CN103975436B - 制造无源光学器件和包含该无源光学器件的装置的方法 - Google Patents

制造无源光学器件和包含该无源光学器件的装置的方法 Download PDF

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Publication number
CN103975436B
CN103975436B CN201280045590.9A CN201280045590A CN103975436B CN 103975436 B CN103975436 B CN 103975436B CN 201280045590 A CN201280045590 A CN 201280045590A CN 103975436 B CN103975436 B CN 103975436B
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China
Prior art keywords
optical
transparent
light
chip
blocking part
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English (en)
Chinese (zh)
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CN103975436A (zh
Inventor
H·拉德曼
S·韦斯特霍弗
B·德莎诺维克
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Ams Sensors Singapore Pte Ltd
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Heptagon Micro Optics Pte Ltd
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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0012Arrays characterised by the manufacturing method
    • G02B3/0031Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00009Production of simple or compound lenses
    • B29D11/00278Lenticular sheets
    • B29D11/00307Producing lens wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00009Production of simple or compound lenses
    • B29D11/00365Production of microlenses
    • B29D11/00375Production of microlenses by moulding lenses in holes through a substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/0074Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00932Combined cutting and grinding thereof
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/001Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00Optical elements, e.g. lenses, prisms
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/804Containers or encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Light Receiving Elements (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Integrated Circuits (AREA)
  • Led Device Packages (AREA)
CN201280045590.9A 2011-07-19 2012-07-10 制造无源光学器件和包含该无源光学器件的装置的方法 Active CN103975436B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161509357P 2011-07-19 2011-07-19
US61/509357 2011-07-19
PCT/CH2012/000160 WO2013010285A1 (en) 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same

Publications (2)

Publication Number Publication Date
CN103975436A CN103975436A (zh) 2014-08-06
CN103975436B true CN103975436B (zh) 2019-05-10

Family

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CN201280045590.9A Active CN103975436B (zh) 2011-07-19 2012-07-10 制造无源光学器件和包含该无源光学器件的装置的方法

Country Status (8)

Country Link
US (4) US8767303B2 (https=)
EP (1) EP2735029B1 (https=)
JP (2) JP2014521992A (https=)
KR (1) KR101966478B1 (https=)
CN (1) CN103975436B (https=)
SG (1) SG10201605834YA (https=)
TW (3) TWI647825B (https=)
WO (1) WO2013010285A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG193151A1 (en) * 2011-07-19 2013-09-30 Heptagon Micro Optics Pte Ltd Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same
WO2013020238A1 (en) * 2011-08-10 2013-02-14 Heptagon Micro Optics Pte. Ltd. Opto-electronic module and method for manufacturing the same
CN107425030B (zh) 2012-08-20 2020-11-06 赫普塔冈微光有限公司 光学晶片的制造
EP2827368B1 (en) * 2013-07-19 2019-06-05 ams AG Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor
WO2015016772A1 (en) 2013-07-31 2015-02-05 Heptagon Micro Optics Pte. Ltd. Micro-optical orientation sensor and related methods
NL2011843C2 (en) 2013-11-26 2015-05-27 Anteryon Wafer Optics B V A method for manufacturing an optical assembly.
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
WO2016208403A1 (ja) * 2015-06-23 2016-12-29 ソニー株式会社 イメージセンサ、および電子機器
JP2017022200A (ja) * 2015-07-08 2017-01-26 ソニーセミコンダクタソリューションズ株式会社 イメージセンサ、および電子機器
JP2018537845A (ja) * 2015-10-07 2018-12-20 シナプティクス インコーポレイテッド 指紋感知用イメージセンサ構造
KR101738883B1 (ko) * 2016-01-06 2017-05-23 한국과학기술원 초박형 디지털 카메라 및 그 제조 방법
JP6740628B2 (ja) * 2016-02-12 2020-08-19 凸版印刷株式会社 固体撮像素子及びその製造方法
SG11201602031TA (en) * 2016-03-08 2017-10-30 Tnc Optics & Tech Pte Ltd A fabrication method of optical sensor cover having a lens
DE112020000917T5 (de) 2019-02-25 2021-11-04 Ams Sensors Singapore Pte. Ltd. Herstellung von optischen diffusoren und optische diffusoren
US10734184B1 (en) 2019-06-21 2020-08-04 Elbit Systems Of America, Llc Wafer scale image intensifier

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4952026A (en) * 1988-10-14 1990-08-28 Corning Incorporated Integral optical element and method
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532038A (en) * 1967-06-05 1970-10-06 Ibm Multi-lens devices for the fabrication of semiconductor devices
JPS5590909A (en) * 1978-12-28 1980-07-10 Canon Inc Production of compound eye lens device
BR9510290A (pt) * 1994-12-23 1997-11-11 Digirad Câmera de raios gama semicondutores e sistema médico de formação de imagens
JP2003004909A (ja) * 2001-04-20 2003-01-08 Matsushita Electric Ind Co Ltd マイクロレンズアレイの製造方法及びマイクロレンズアレイ
US6814901B2 (en) * 2001-04-20 2004-11-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing microlens array and microlens array
TW200506418A (en) * 2003-07-01 2005-02-16 Nippon Sheet Glass Co Ltd Lens plate, its manufacturing method, and image transmitting apparatus
JP2005072662A (ja) * 2003-08-25 2005-03-17 Sharp Corp 透光板および透光板の製造方法、並びに透光板を用いた画像入力装置
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
US7399421B2 (en) * 2005-08-02 2008-07-15 International Business Machines Corporation Injection molded microoptics
JP2007148297A (ja) 2005-11-30 2007-06-14 Hitachi Maxell Ltd バックライト用光学シート、バックライト及び表示装置
KR100802199B1 (ko) * 2006-05-25 2008-03-17 정경희 광모듈 및 그 제조방법
EP1870936A1 (fr) * 2006-06-19 2007-12-26 STMicroelectronics (Rousset) SAS Procédé de fabrication de lentilles, notamment pour imageur intégré
US8013289B2 (en) * 2006-11-15 2011-09-06 Ether Precision, Inc. Lens array block for image capturing unit and methods of fabrication
EP2220684A1 (en) * 2007-11-27 2010-08-25 Heptagon Oy Encapsulated lens stack
TWI478808B (zh) * 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
TWI505703B (zh) * 2007-12-19 2015-10-21 新加坡恒立私人有限公司 光學模組,晶圓等級的封裝及其製造方法
US7920328B2 (en) * 2008-02-28 2011-04-05 Visera Technologies Company Limited Lens module and a method for fabricating the same
JP5030828B2 (ja) * 2008-03-18 2012-09-19 株式会社沖データ レンズアレイ並びにそれを有するledヘッド、露光装置、画像形成装置及び読取装置
JP4420141B2 (ja) * 2008-04-28 2010-02-24 コニカミノルタオプト株式会社 ウエハレンズの製造方法及びウエハレンズ
JP4906798B2 (ja) * 2008-07-01 2012-03-28 株式会社沖データ レンズアレイ、ledヘッド、露光装置、画像形成装置及び読取装置
JP4966931B2 (ja) * 2008-08-26 2012-07-04 シャープ株式会社 電子素子ウエハモジュールおよびその製造方法、電子素子モジュールおよびその製造方法、電子情報機器
WO2010055801A1 (ja) 2008-11-17 2010-05-20 コニカミノルタオプト株式会社 光学素子の製造方法及び光学素子
JP2010204635A (ja) * 2009-02-06 2010-09-16 Fujifilm Corp レンズアレイ
JP2010204632A (ja) 2009-02-06 2010-09-16 Fujifilm Corp ウェハレベルレンズアレイの製造方法、ウェハレンズアレイ、レンズモジュール及び撮像ユニット
EP3081369B1 (en) * 2009-06-02 2021-05-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for manufacturing a lens
CN102023330A (zh) * 2009-09-15 2011-04-20 鸿富锦精密工业(深圳)有限公司 遮光元件阵列、遮光元件阵列制造方法及镜头模组阵列
JP2011097294A (ja) 2009-10-28 2011-05-12 Olympus Corp 撮像装置および撮像装置の製造方法
US8792044B2 (en) 2009-11-05 2014-07-29 Konica Minolta Advanced Layers Inc. Image pickup device and method for manufacturing the image pickup device
JP2011104811A (ja) 2009-11-13 2011-06-02 Fujifilm Corp マスタ型、マスタの作成方法及びマスタ
SG181620A1 (en) * 2009-12-11 2012-07-30 Fujifilm Corp Black curable composition, light-shielding color filter, light-shielding film and method for manufacturing the same, wafer level lens, and solid-state imaging device
CN102130138B (zh) * 2010-01-12 2013-01-02 中芯国际集成电路制造(上海)有限公司 图像传感器及其形成方法
US7974023B1 (en) * 2010-03-11 2011-07-05 Himax Semiconductor, Inc. Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof
TWM399313U (en) * 2010-07-30 2011-03-01 Sigurd Microelectronics Corp Proximity sensor package structure
CN103959465B (zh) * 2011-10-06 2019-06-07 新加坡恒立私人有限公司 用于物体的晶片级制造的方法以及相应的中间产品
JP2014190988A (ja) * 2013-03-26 2014-10-06 Fuji Xerox Co Ltd レンズアレイ及びレンズアレイ製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4952026A (en) * 1988-10-14 1990-08-28 Corning Incorporated Integral optical element and method
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods

Also Published As

Publication number Publication date
US20140347747A1 (en) 2014-11-27
WO2013010285A1 (en) 2013-01-24
JP2014521992A (ja) 2014-08-28
TW201310626A (zh) 2013-03-01
JP6763807B2 (ja) 2020-09-30
TWI647825B (zh) 2019-01-11
EP2735029B1 (en) 2022-12-21
US8767303B2 (en) 2014-07-01
KR101966478B1 (ko) 2019-04-05
JP2017167533A (ja) 2017-09-21
TWI635601B (zh) 2018-09-11
SG10201605834YA (en) 2016-09-29
US9610743B2 (en) 2017-04-04
US10527762B2 (en) 2020-01-07
US20170235026A1 (en) 2017-08-17
EP2735029A1 (en) 2014-05-28
TW201820597A (zh) 2018-06-01
CN103975436A (zh) 2014-08-06
TW201742238A (zh) 2017-12-01
US20130033767A1 (en) 2013-02-07
KR20140054081A (ko) 2014-05-08
US20160031169A1 (en) 2016-02-04
US9193120B2 (en) 2015-11-24
TWI647824B (zh) 2019-01-11

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