SE9800757L - Optoelektrisk flerchipsmodul - Google Patents
Optoelektrisk flerchipsmodulInfo
- Publication number
- SE9800757L SE9800757L SE9800757A SE9800757A SE9800757L SE 9800757 L SE9800757 L SE 9800757L SE 9800757 A SE9800757 A SE 9800757A SE 9800757 A SE9800757 A SE 9800757A SE 9800757 L SE9800757 L SE 9800757L
- Authority
- SE
- Sweden
- Prior art keywords
- layers
- optical
- polymer layers
- optical waveguides
- thin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12104—Mirror; Reflectors or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9800757A SE513858C2 (sv) | 1998-03-06 | 1998-03-06 | Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler |
US09/263,521 US6343164B1 (en) | 1998-03-06 | 1999-03-05 | Optoelectric multichip module |
AU31780/99A AU3178099A (en) | 1998-03-06 | 1999-03-08 | Optoelectric multichip module |
CA002322314A CA2322314A1 (en) | 1998-03-06 | 1999-03-08 | Optoelectric multichip module |
JP2000534898A JP2002506223A (ja) | 1998-03-06 | 1999-03-08 | 光電子マルチチップ・モジュール |
KR1020007009740A KR20010041556A (ko) | 1998-03-06 | 1999-03-08 | 광전 다중칩 모듈 |
CNB998057800A CN1154858C (zh) | 1998-03-06 | 1999-03-08 | 光电多芯片模块 |
EP99913786A EP1070269A2 (en) | 1998-03-06 | 1999-03-08 | Optoelectric multichip module |
PCT/SE1999/000349 WO1999045416A2 (en) | 1998-03-06 | 1999-03-08 | Optoelectric multichip module |
TW088104491A TW430747B (en) | 1998-03-06 | 1999-03-22 | Optoelectric multichip module |
HK01108507A HK1037929A1 (en) | 1998-03-06 | 2001-12-04 | Optoelectric multichip module. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9800757A SE513858C2 (sv) | 1998-03-06 | 1998-03-06 | Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9800757D0 SE9800757D0 (sv) | 1998-03-06 |
SE9800757L true SE9800757L (sv) | 1999-09-07 |
SE513858C2 SE513858C2 (sv) | 2000-11-13 |
Family
ID=20410471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9800757A SE513858C2 (sv) | 1998-03-06 | 1998-03-06 | Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler |
Country Status (11)
Country | Link |
---|---|
US (1) | US6343164B1 (sv) |
EP (1) | EP1070269A2 (sv) |
JP (1) | JP2002506223A (sv) |
KR (1) | KR20010041556A (sv) |
CN (1) | CN1154858C (sv) |
AU (1) | AU3178099A (sv) |
CA (1) | CA2322314A1 (sv) |
HK (1) | HK1037929A1 (sv) |
SE (1) | SE513858C2 (sv) |
TW (1) | TW430747B (sv) |
WO (1) | WO1999045416A2 (sv) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1093600B1 (en) * | 1998-07-08 | 2004-09-15 | E Ink Corporation | Methods for achieving improved color in microencapsulated electrophoretic devices |
WO2001007961A1 (en) * | 1999-07-21 | 2001-02-01 | E Ink Corporation | Use of a storage capacitor to enhance the performance of an active matrix driven electronic display |
ATE438927T1 (de) * | 2000-04-18 | 2009-08-15 | E Ink Corp | Prozess zur herstellung von dünnfilmtransistoren |
US7893435B2 (en) * | 2000-04-18 | 2011-02-22 | E Ink Corporation | Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough |
US7034775B2 (en) * | 2001-03-26 | 2006-04-25 | Seiko Epson Corporation | Display device and method for manufacturing the same |
FR2824920B1 (fr) * | 2001-05-15 | 2003-10-17 | Opsitech Optical Sys On A Chip | Structure optique integree a parties conductrices de l'electricite |
US6967640B2 (en) * | 2001-07-27 | 2005-11-22 | E Ink Corporation | Microencapsulated electrophoretic display with integrated driver |
FR2832224B1 (fr) * | 2001-11-15 | 2004-01-16 | Commissariat Energie Atomique | Dispositif electronique monolithique multicouches et procede de realisation d'un tel dispositif |
DE10202277A1 (de) * | 2002-01-22 | 2003-07-31 | Siemens Ag | Elektrisch-optischer Schaltungsträger und Verfahren zu dessen Herstellung |
US6907178B2 (en) * | 2002-06-13 | 2005-06-14 | Steve Lerner | Optoelectronic assembly with embedded optical and electrical components |
GB0329516D0 (en) * | 2003-12-19 | 2004-01-28 | Univ Kent Canterbury | Integrated circuit with debug support interface |
US7369718B2 (en) * | 2004-01-23 | 2008-05-06 | Intel Corporation | Package substrate pattern to accommodate optical waveguide |
WO2006014582A2 (en) * | 2004-07-08 | 2006-02-09 | Dow Corning Corporation | Short reach optical interconnect |
US20060024060A1 (en) * | 2004-07-30 | 2006-02-02 | Roth Weston C | Apparatus and method for optical interconnects on a carrier substrate |
US7492982B2 (en) * | 2006-02-06 | 2009-02-17 | Samsung Electronics Co., Ltd. | Optical module |
US7486847B1 (en) | 2008-03-31 | 2009-02-03 | International Business Machines Corporation | Chip carrier package with optical vias |
US8346039B2 (en) * | 2008-11-05 | 2013-01-01 | Rochester Institute Of Technology | Methods for three-dimensional nanofocusing of light and systems thereof |
JP5267426B2 (ja) * | 2009-11-04 | 2013-08-21 | 住友ベークライト株式会社 | 光素子搭載基板、光電気混載基板および電子機器 |
JP5495896B2 (ja) * | 2010-03-30 | 2014-05-21 | 京セラ株式会社 | 光電気配線基板の製造方法 |
CN103135182B (zh) * | 2011-12-02 | 2016-09-14 | 鸿富锦精密工业(深圳)有限公司 | 光学元件封装结构及其封装方法 |
TWI575275B (zh) * | 2012-12-21 | 2017-03-21 | 鴻海精密工業股份有限公司 | 光學通訊模組 |
CN103885135A (zh) * | 2012-12-22 | 2014-06-25 | 鸿富锦精密工业(深圳)有限公司 | 光学通讯装置 |
JP6286853B2 (ja) * | 2013-04-04 | 2018-03-07 | 富士通株式会社 | 電子装置とその製造方法、及び電子機器 |
CN104166188B (zh) * | 2013-05-16 | 2017-07-21 | 赛恩倍吉科技顾问(深圳)有限公司 | 光通讯装置 |
JP6168602B2 (ja) * | 2013-10-31 | 2017-07-26 | 日東電工株式会社 | 光電気混載モジュール |
US9854687B2 (en) * | 2014-08-13 | 2017-12-26 | Finisar Corporation | Multi-layer substrates including thin film signal lines |
US9848498B2 (en) | 2014-08-13 | 2017-12-19 | Finisar Corporation | Optoelectronic subassembly with components mounted on top and bottom of substrate |
EP3213132A1 (en) * | 2014-10-28 | 2017-09-06 | Finisar Corporation | Multi-layer substrates |
US9389362B1 (en) * | 2015-11-16 | 2016-07-12 | International Business Machines Corporation | Adaptive optical interconnection of components of an electro-optical circuit |
CN106980159B (zh) * | 2017-03-07 | 2019-01-22 | 中国科学院微电子研究所 | 基于光电混合集成的光电模块封装结构 |
IT201800005891A1 (it) * | 2018-05-31 | 2019-12-01 | Procedimento per realizzare un dispositivo per accoppiamento adiabatico, dispositivo e sistema corrispondenti | |
CN116263524A (zh) * | 2021-12-13 | 2023-06-16 | 中兴通讯股份有限公司 | 一种光连接器及其制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1986002172A1 (en) | 1984-09-28 | 1986-04-10 | American Telephone & Telegraph Company | Optical waveguide lateral alignment arrangement |
DE3669401D1 (en) | 1985-10-16 | 1990-04-12 | British Telecomm | Fabry-perot-interferometer. |
US5292620A (en) * | 1988-01-15 | 1994-03-08 | E. I. Du Pont De Nemours And Company | Optical waveguide devices, elements for making the devices and methods of making the devices and elements |
US5077878A (en) | 1990-07-11 | 1992-01-07 | Gte Laboratories Incorporated | Method and device for passive alignment of diode lasers and optical fibers |
US5125054A (en) * | 1991-07-25 | 1992-06-23 | Motorola, Inc. | Laminated polymer optical waveguide interface and method of making same |
JPH05173046A (ja) | 1991-12-20 | 1993-07-13 | Sony Corp | 光導波路装置 |
US5656507A (en) | 1992-01-28 | 1997-08-12 | British Telecommunications Public Limited Company | Process for self-aligning circuit components brought into abutment by surface tension of a molten material and bonding under tension |
DE4206328A1 (de) * | 1992-02-29 | 1993-09-02 | Sel Alcatel Ag | Verfahren zur herstellung optoelektronischer bauelemente |
US5917980A (en) * | 1992-03-06 | 1999-06-29 | Fujitsu Limited | Optical circuit device, its manufacturing process and a multilayer optical circuit using said optical circuit device |
US5271083A (en) * | 1992-07-27 | 1993-12-14 | Motorola, Inc. | Molded optical waveguide with contacts utilizing leadframes and method of making same |
US5388174A (en) | 1993-02-22 | 1995-02-07 | At&T Corp. | Optical fiber connector techniques |
JP3484543B2 (ja) * | 1993-03-24 | 2004-01-06 | 富士通株式会社 | 光結合部材の製造方法及び光装置 |
US5544268A (en) * | 1994-09-09 | 1996-08-06 | Deacon Research | Display panel with electrically-controlled waveguide-routing |
US5659648A (en) | 1995-09-29 | 1997-08-19 | Motorola, Inc. | Polyimide optical waveguide having electrical conductivity |
KR100219712B1 (ko) * | 1997-02-26 | 1999-09-01 | 윤종용 | 저손실 능동광소자 및 그 제조방법 |
US5974214A (en) * | 1997-04-08 | 1999-10-26 | Alliedsignal Inc. | Raised rib waveguide ribbon for precision optical interconnects |
US5887116A (en) * | 1997-06-11 | 1999-03-23 | The United States Of America As Represented By The Secretary Of The Air Force | Integrated circuit compatible electro-optic device using conductive polymer cladding layers |
-
1998
- 1998-03-06 SE SE9800757A patent/SE513858C2/sv not_active IP Right Cessation
-
1999
- 1999-03-05 US US09/263,521 patent/US6343164B1/en not_active Expired - Fee Related
- 1999-03-08 AU AU31780/99A patent/AU3178099A/en not_active Abandoned
- 1999-03-08 KR KR1020007009740A patent/KR20010041556A/ko not_active Application Discontinuation
- 1999-03-08 JP JP2000534898A patent/JP2002506223A/ja active Pending
- 1999-03-08 CA CA002322314A patent/CA2322314A1/en not_active Abandoned
- 1999-03-08 EP EP99913786A patent/EP1070269A2/en not_active Withdrawn
- 1999-03-08 WO PCT/SE1999/000349 patent/WO1999045416A2/en not_active Application Discontinuation
- 1999-03-08 CN CNB998057800A patent/CN1154858C/zh not_active Expired - Fee Related
- 1999-03-22 TW TW088104491A patent/TW430747B/zh not_active IP Right Cessation
-
2001
- 2001-12-04 HK HK01108507A patent/HK1037929A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2322314A1 (en) | 1999-09-10 |
SE513858C2 (sv) | 2000-11-13 |
AU3178099A (en) | 1999-09-20 |
SE9800757D0 (sv) | 1998-03-06 |
CN1154858C (zh) | 2004-06-23 |
WO1999045416A2 (en) | 1999-09-10 |
EP1070269A2 (en) | 2001-01-24 |
HK1037929A1 (en) | 2002-02-22 |
JP2002506223A (ja) | 2002-02-26 |
CN1299471A (zh) | 2001-06-13 |
KR20010041556A (ko) | 2001-05-25 |
WO1999045416A3 (en) | 2000-01-06 |
US6343164B1 (en) | 2002-01-29 |
TW430747B (en) | 2001-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |