SG10201605834YA - Method for manufacturing passive optical components, and devices comprising the same - Google Patents

Method for manufacturing passive optical components, and devices comprising the same

Info

Publication number
SG10201605834YA
SG10201605834YA SG10201605834YA SG10201605834YA SG10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA
Authority
SG
Singapore
Prior art keywords
devices
same
optical components
passive optical
manufacturing passive
Prior art date
Application number
SG10201605834YA
Other languages
English (en)
Inventor
Hartmut Rudmann
Susanne Westenhoefer
Bojan Tesanovic
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG10201605834YA publication Critical patent/SG10201605834YA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00932—Combined cutting and grinding thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
  • Optical Integrated Circuits (AREA)
SG10201605834YA 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same SG10201605834YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161509357P 2011-07-19 2011-07-19

Publications (1)

Publication Number Publication Date
SG10201605834YA true SG10201605834YA (en) 2016-09-29

Family

ID=46639253

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201605834YA SG10201605834YA (en) 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same

Country Status (8)

Country Link
US (4) US8767303B2 (https=)
EP (1) EP2735029B1 (https=)
JP (2) JP2014521992A (https=)
KR (1) KR101966478B1 (https=)
CN (1) CN103975436B (https=)
SG (1) SG10201605834YA (https=)
TW (3) TWI647824B (https=)
WO (1) WO2013010285A1 (https=)

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US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US10475837B2 (en) * 2015-06-23 2019-11-12 Sony Corporation Image sensor and electronic device
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JP6740628B2 (ja) * 2016-02-12 2020-08-19 凸版印刷株式会社 固体撮像素子及びその製造方法
WO2017155460A1 (en) * 2016-03-08 2017-09-14 Tnc Optics & Technologies Pte. Ltd. A fabrication method of optical sensor cover having a lens
CN113474154A (zh) * 2019-02-25 2021-10-01 ams传感器新加坡私人有限公司 光学漫射器元件的制造和光学漫射器元件
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Also Published As

Publication number Publication date
KR101966478B1 (ko) 2019-04-05
CN103975436B (zh) 2019-05-10
CN103975436A (zh) 2014-08-06
JP2017167533A (ja) 2017-09-21
US9193120B2 (en) 2015-11-24
US20160031169A1 (en) 2016-02-04
US20130033767A1 (en) 2013-02-07
TWI635601B (zh) 2018-09-11
TWI647825B (zh) 2019-01-11
TW201310626A (zh) 2013-03-01
JP6763807B2 (ja) 2020-09-30
TW201742238A (zh) 2017-12-01
US20140347747A1 (en) 2014-11-27
US8767303B2 (en) 2014-07-01
JP2014521992A (ja) 2014-08-28
EP2735029A1 (en) 2014-05-28
US20170235026A1 (en) 2017-08-17
TWI647824B (zh) 2019-01-11
WO2013010285A1 (en) 2013-01-24
EP2735029B1 (en) 2022-12-21
TW201820597A (zh) 2018-06-01
KR20140054081A (ko) 2014-05-08
US9610743B2 (en) 2017-04-04
US10527762B2 (en) 2020-01-07

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