SG10201508996WA - Roll-Type Processing Member, Pencil-Type Processing Member, And Substrate Processing Apparatus Including Any One Of These - Google Patents

Roll-Type Processing Member, Pencil-Type Processing Member, And Substrate Processing Apparatus Including Any One Of These

Info

Publication number
SG10201508996WA
SG10201508996WA SG10201508996WA SG10201508996WA SG10201508996WA SG 10201508996W A SG10201508996W A SG 10201508996WA SG 10201508996W A SG10201508996W A SG 10201508996WA SG 10201508996W A SG10201508996W A SG 10201508996WA SG 10201508996W A SG10201508996W A SG 10201508996WA
Authority
SG
Singapore
Prior art keywords
processing member
type processing
pencil
roll
apparatus including
Prior art date
Application number
SG10201508996WA
Other languages
English (en)
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201508996WA publication Critical patent/SG10201508996WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201508996WA 2014-10-31 2015-10-30 Roll-Type Processing Member, Pencil-Type Processing Member, And Substrate Processing Apparatus Including Any One Of These SG10201508996WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014223754A JP6316730B2 (ja) 2014-10-31 2014-10-31 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置

Publications (1)

Publication Number Publication Date
SG10201508996WA true SG10201508996WA (en) 2016-05-30

Family

ID=55853472

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201508996WA SG10201508996WA (en) 2014-10-31 2015-10-30 Roll-Type Processing Member, Pencil-Type Processing Member, And Substrate Processing Apparatus Including Any One Of These

Country Status (7)

Country Link
US (2) US10471481B2 (zh)
JP (1) JP6316730B2 (zh)
KR (1) KR102443489B1 (zh)
CN (2) CN113276024B (zh)
MY (1) MY178652A (zh)
SG (1) SG10201508996WA (zh)
TW (2) TWI670141B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956578B2 (ja) 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
US20220410343A1 (en) * 2019-12-13 2022-12-29 Ebara Corporation Substrate cleaning apparatus, polishing apparatus, buffing apparatus, substrate cleaning method, substrate processing apparatus, and machine learning apparatus
CN112420574B (zh) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 一种可隔离防护晶圆的晶圆处理装置
JP2022084287A (ja) * 2020-11-26 2022-06-07 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシベースおよび基板洗浄装置
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2480023A (en) * 1948-05-28 1949-08-23 Knickerbocker Rubber Company Massage brush
US3583555A (en) * 1969-01-31 1971-06-08 George E Karsnak Cleaning apparatus for conveyor belts or the like
US4217737A (en) * 1979-04-16 1980-08-19 Merit Abrasive Products, Inc. Abrasive flap drum
JP3114156B2 (ja) * 1994-06-28 2000-12-04 株式会社荏原製作所 洗浄方法および装置
EP1080797A3 (en) * 1994-06-28 2005-10-05 Ebara Corporation Method and apparatus for cleaning workpiece
JPH08141521A (ja) 1994-11-24 1996-06-04 Sumitomo Metal Ind Ltd 洗浄装置
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
DE69737926T2 (de) * 1996-10-21 2008-04-10 Ebara Corp. Reinigungsvorrichtung
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
EP0937509A4 (en) 1996-11-08 2005-01-19 Aion Co Ltd SPONGE ROLL FOR CLEANING
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
JP4091187B2 (ja) * 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
KR100613919B1 (ko) * 1999-07-26 2006-08-18 동경 엘렉트론 주식회사 기판세정구, 기판세정장치 및 기판세정방법
US6406358B1 (en) * 1999-08-05 2002-06-18 Micron Technology, Inc. Method and apparatus for cleaning a surface of a microelectronic substrate
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US6367613B1 (en) * 2000-04-28 2002-04-09 Preston D. Montgomery Belt cleaning sprocket
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
JP2004273530A (ja) * 2003-03-05 2004-09-30 Nec Kyushu Ltd 洗浄装置およびその方法
EP1680260B1 (en) * 2003-08-08 2014-04-30 Entegris, Inc. Methods and materials for making a monolithic porous pad cast onto a rotatable base
CN1872546A (zh) * 2005-05-26 2006-12-06 日东电工株式会社 清洁片及使用该清洁片的清洁方法
JP2007000860A (ja) * 2005-05-26 2007-01-11 Nitto Denko Corp 清浄用シート及びそれを用いた清浄方法
CN100449704C (zh) * 2006-08-11 2009-01-07 中芯国际集成电路制造(上海)有限公司 研磨头的清洗装置
KR101155623B1 (ko) * 2010-01-08 2012-06-13 세메스 주식회사 기판 세정 유닛 및 이를 갖는 기판 세정 장치
WO2013049207A2 (en) * 2011-09-26 2013-04-04 Entegris, Inc. Post-cmp cleaning apparatus and method
US9202723B2 (en) * 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush
JP6352158B2 (ja) * 2014-11-20 2018-07-04 株式会社荏原製作所 洗浄具、洗浄具の製造方法、および、基板洗浄装置

Also Published As

Publication number Publication date
US11642704B2 (en) 2023-05-09
CN105575851A (zh) 2016-05-11
KR20160052343A (ko) 2016-05-12
MY178652A (en) 2020-10-20
JP6316730B2 (ja) 2018-04-25
US10471481B2 (en) 2019-11-12
TW201906689A (zh) 2019-02-16
TWI670141B (zh) 2019-09-01
CN105575851B (zh) 2021-08-27
TW201615340A (zh) 2016-05-01
KR102443489B1 (ko) 2022-09-15
US20200030855A1 (en) 2020-01-30
TWI678260B (zh) 2019-12-01
US20160126113A1 (en) 2016-05-05
JP2016092158A (ja) 2016-05-23
CN113276024A (zh) 2021-08-20
CN113276024B (zh) 2023-08-29

Similar Documents

Publication Publication Date Title
HK1231513A1 (zh) 活化素抑制劑應答預測和用於治療的用途
SG10201604456TA (en) Substrate processing apparatus and substrate processing method
SG10201705081PA (en) Substrate processing apparatus
SG10201508119XA (en) Substrate processing apparatus and processing method
KR102342131B9 (ko) 기판 처리 장치 및 기판 처리 방법
HK1245417B (zh) 基板處理方法和基板處理裝置
GB201417462D0 (en) Apparatus and process
SG11201606429YA (en) Bearing device and plasma processing apparatus
SG10201506731PA (en) Buffing apparatus, and substrate processing apparatus
SG11201607004QA (en) Substrate processing system and substrate processing method
HUE057676T2 (hu) Szállítóberendezés
SG10201502813TA (en) Substrate Processing Apparatus
SG11201710053SA (en) Substrate treatment device and substrate treatment method
SG11201704891XA (en) Heating chamber and semiconductor processing apparatus
SG10201508996WA (en) Roll-Type Processing Member, Pencil-Type Processing Member, And Substrate Processing Apparatus Including Any One Of These
SG11201702039YA (en) Bearing apparatus and semiconductor processing device
SG11201608815XA (en) Reaction chamber and semi-conductor processing device
EP3253715A4 (en) Improved fluid treatment apparatus and processes
SG10201700763VA (en) Processing apparatus
SG10201504537YA (en) Processing apparatus
SG10201705501WA (en) Substrate processing apparatus
SG11201705934UA (en) Substrate treatment apparatus and reaction tube
SG11201609506SA (en) Pressure calibration jig and substrate processing apparatus
SG10201710545XA (en) Control device for substrate treatment apparatus, substrate treatment apparatus, and display control device
SG10201603207YA (en) Processing apparatus