KR101966478B1 - 수동 광학 부품을 제조하기 위한 방법 및 그것을 포함하는 장치 - Google Patents

수동 광학 부품을 제조하기 위한 방법 및 그것을 포함하는 장치 Download PDF

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KR101966478B1
KR101966478B1 KR1020147004151A KR20147004151A KR101966478B1 KR 101966478 B1 KR101966478 B1 KR 101966478B1 KR 1020147004151 A KR1020147004151 A KR 1020147004151A KR 20147004151 A KR20147004151 A KR 20147004151A KR 101966478 B1 KR101966478 B1 KR 101966478B1
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South Korea
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optical
transparent
wafer
blocking portion
transparent element
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Korean (ko)
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KR20140054081A (ko
Inventor
하르트무트 루드만
수잔 베슈텐회퍼
보얀 테자노픽
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헵타곤 마이크로 옵틱스 피티이. 리미티드
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00932—Combined cutting and grinding thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Light Receiving Elements (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Integrated Circuits (AREA)
  • Led Device Packages (AREA)
KR1020147004151A 2011-07-19 2012-07-10 수동 광학 부품을 제조하기 위한 방법 및 그것을 포함하는 장치 Active KR101966478B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161509357P 2011-07-19 2011-07-19
US61/509,357 2011-07-19
PCT/CH2012/000160 WO2013010285A1 (en) 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same

Publications (2)

Publication Number Publication Date
KR20140054081A KR20140054081A (ko) 2014-05-08
KR101966478B1 true KR101966478B1 (ko) 2019-04-05

Family

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KR1020147004151A Active KR101966478B1 (ko) 2011-07-19 2012-07-10 수동 광학 부품을 제조하기 위한 방법 및 그것을 포함하는 장치

Country Status (8)

Country Link
US (4) US8767303B2 (https=)
EP (1) EP2735029B1 (https=)
JP (2) JP2014521992A (https=)
KR (1) KR101966478B1 (https=)
CN (1) CN103975436B (https=)
SG (1) SG10201605834YA (https=)
TW (3) TWI647825B (https=)
WO (1) WO2013010285A1 (https=)

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WO2015016772A1 (en) 2013-07-31 2015-02-05 Heptagon Micro Optics Pte. Ltd. Micro-optical orientation sensor and related methods
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US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
WO2016208403A1 (ja) * 2015-06-23 2016-12-29 ソニー株式会社 イメージセンサ、および電子機器
JP2017022200A (ja) * 2015-07-08 2017-01-26 ソニーセミコンダクタソリューションズ株式会社 イメージセンサ、および電子機器
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Also Published As

Publication number Publication date
US20140347747A1 (en) 2014-11-27
WO2013010285A1 (en) 2013-01-24
JP2014521992A (ja) 2014-08-28
TW201310626A (zh) 2013-03-01
JP6763807B2 (ja) 2020-09-30
TWI647825B (zh) 2019-01-11
CN103975436B (zh) 2019-05-10
EP2735029B1 (en) 2022-12-21
US8767303B2 (en) 2014-07-01
JP2017167533A (ja) 2017-09-21
TWI635601B (zh) 2018-09-11
SG10201605834YA (en) 2016-09-29
US9610743B2 (en) 2017-04-04
US10527762B2 (en) 2020-01-07
US20170235026A1 (en) 2017-08-17
EP2735029A1 (en) 2014-05-28
TW201820597A (zh) 2018-06-01
CN103975436A (zh) 2014-08-06
TW201742238A (zh) 2017-12-01
US20130033767A1 (en) 2013-02-07
KR20140054081A (ko) 2014-05-08
US20160031169A1 (en) 2016-02-04
US9193120B2 (en) 2015-11-24
TWI647824B (zh) 2019-01-11

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