (ja) * | 2007-03-28 | 2008-10-09 | Ngk Spark Plug Co Ltd | ガスセンサ |
JP4382863B2 (ja) | 2007-09-28 | 2009-12-16 | 太陽誘電株式会社 | ガスセンサ及びガス検出方法 |
KR20090124011A (ko) | 2008-05-29 | 2009-12-03 | (주)엠투엔 | 패키징 기판과 이를 포함하는 가스 센싱 장치 및 그 제조방법 |
US8115286B2 (en) * | 2008-10-22 | 2012-02-14 | Honeywell International Inc. | Integrated sensor including sensing and processing die mounted on opposite sides of package substrate |
DE102008053909A1 (de) | 2008-10-30 | 2010-05-27 | Novar Gmbh | Gasdetektor |
KR101078187B1 (ko) | 2009-02-26 | 2011-11-10 | 전자부품연구원 | 마이크로 가스 센서 및 그 제조 방법 |
US20110124113A1 (en) * | 2009-11-25 | 2011-05-26 | Abdul-Majeed Azad | Methods and devices for detecting unsaturated compounds |
DE102010018499A1 (de) | 2010-04-22 | 2011-10-27 | Schweizer Electronic Ag | Leiterplatte mit Hohlraum |
US9784708B2 (en) * | 2010-11-24 | 2017-10-10 | Spec Sensors, Llc | Printed gas sensor |
WO2016043848A2 (en) | 2014-07-24 | 2016-03-24 | Spec Sensors, Llc | Electrochemical sensors and packaging and related methods |
EP2857349B1 (en) | 2013-10-01 | 2020-08-05 | LG Innotek Co., Ltd. | Gas sensor package |
KR20150089749A (ko) | 2014-01-28 | 2015-08-05 | 엘지이노텍 주식회사 | 레이더 장치 |
KR102158068B1 (ko) | 2014-02-05 | 2020-09-21 | 엘지이노텍 주식회사 | 임베디드 인쇄회로기판 |
KR102212967B1 (ko) | 2014-02-06 | 2021-02-08 | 엘지이노텍 주식회사 | 임베디드 인쇄회로기판 |
JP6347618B2 (ja) | 2014-02-07 | 2018-06-27 | 日本特殊陶業株式会社 | ガス検出器 |
TWI546913B (zh) | 2014-04-02 | 2016-08-21 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
KR20150116209A (ko) | 2014-04-07 | 2015-10-15 | 주식회사 이노칩테크놀로지 | 센서 소자 |
US9664661B2 (en) | 2014-05-08 | 2017-05-30 | Active-Semi, Inc. | Olfactory application controller integrated circuit |
JP6312205B2 (ja) | 2014-05-19 | 2018-04-18 | 日立オートモティブシステムズ株式会社 | ガスセンサ |
EP3001186B1 (en) | 2014-09-26 | 2018-06-06 | Sensirion AG | Sensor chip |
JP2016070670A (ja) | 2014-09-26 | 2016-05-09 | 京セラ株式会社 | センサ装置 |
US9598280B2 (en) | 2014-11-10 | 2017-03-21 | Nxp Usa, Inc. | Environmental sensor structure |
KR20160088111A (ko) | 2015-01-15 | 2016-07-25 | 삼성전기주식회사 | 복합 센서와 이를 구비하는 패키지 및 그 제조 방법 |
KR20160122439A (ko) | 2015-04-14 | 2016-10-24 | 엘지이노텍 주식회사 | 임베디드 인쇄회로기판 |
KR101709468B1 (ko) | 2015-06-19 | 2017-03-09 | 주식회사 심텍 | Pop 구조용 인쇄회로기판, 그 제조 방법 및 이를 이용하는 소자 패키지 |
JP6622593B2 (ja) | 2016-01-06 | 2019-12-18 | 日本特殊陶業株式会社 | センサの検査方法及びセンサの製造方法 |
KR102522099B1 (ko) | 2016-01-14 | 2023-04-17 | 엘지이노텍 주식회사 | 센서 및 이의 제조 방법 |
JP2017151064A (ja) | 2016-02-26 | 2017-08-31 | セイコーエプソン株式会社 | 電子デバイス、高度計、電子機器および移動体 |
CN106298704B (zh) | 2016-10-11 | 2018-05-29 | 中国科学院地质与地球物理研究所 | 一种带热沉和磁屏蔽的mems封装及其制备方法 |
-
2018
- 2018-01-10 KR KR1020180003171A patent/KR102520038B1/ko active IP Right Grant
- 2018-09-07 US US16/124,385 patent/US11067554B2/en active Active
- 2018-11-29 EP EP18209061.3A patent/EP3511703B1/en active Active
- 2018-12-21 CN CN201811570923.5A patent/CN110018202A/zh active Pending
- 2018-12-27 JP JP2018244486A patent/JP7210271B2/ja active Active
-
2019
- 2019-01-08 SG SG10201900168RA patent/SG10201900168RA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2019120698A (ja) | 2019-07-22 |
EP3511703B1 (en) | 2024-07-03 |
EP3511703A3 (en) | 2019-08-28 |
US11067554B2 (en) | 2021-07-20 |
CN110018202A (zh) | 2019-07-16 |
EP3511703A2 (en) | 2019-07-17 |
KR20190085263A (ko) | 2019-07-18 |
JP7210271B2 (ja) | 2023-01-23 |
US20190212312A1 (en) | 2019-07-11 |
KR102520038B1 (ko) | 2023-04-12 |
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