KR102455120B1 - 연속적인 백금층의 무전해 디포지션 - Google Patents

연속적인 백금층의 무전해 디포지션 Download PDF

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KR102455120B1
KR102455120B1 KR1020150022631A KR20150022631A KR102455120B1 KR 102455120 B1 KR102455120 B1 KR 102455120B1 KR 1020150022631 A KR1020150022631 A KR 1020150022631A KR 20150022631 A KR20150022631 A KR 20150022631A KR 102455120 B1 KR102455120 B1 KR 102455120B1
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solution
ions
platinum
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electroless deposition
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KR20150097412A (ko
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에우게니주스 노르쿠스
알도나 자그미니엔네
알비나 지엘리엔네
인나 스탄케비키엔네
로레타 타마사우스카이테-타마시우나이테
아니루다 조이
예즈디 도르디
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76874—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrochemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020150022631A 2014-02-18 2015-02-13 연속적인 백금층의 무전해 디포지션 Active KR102455120B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/182,987 2014-02-18
US14/182,987 US9469902B2 (en) 2014-02-18 2014-02-18 Electroless deposition of continuous platinum layer

Publications (2)

Publication Number Publication Date
KR20150097412A KR20150097412A (ko) 2015-08-26
KR102455120B1 true KR102455120B1 (ko) 2022-10-14

Family

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KR1020150022631A Active KR102455120B1 (ko) 2014-02-18 2015-02-13 연속적인 백금층의 무전해 디포지션

Country Status (6)

Country Link
US (1) US9469902B2 (enExample)
JP (1) JP2015151628A (enExample)
KR (1) KR102455120B1 (enExample)
CN (1) CN104851837B (enExample)
SG (1) SG10201501150YA (enExample)
TW (1) TW201542873A (enExample)

Families Citing this family (11)

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Publication number Priority date Publication date Assignee Title
WO2003008537A2 (en) 2001-04-06 2003-01-30 Mannkind Corporation Epitope sequences
EP1752160A3 (en) 2001-04-06 2007-05-30 Mannkind Corporation Epitope sequences
ATE546153T1 (de) 2003-06-17 2012-03-15 Mannkind Corp Kombinationen von tumor-assoziierten antigenen zur behandlung von verschiedenen krebstypen
MXPA05013973A (es) 2003-06-17 2006-03-02 Mannkind Corp Metodos para producir, mejorar y sustentar respuestas inmunes contra epitopes restringidos mhc clase i, para propositos profilacticos o terapeuticos.
EP2332971B1 (en) 2004-06-17 2016-02-17 MannKind Corporation Epitope analogs
US7511119B2 (en) 2005-06-17 2009-03-31 Mannkind Corporation PRAME peptide analogues
CA2612516C (en) 2005-06-17 2015-03-24 Mannkind Corporation Methods and compositions to elicit multivalent immune responses against dominant and subdominant epitopes, expressed on cancer cells and tumor stroma
KR20080033271A (ko) 2005-06-17 2008-04-16 맨카인드 코포레이션 암종을 위한 다가 동반이행 및 증폭형 면역치료제
WO2011050344A2 (en) 2009-10-23 2011-04-28 Mannkind Corporation Cancer immunotherapy and method of treatment
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
LT6547B (lt) 2016-12-28 2018-08-10 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Platinos cheminio nusodinimo tirpalas ir platinos tolydžios dangos formavimo būdas

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2000026977A (ja) 1998-07-13 2000-01-25 Daiwa Kasei Kenkyusho:Kk 貴金属を化学的還元析出によって得るための水溶液
JP2000353527A (ja) 1999-04-06 2000-12-19 Sumitomo Electric Ind Ltd 導電性多孔質とそれを用いた金属多孔質体および電池用極板
JP2000355774A (ja) * 1999-04-06 2000-12-26 Daiwa Kasei Kenkyusho:Kk めっき方法とそれに用いるめっき液前駆体
JP2013161928A (ja) 2012-02-03 2013-08-19 Sumitomo Electric Ind Ltd プリント配線板用基材およびプリント配線板用基材の製造方法

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US3698939A (en) * 1970-07-09 1972-10-17 Frank H Leaman Method and composition of platinum plating
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
JPH04325688A (ja) 1991-04-26 1992-11-16 Murata Mfg Co Ltd 無電解めっき浴
US5360471A (en) * 1992-08-05 1994-11-01 Murata Manufacturing Co., Ltd. Electroless solder plating bath
JP3116637B2 (ja) 1993-03-12 2000-12-11 株式会社村田製作所 無電解めっき液
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
EP1489695B1 (en) * 2002-03-04 2008-09-10 Sumitomo Electric Industries, Ltd. Anisotropic conductive film and method for producing the same
JP2004115885A (ja) * 2002-09-27 2004-04-15 Tokyo Electron Ltd 無電解メッキ方法
JP2009016389A (ja) * 2007-06-29 2009-01-22 Panasonic Corp 半導体レーザ素子およびその製造方法
JP4986174B2 (ja) * 2008-10-30 2012-07-25 独立行政法人産業技術総合研究所 マイクロリアクター用反応管及びその製造方法
KR20120086354A (ko) * 2009-11-16 2012-08-02 바스프 에스이 금속 섬 코팅 및 합성 방법
KR101079775B1 (ko) * 2010-04-01 2011-11-03 경희대학교 산학협력단 전기방사에 이은 무전해 도금을 통한 전기 전도성 나노섬유 제조 방법
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
EP2481835B1 (en) * 2011-01-28 2013-09-11 Atotech Deutschland GmbH Autocatalytic plating bath composition for deposition of tin and tin alloys
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US9428836B2 (en) * 2014-04-29 2016-08-30 Lam Research Corporation Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents
US20150307995A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS
US20150307994A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000026977A (ja) 1998-07-13 2000-01-25 Daiwa Kasei Kenkyusho:Kk 貴金属を化学的還元析出によって得るための水溶液
JP2000353527A (ja) 1999-04-06 2000-12-19 Sumitomo Electric Ind Ltd 導電性多孔質とそれを用いた金属多孔質体および電池用極板
JP2000355774A (ja) * 1999-04-06 2000-12-26 Daiwa Kasei Kenkyusho:Kk めっき方法とそれに用いるめっき液前駆体
JP2013161928A (ja) 2012-02-03 2013-08-19 Sumitomo Electric Ind Ltd プリント配線板用基材およびプリント配線板用基材の製造方法

Also Published As

Publication number Publication date
US9469902B2 (en) 2016-10-18
CN104851837B (zh) 2018-03-13
JP2015151628A (ja) 2015-08-24
SG10201501150YA (en) 2015-09-29
CN104851837A (zh) 2015-08-19
TW201542873A (zh) 2015-11-16
US20150232995A1 (en) 2015-08-20
KR20150097412A (ko) 2015-08-26

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