SG10201506220PA - Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices - Google Patents

Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Info

Publication number
SG10201506220PA
SG10201506220PA SG10201506220PA SG10201506220PA SG10201506220PA SG 10201506220P A SG10201506220P A SG 10201506220PA SG 10201506220P A SG10201506220P A SG 10201506220PA SG 10201506220P A SG10201506220P A SG 10201506220PA SG 10201506220P A SG10201506220P A SG 10201506220PA
Authority
SG
Singapore
Prior art keywords
mechanical
electrical
optical devices
substrate materials
chemically mechanically
Prior art date
Application number
SG10201506220PA
Other languages
English (en)
Inventor
Yuzhuo Li
Jea-Ju Chu
Shyam Sundar Venkataraman
Ibrahim Sheik Ansar Usman
Harvey Wayne Pinder
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG10201506220PA publication Critical patent/SG10201506220PA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1409Abrasive particles per se
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/04Aqueous dispersions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/06Other polishing compositions
    • C09G1/14Other polishing compositions based on non-waxy substances
    • C09G1/18Other polishing compositions based on non-waxy substances on other substances
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/31051Planarisation of the insulating layers
    • H01L21/31053Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201506220PA 2010-09-08 2011-09-06 Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices SG10201506220PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38072310P 2010-09-08 2010-09-08

Publications (1)

Publication Number Publication Date
SG10201506220PA true SG10201506220PA (en) 2015-09-29

Family

ID=45810176

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201506220PA SG10201506220PA (en) 2010-09-08 2011-09-06 Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices
SG2013017264A SG188460A1 (en) 2010-09-08 2011-09-06 Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2013017264A SG188460A1 (en) 2010-09-08 2011-09-06 Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Country Status (11)

Country Link
US (1) US20130161285A1 (ja)
EP (1) EP2614123B1 (ja)
JP (1) JP6196155B2 (ja)
KR (1) KR101907863B1 (ja)
CN (1) CN103189457B (ja)
IL (1) IL225085A (ja)
MY (1) MY164859A (ja)
RU (1) RU2577281C2 (ja)
SG (2) SG10201506220PA (ja)
TW (1) TWI538989B (ja)
WO (1) WO2012032469A1 (ja)

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Also Published As

Publication number Publication date
RU2013115235A (ru) 2014-10-20
RU2577281C2 (ru) 2016-03-10
EP2614123A4 (en) 2014-07-30
EP2614123A1 (en) 2013-07-17
US20130161285A1 (en) 2013-06-27
EP2614123B1 (en) 2017-06-28
IL225085A (en) 2017-09-28
SG188460A1 (en) 2013-04-30
TWI538989B (zh) 2016-06-21
JP2013540851A (ja) 2013-11-07
WO2012032469A1 (en) 2012-03-15
JP6196155B2 (ja) 2017-09-13
TW201211223A (en) 2012-03-16
CN103189457B (zh) 2015-12-09
KR101907863B1 (ko) 2018-10-15
MY164859A (en) 2018-01-30
KR20130133177A (ko) 2013-12-06
CN103189457A (zh) 2013-07-03

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