SG10201501150YA - Electroless deposition of continuous platinum layer - Google Patents

Electroless deposition of continuous platinum layer

Info

Publication number
SG10201501150YA
SG10201501150YA SG10201501150YA SG10201501150YA SG10201501150YA SG 10201501150Y A SG10201501150Y A SG 10201501150YA SG 10201501150Y A SG10201501150Y A SG 10201501150YA SG 10201501150Y A SG10201501150Y A SG 10201501150YA SG 10201501150Y A SG10201501150Y A SG 10201501150YA
Authority
SG
Singapore
Prior art keywords
electroless deposition
platinum layer
continuous platinum
continuous
electroless
Prior art date
Application number
SG10201501150YA
Other languages
English (en)
Inventor
Eugenijus Norkus
Aldona Jagminiene
Albina Zieliene
Ina Stankeviciene
Loreta Tamasauskaite-Tamasiunaite
Aniruddha Joi
Yezdi Dordi
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201501150YA publication Critical patent/SG10201501150YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrochemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
SG10201501150YA 2014-02-18 2015-02-13 Electroless deposition of continuous platinum layer SG10201501150YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/182,987 US9469902B2 (en) 2014-02-18 2014-02-18 Electroless deposition of continuous platinum layer

Publications (1)

Publication Number Publication Date
SG10201501150YA true SG10201501150YA (en) 2015-09-29

Family

ID=53797584

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501150YA SG10201501150YA (en) 2014-02-18 2015-02-13 Electroless deposition of continuous platinum layer

Country Status (6)

Country Link
US (1) US9469902B2 (enExample)
JP (1) JP2015151628A (enExample)
KR (1) KR102455120B1 (enExample)
CN (1) CN104851837B (enExample)
SG (1) SG10201501150YA (enExample)
TW (1) TW201542873A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003008537A2 (en) 2001-04-06 2003-01-30 Mannkind Corporation Epitope sequences
EP1752160A3 (en) 2001-04-06 2007-05-30 Mannkind Corporation Epitope sequences
ATE546153T1 (de) 2003-06-17 2012-03-15 Mannkind Corp Kombinationen von tumor-assoziierten antigenen zur behandlung von verschiedenen krebstypen
MXPA05013973A (es) 2003-06-17 2006-03-02 Mannkind Corp Metodos para producir, mejorar y sustentar respuestas inmunes contra epitopes restringidos mhc clase i, para propositos profilacticos o terapeuticos.
EP2332971B1 (en) 2004-06-17 2016-02-17 MannKind Corporation Epitope analogs
US7511119B2 (en) 2005-06-17 2009-03-31 Mannkind Corporation PRAME peptide analogues
CA2612516C (en) 2005-06-17 2015-03-24 Mannkind Corporation Methods and compositions to elicit multivalent immune responses against dominant and subdominant epitopes, expressed on cancer cells and tumor stroma
KR20080033271A (ko) 2005-06-17 2008-04-16 맨카인드 코포레이션 암종을 위한 다가 동반이행 및 증폭형 면역치료제
WO2011050344A2 (en) 2009-10-23 2011-04-28 Mannkind Corporation Cancer immunotherapy and method of treatment
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
LT6547B (lt) 2016-12-28 2018-08-10 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Platinos cheminio nusodinimo tirpalas ir platinos tolydžios dangos formavimo būdas

Family Cites Families (24)

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US3698939A (en) * 1970-07-09 1972-10-17 Frank H Leaman Method and composition of platinum plating
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
JPH04325688A (ja) 1991-04-26 1992-11-16 Murata Mfg Co Ltd 無電解めっき浴
US5360471A (en) * 1992-08-05 1994-11-01 Murata Manufacturing Co., Ltd. Electroless solder plating bath
JP3116637B2 (ja) 1993-03-12 2000-12-11 株式会社村田製作所 無電解めっき液
JP3920462B2 (ja) * 1998-07-13 2007-05-30 株式会社大和化成研究所 貴金属を化学的還元析出によって得るための水溶液
JP3455709B2 (ja) 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
JP3744300B2 (ja) * 1999-04-06 2006-02-08 住友電気工業株式会社 導電性多孔質とそれを用いた金属多孔質体および電池用極板
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
EP1489695B1 (en) * 2002-03-04 2008-09-10 Sumitomo Electric Industries, Ltd. Anisotropic conductive film and method for producing the same
JP2004115885A (ja) * 2002-09-27 2004-04-15 Tokyo Electron Ltd 無電解メッキ方法
JP2009016389A (ja) * 2007-06-29 2009-01-22 Panasonic Corp 半導体レーザ素子およびその製造方法
JP4986174B2 (ja) * 2008-10-30 2012-07-25 独立行政法人産業技術総合研究所 マイクロリアクター用反応管及びその製造方法
KR20120086354A (ko) * 2009-11-16 2012-08-02 바스프 에스이 금속 섬 코팅 및 합성 방법
KR101079775B1 (ko) * 2010-04-01 2011-11-03 경희대학교 산학협력단 전기방사에 이은 무전해 도금을 통한 전기 전도성 나노섬유 제조 방법
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
EP2481835B1 (en) * 2011-01-28 2013-09-11 Atotech Deutschland GmbH Autocatalytic plating bath composition for deposition of tin and tin alloys
JP2013161928A (ja) * 2012-02-03 2013-08-19 Sumitomo Electric Ind Ltd プリント配線板用基材およびプリント配線板用基材の製造方法
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US9428836B2 (en) * 2014-04-29 2016-08-30 Lam Research Corporation Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents
US20150307995A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS
US20150307994A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS

Also Published As

Publication number Publication date
US9469902B2 (en) 2016-10-18
CN104851837B (zh) 2018-03-13
JP2015151628A (ja) 2015-08-24
CN104851837A (zh) 2015-08-19
TW201542873A (zh) 2015-11-16
US20150232995A1 (en) 2015-08-20
KR20150097412A (ko) 2015-08-26
KR102455120B1 (ko) 2022-10-14

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