SG10201605697UA - Aqueous alkaline compositions and method for treating the surface of silicon substrates - Google Patents
Aqueous alkaline compositions and method for treating the surface of silicon substratesInfo
- Publication number
- SG10201605697UA SG10201605697UA SG10201605697UA SG10201605697UA SG10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA
- Authority
- SG
- Singapore
- Prior art keywords
- treating
- aqueous alkaline
- silicon substrates
- alkaline compositions
- compositions
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Photovoltaic Devices (AREA)
- Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161521386P | 2011-08-09 | 2011-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201605697UA true SG10201605697UA (en) | 2016-09-29 |
Family
ID=47667939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201605697UA SG10201605697UA (en) | 2011-08-09 | 2012-07-12 | Aqueous alkaline compositions and method for treating the surface of silicon substrates |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20140134778A1 (ja) |
| JP (1) | JP2014529641A (ja) |
| KR (1) | KR101922855B1 (ja) |
| CN (1) | CN103717687B (ja) |
| IN (1) | IN2014CN00877A (ja) |
| MY (1) | MY167595A (ja) |
| SG (1) | SG10201605697UA (ja) |
| TW (1) | TWI564386B (ja) |
| WO (1) | WO2013021296A1 (ja) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160200571A1 (en) * | 2013-09-05 | 2016-07-14 | Kit Co, Ltd. | Hydrogen production apparatus, hydrogen production method, silicon fine particles for hydrogen production, and production method for silicon fine particles for hydrogen production |
| JP6412377B2 (ja) * | 2013-09-11 | 2018-10-24 | 花王株式会社 | 樹脂マスク層用洗浄剤組成物及び回路基板の製造方法 |
| KR102668708B1 (ko) * | 2016-09-05 | 2024-05-23 | 동우 화인켐 주식회사 | 폴리실리콘 식각액 조성물 및 반도체 소자의 제조 방법 |
| US11271129B2 (en) * | 2016-11-03 | 2022-03-08 | Total Marketing Services | Surface treatment of solar cells |
| US10934485B2 (en) | 2017-08-25 | 2021-03-02 | Versum Materials Us, Llc | Etching solution for selectively removing silicon over silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device |
| CN108550639B (zh) * | 2018-03-21 | 2020-08-21 | 台州市棱智塑业有限公司 | 一种硅异质结太阳能电池界面处理剂及处理方法 |
| KR102624328B1 (ko) * | 2018-10-31 | 2024-01-15 | 상라오 신위안 웨동 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 태양 전지 모듈 |
| SG11202103910PA (en) | 2018-11-15 | 2021-05-28 | Entegris Inc | Silicon nitride etching composition and method |
| CN109609290B (zh) * | 2018-12-13 | 2021-04-09 | 蓝思科技（长沙）有限公司 | 一种玻璃抛光后用清洗剂和清洗方法 |
| JPWO2020166676A1 (ja) * | 2019-02-13 | 2021-12-16 | 株式会社トクヤマ | 次亜塩素酸イオン、及びｐＨ緩衝剤を含む半導体ウェハの処理液 |
| JP7433293B2 (ja) | 2019-03-26 | 2024-02-19 | 富士フイルム株式会社 | 洗浄液 |
| CN110473936A (zh) * | 2019-07-26 | 2019-11-19 | 镇江仁德新能源科技有限公司 | 一种单面湿法黑硅制绒方法 |
| US11499099B2 (en) * | 2019-09-10 | 2022-11-15 | Fujifilm Electronic Materials U.S.A., Inc. | Etching composition |
| CN112745990B (zh) * | 2019-10-30 | 2022-06-03 | 洛阳阿特斯光伏科技有限公司 | 一种无磷双组份清洗剂及其制备方法和应用 |
| KR20210119164A (ko) | 2020-03-24 | 2021-10-05 | 동우 화인켐 주식회사 | 결정성 실리콘 식각액 조성물, 및 이를 이용한 패턴 형성 방법 |
| CN112680229A (zh) * | 2021-01-29 | 2021-04-20 | 深圳市百通达科技有限公司 | 一种湿电子化学的硅基材料蚀刻液及其制备方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5466389A (en) * | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
| US5989353A (en) * | 1996-10-11 | 1999-11-23 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| JP2000208466A (ja) * | 1999-01-12 | 2000-07-28 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
| JP4206233B2 (ja) * | 2002-07-22 | 2009-01-07 | 旭硝子株式会社 | 研磨剤および研磨方法 |
| US20040077295A1 (en) * | 2002-08-05 | 2004-04-22 | Hellring Stuart D. | Process for reducing dishing and erosion during chemical mechanical planarization |
| JP2005268665A (ja) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
| EP1609847B1 (en) * | 2004-06-25 | 2007-03-21 | JSR Corporation | Cleaning composition for semiconductor components and process for manufacturing semiconductor device |
| US20060226122A1 (en) * | 2005-04-08 | 2006-10-12 | Wojtczak William A | Selective wet etching of metal nitrides |
| TW200714696A (en) * | 2005-08-05 | 2007-04-16 | Advanced Tech Materials | High throughput chemical mechanical polishing composition for metal film planarization |
| KR100786949B1 (ko) * | 2005-12-08 | 2007-12-17 | 주식회사 엘지화학 | 연마 선택도 조절 보조제 및 이를 함유한 ｃｍｐ 슬러리 |
| JP2007180451A (ja) * | 2005-12-28 | 2007-07-12 | Fujifilm Corp | 化学的機械的平坦化方法 |
| US8685909B2 (en) * | 2006-09-21 | 2014-04-01 | Advanced Technology Materials, Inc. | Antioxidants for post-CMP cleaning formulations |
| JP2008124222A (ja) * | 2006-11-10 | 2008-05-29 | Fujifilm Corp | 研磨液 |
| US20100015807A1 (en) * | 2006-12-22 | 2010-01-21 | Techno Semichem Co., Ltd. | Chemical Mechanical Polishing Composition for Copper Comprising Zeolite |
| JP2008181955A (ja) * | 2007-01-23 | 2008-08-07 | Fujifilm Corp | 金属用研磨液及びそれを用いた研磨方法 |
| JP2008277723A (ja) * | 2007-03-30 | 2008-11-13 | Fujifilm Corp | 金属用研磨液及び研磨方法 |
| US20100136794A1 (en) * | 2007-05-14 | 2010-06-03 | Basf Se | Method for removing etching residues from semiconductor components |
| KR101622862B1 (ko) * | 2007-05-17 | 2016-05-19 | 엔테그리스, 아이엔씨. | Ｃｍｐ후 세정 제제용 신규한 항산화제 |
| US8203013B2 (en) * | 2007-08-31 | 2012-06-19 | Jh Biotech, Inc. | Preparation of fatty acids in solid form |
| CN101883688A (zh) * | 2007-11-16 | 2010-11-10 | Ekc技术公司 | 用来从半导体基板除去金属硬掩模蚀刻残余物的组合物 |
| KR101094662B1 (ko) * | 2008-07-24 | 2011-12-20 | 솔브레인 주식회사 | 폴리실리콘 연마정지제를 함유하는 화학 기계적 연마조성물 |
| JP5553985B2 (ja) * | 2008-12-11 | 2014-07-23 | 三洋化成工業株式会社 | 電子材料用洗浄剤 |
| US8361237B2 (en) * | 2008-12-17 | 2013-01-29 | Air Products And Chemicals, Inc. | Wet clean compositions for CoWP and porous dielectrics |
| TWI583786B (zh) * | 2010-01-29 | 2017-05-21 | 恩特葛瑞斯股份有限公司 | 供附有金屬佈線之半導體用清洗劑 |
| MY160091A (en) * | 2010-06-09 | 2017-02-28 | Basf Se | Aqueous alkaline etching and cleaning composition and method for treating the surface of silicon substrates |
| EP2460860A1 (de) * | 2010-12-02 | 2012-06-06 | Basf Se | Verwendung von Mischungen zur Entfernung von Polyurethanen von Metalloberflächen |
-
2012
- 2012-07-12 US US14/131,304 patent/US20140134778A1/en not_active Abandoned
- 2012-07-12 MY MYPI2013004626A patent/MY167595A/en unknown
- 2012-07-12 IN IN877CHN2014 patent/IN2014CN00877A/en unknown
- 2012-07-12 SG SG10201605697UA patent/SG10201605697UA/en unknown
- 2012-07-12 WO PCT/IB2012/053576 patent/WO2013021296A1/en active Application Filing
- 2012-07-12 CN CN201280038487.1A patent/CN103717687B/zh not_active Expired - Fee Related
- 2012-07-12 KR KR1020147003265A patent/KR101922855B1/ko active IP Right Grant
- 2012-07-12 JP JP2014524461A patent/JP2014529641A/ja active Pending
- 2012-08-09 TW TW101128828A patent/TWI564386B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN103717687A (zh) | 2014-04-09 |
| MY167595A (en) | 2018-09-20 |
| TWI564386B (zh) | 2017-01-01 |
| US20140134778A1 (en) | 2014-05-15 |
| KR101922855B1 (ko) | 2019-02-27 |
| KR20140057259A (ko) | 2014-05-12 |
| CN103717687B (zh) | 2016-05-18 |
| JP2014529641A (ja) | 2014-11-13 |
| IN2014CN00877A (ja) | 2015-04-03 |
| TW201313894A (zh) | 2013-04-01 |
| WO2013021296A1 (en) | 2013-02-14 |
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