SG10201504251WA - Composition for metal electroplating comprising leveling agent - Google Patents

Composition for metal electroplating comprising leveling agent

Info

Publication number
SG10201504251WA
SG10201504251WA SG10201504251WA SG10201504251WA SG10201504251WA SG 10201504251W A SG10201504251W A SG 10201504251WA SG 10201504251W A SG10201504251W A SG 10201504251WA SG 10201504251W A SG10201504251W A SG 10201504251WA SG 10201504251W A SG10201504251W A SG 10201504251WA
Authority
SG
Singapore
Prior art keywords
composition
leveling agent
metal electroplating
electroplating
metal
Prior art date
Application number
SG10201504251WA
Other languages
English (en)
Inventor
Michael Siemer
Cornelia Röger-Göpfert
Nicole Meier
Roman Benedikt Raether
Marco Arnold
Charlotte Emnet
Dieter Mayer
Alexander Flügel
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG10201504251WA publication Critical patent/SG10201504251WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0616—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SG10201504251WA 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent SG10201504251WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35004510P 2010-06-01 2010-06-01

Publications (1)

Publication Number Publication Date
SG10201504251WA true SG10201504251WA (en) 2015-07-30

Family

ID=45066252

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201504251WA SG10201504251WA (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent
SG2012086377A SG185736A1 (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012086377A SG185736A1 (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent

Country Status (11)

Country Link
US (1) US9683302B2 (ko)
EP (1) EP2576696B1 (ko)
JP (1) JP5933532B2 (ko)
KR (3) KR101829866B1 (ko)
CN (1) CN102939339B (ko)
IL (1) IL223183B (ko)
MY (1) MY164464A (ko)
RU (1) RU2603675C2 (ko)
SG (2) SG10201504251WA (ko)
TW (1) TWI539036B (ko)
WO (1) WO2011151785A1 (ko)

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US10190228B2 (en) * 2016-03-29 2019-01-29 Rohm And Haas Electronic Materials Llc Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
CN109996785B (zh) * 2016-09-22 2021-12-28 麦克德米德乐思公司 集成电路的晶圆级封装中的铜沉积
WO2018073011A1 (en) 2016-10-20 2018-04-26 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
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CN110678583B (zh) * 2017-06-01 2022-09-30 巴斯夫欧洲公司 包含流平剂的锡合金电镀组合物
US11387108B2 (en) 2017-09-04 2022-07-12 Basf Se Composition for metal electroplating comprising leveling agent
EP3511444B1 (en) * 2018-01-16 2020-07-22 ATOTECH Deutschland GmbH Metal or metal alloy deposition composition and plating compound
KR102483615B1 (ko) * 2018-01-24 2023-01-03 삼성전기주식회사 비스-아릴 암모늄 화합물을 포함하는 도금용 평탄제 및 이를 이용한 구리 도금 방법
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
WO2021058336A1 (en) 2019-09-27 2021-04-01 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
EP4034696A1 (en) 2019-09-27 2022-08-03 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
CN110938847B (zh) * 2019-10-30 2021-11-12 苏州清飙科技有限公司 电镀铜整平剂及其制备方法、以及电镀液
CN115335434A (zh) 2020-04-03 2022-11-11 巴斯夫欧洲公司 用于铜凸块电沉积的包含聚氨基酰胺型流平剂的组合物
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JP2023533784A (ja) 2020-07-13 2023-08-04 ビーエーエスエフ ソシエタス・ヨーロピア コバルトシード上の銅電気メッキ用組成物
KR102339868B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
IL311715A (en) 2021-10-01 2024-05-01 Basf Se The composition for electrical deposition of copper containing a polyaminoamide compensator
WO2024008562A1 (en) 2022-07-07 2024-01-11 Basf Se Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition

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Also Published As

Publication number Publication date
IL223183B (en) 2018-03-29
CN102939339A (zh) 2013-02-20
TW201211321A (en) 2012-03-16
KR20180017244A (ko) 2018-02-20
US20130068626A1 (en) 2013-03-21
EP2576696A1 (en) 2013-04-10
KR101955869B1 (ko) 2019-03-07
IL223183A0 (en) 2013-02-03
EP2576696A4 (en) 2014-07-16
CN102939339B (zh) 2016-02-17
JP2013527325A (ja) 2013-06-27
JP5933532B2 (ja) 2016-06-15
KR101891473B1 (ko) 2018-08-27
RU2603675C2 (ru) 2016-11-27
TWI539036B (zh) 2016-06-21
KR20130112018A (ko) 2013-10-11
WO2011151785A1 (en) 2011-12-08
MY164464A (en) 2017-12-15
EP2576696B1 (en) 2017-10-04
KR101829866B1 (ko) 2018-02-20
KR20180094140A (ko) 2018-08-22
SG185736A1 (en) 2012-12-28
RU2012157535A (ru) 2014-07-20
US9683302B2 (en) 2017-06-20

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