SG10201402045WA - Methods And Apparatus For Recovery Of Silicon And Silicon Carbide From Spent Wafer-Sawing Slurry - Google Patents

Methods And Apparatus For Recovery Of Silicon And Silicon Carbide From Spent Wafer-Sawing Slurry

Info

Publication number
SG10201402045WA
SG10201402045WA SG10201402045WA SG10201402045WA SG10201402045WA SG 10201402045W A SG10201402045W A SG 10201402045WA SG 10201402045W A SG10201402045W A SG 10201402045WA SG 10201402045W A SG10201402045W A SG 10201402045WA SG 10201402045W A SG10201402045W A SG 10201402045WA
Authority
SG
Singapore
Prior art keywords
silicon
recovery
methods
silicon carbide
sawing slurry
Prior art date
Application number
SG10201402045WA
Other languages
English (en)
Inventor
John Allan Fallavollita
Original Assignee
Iosil Energy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iosil Energy Corp filed Critical Iosil Energy Corp
Publication of SG10201402045WA publication Critical patent/SG10201402045WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG10201402045WA 2008-04-11 2009-04-10 Methods And Apparatus For Recovery Of Silicon And Silicon Carbide From Spent Wafer-Sawing Slurry SG10201402045WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4434208P 2008-04-11 2008-04-11
US14803309P 2009-01-28 2009-01-28

Publications (1)

Publication Number Publication Date
SG10201402045WA true SG10201402045WA (en) 2014-10-30

Family

ID=41162660

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201402045WA SG10201402045WA (en) 2008-04-11 2009-04-10 Methods And Apparatus For Recovery Of Silicon And Silicon Carbide From Spent Wafer-Sawing Slurry

Country Status (7)

Country Link
US (3) US20110059002A1 (zh)
EP (1) EP2274767A4 (zh)
JP (1) JP2011516290A (zh)
CN (2) CN103481383A (zh)
CA (1) CA2721177A1 (zh)
SG (1) SG10201402045WA (zh)
WO (1) WO2009126922A2 (zh)

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Also Published As

Publication number Publication date
WO2009126922A3 (en) 2010-03-18
US20110059002A1 (en) 2011-03-10
EP2274767A4 (en) 2014-09-17
CN103481383A (zh) 2014-01-01
WO2009126922A2 (en) 2009-10-15
CA2721177A1 (en) 2009-10-15
US20110280785A1 (en) 2011-11-17
JP2011516290A (ja) 2011-05-26
CN102067277A (zh) 2011-05-18
EP2274767A2 (en) 2011-01-19
US20130236387A1 (en) 2013-09-12
US8354088B2 (en) 2013-01-15
CN102067277B (zh) 2013-09-18

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