SE9803767D0 - Method for semiconductor manufacturing - Google Patents

Method for semiconductor manufacturing

Info

Publication number
SE9803767D0
SE9803767D0 SE9803767A SE9803767A SE9803767D0 SE 9803767 D0 SE9803767 D0 SE 9803767D0 SE 9803767 A SE9803767 A SE 9803767A SE 9803767 A SE9803767 A SE 9803767A SE 9803767 D0 SE9803767 D0 SE 9803767D0
Authority
SE
Sweden
Prior art keywords
region
type
semiconductor manufacturing
subregion
implementing
Prior art date
Application number
SE9803767A
Other languages
English (en)
Other versions
SE514707C2 (sv
Inventor
Jan Christian Nystroem
Ted Johansson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9803767A priority Critical patent/SE514707C2/sv
Publication of SE9803767D0 publication Critical patent/SE9803767D0/sv
Priority to PCT/SE1999/001942 priority patent/WO2000026962A1/en
Priority to EP99971582A priority patent/EP1145306A1/en
Priority to CA002349559A priority patent/CA2349559A1/en
Priority to JP2000580245A priority patent/JP2002529914A/ja
Priority to AU14315/00A priority patent/AU1431500A/en
Priority to KR1020017004974A priority patent/KR20010080271A/ko
Priority to CN99813035A priority patent/CN1325544A/zh
Priority to US09/433,795 priority patent/US6313001B1/en
Priority to US09/785,277 priority patent/US20010005608A1/en
Publication of SE514707C2 publication Critical patent/SE514707C2/sv
Priority to HK02103935.0A priority patent/HK1042163A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/102—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8248—Combination of bipolar and field-effect technology
    • H01L21/8249—Bipolar and MOS technology

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
SE9803767A 1998-11-04 1998-11-04 Metod för halvledartillverkning SE514707C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE9803767A SE514707C2 (sv) 1998-11-04 1998-11-04 Metod för halvledartillverkning
CN99813035A CN1325544A (zh) 1998-11-04 1999-10-27 半导体制作方法
JP2000580245A JP2002529914A (ja) 1998-11-04 1999-10-27 半導体の製造法
EP99971582A EP1145306A1 (en) 1998-11-04 1999-10-27 Method for semiconductor manufacturing
CA002349559A CA2349559A1 (en) 1998-11-04 1999-10-27 Method for semiconductor manufacturing
PCT/SE1999/001942 WO2000026962A1 (en) 1998-11-04 1999-10-27 Method for semiconductor manufacturing
AU14315/00A AU1431500A (en) 1998-11-04 1999-10-27 Method for semiconductor manufacturing
KR1020017004974A KR20010080271A (ko) 1998-11-04 1999-10-27 반도체 제조 방법
US09/433,795 US6313001B1 (en) 1998-11-04 1999-11-03 Method for semiconductor manufacturing
US09/785,277 US20010005608A1 (en) 1998-11-04 2001-02-20 Method for semiconductor manufacturing
HK02103935.0A HK1042163A1 (zh) 1998-11-04 2002-05-27 半導體製作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9803767A SE514707C2 (sv) 1998-11-04 1998-11-04 Metod för halvledartillverkning

Publications (2)

Publication Number Publication Date
SE9803767D0 true SE9803767D0 (sv) 1998-11-04
SE514707C2 SE514707C2 (sv) 2001-04-02

Family

ID=20413175

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9803767A SE514707C2 (sv) 1998-11-04 1998-11-04 Metod för halvledartillverkning

Country Status (10)

Country Link
US (2) US6313001B1 (sv)
EP (1) EP1145306A1 (sv)
JP (1) JP2002529914A (sv)
KR (1) KR20010080271A (sv)
CN (1) CN1325544A (sv)
AU (1) AU1431500A (sv)
CA (1) CA2349559A1 (sv)
HK (1) HK1042163A1 (sv)
SE (1) SE514707C2 (sv)
WO (1) WO2000026962A1 (sv)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6448160B1 (en) 1999-04-01 2002-09-10 Apd Semiconductor, Inc. Method of fabricating power rectifier device to vary operating parameters and resulting device
US7772653B1 (en) * 2004-02-11 2010-08-10 National Semiconductor Corporation Semiconductor apparatus comprising bipolar transistors and metal oxide semiconductor transistors
US7067383B2 (en) * 2004-03-08 2006-06-27 Intersil Americas, Inc. Method of making bipolar transistors and resulting product
US20060148188A1 (en) * 2005-01-05 2006-07-06 Bcd Semiconductor Manufacturing Limited Fabrication method for bipolar integrated circuits
CN100424909C (zh) * 2006-05-25 2008-10-08 中国科学院长春应用化学研究所 金属基极有机晶体管及其制备方法
US8643055B2 (en) 2007-09-26 2014-02-04 Stmicroelectronics N.V. Series current limiter device
US8633521B2 (en) 2007-09-26 2014-01-21 Stmicroelectronics N.V. Self-bootstrapping field effect diode structures and methods
US8148748B2 (en) 2007-09-26 2012-04-03 Stmicroelectronics N.V. Adjustable field effect rectifier
EP3447803A3 (en) 2007-09-26 2019-06-19 STMicroelectronics N.V. Adjustable field effect rectifier
WO2010089675A1 (en) * 2009-02-06 2010-08-12 Nxp B.V. Ic and ic manufacturing method
US9252293B2 (en) * 2014-01-22 2016-02-02 Alexei Ankoudinov Trench field effect diodes and methods of manufacturing those diodes
US9419116B2 (en) 2014-01-22 2016-08-16 Alexei Ankoudinov Diodes and methods of manufacturing diodes
CN110890366A (zh) * 2018-09-07 2020-03-17 长鑫存储技术有限公司 半导体存储器的制备方法及半导体存储器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548704B2 (sv) * 1973-06-01 1980-12-08
DE2453134C3 (de) * 1974-11-08 1983-02-10 Deutsche Itt Industries Gmbh, 7800 Freiburg Planardiffusionsverfahren
US4025364A (en) * 1975-08-11 1977-05-24 Fairchild Camera And Instrument Corporation Process for simultaneously fabricating epitaxial resistors, base resistors, and vertical transistor bases
US4133701A (en) * 1977-06-29 1979-01-09 General Motors Corporation Selective enhancement of phosphorus diffusion by implanting halogen ions
US4535531A (en) * 1982-03-22 1985-08-20 International Business Machines Corporation Method and resulting structure for selective multiple base width transistor structures
US4596605A (en) 1982-12-14 1986-06-24 Junichi Nishizawa Fabrication process of static induction transistor and solid-state image sensor device
JPS60117765A (ja) * 1983-11-30 1985-06-25 Fujitsu Ltd 半導体装置の製造方法
US4882294A (en) * 1988-08-17 1989-11-21 Delco Electronics Corporation Process for forming an epitaxial layer having portions of different thicknesses
KR930010116B1 (ko) 1990-10-22 1993-10-14 한국전기통신공사 BiCMOS 소자의 제조방법

Also Published As

Publication number Publication date
EP1145306A1 (en) 2001-10-17
CN1325544A (zh) 2001-12-05
HK1042163A1 (zh) 2002-08-02
KR20010080271A (ko) 2001-08-22
SE514707C2 (sv) 2001-04-02
AU1431500A (en) 2000-05-22
US20010005608A1 (en) 2001-06-28
WO2000026962A1 (en) 2000-05-11
CA2349559A1 (en) 2000-05-11
US6313001B1 (en) 2001-11-06
JP2002529914A (ja) 2002-09-10

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