SE9800757D0 - Optoelectric multichip module - Google Patents

Optoelectric multichip module

Info

Publication number
SE9800757D0
SE9800757D0 SE9800757A SE9800757A SE9800757D0 SE 9800757 D0 SE9800757 D0 SE 9800757D0 SE 9800757 A SE9800757 A SE 9800757A SE 9800757 A SE9800757 A SE 9800757A SE 9800757 D0 SE9800757 D0 SE 9800757D0
Authority
SE
Sweden
Prior art keywords
layers
optical
polymer layers
optical waveguides
thin
Prior art date
Application number
SE9800757A
Other languages
English (en)
Other versions
SE9800757L (sv
SE513858C2 (sv
Inventor
Mats Robertsson
Olle-Jonny Hagel
Goeran Gustafsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9800757A priority Critical patent/SE513858C2/sv
Publication of SE9800757D0 publication Critical patent/SE9800757D0/sv
Priority to US09/263,521 priority patent/US6343164B1/en
Priority to KR1020007009740A priority patent/KR20010041556A/ko
Priority to EP99913786A priority patent/EP1070269A2/en
Priority to CNB998057800A priority patent/CN1154858C/zh
Priority to AU31780/99A priority patent/AU3178099A/en
Priority to JP2000534898A priority patent/JP2002506223A/ja
Priority to CA002322314A priority patent/CA2322314A1/en
Priority to PCT/SE1999/000349 priority patent/WO1999045416A2/en
Priority to TW088104491A priority patent/TW430747B/zh
Publication of SE9800757L publication Critical patent/SE9800757L/sv
Publication of SE513858C2 publication Critical patent/SE513858C2/sv
Priority to HK01108507A priority patent/HK1037929A1/xx

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12104—Mirror; Reflectors or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
SE9800757A 1998-03-06 1998-03-06 Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler SE513858C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE9800757A SE513858C2 (sv) 1998-03-06 1998-03-06 Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler
US09/263,521 US6343164B1 (en) 1998-03-06 1999-03-05 Optoelectric multichip module
PCT/SE1999/000349 WO1999045416A2 (en) 1998-03-06 1999-03-08 Optoelectric multichip module
CNB998057800A CN1154858C (zh) 1998-03-06 1999-03-08 光电多芯片模块
EP99913786A EP1070269A2 (en) 1998-03-06 1999-03-08 Optoelectric multichip module
KR1020007009740A KR20010041556A (ko) 1998-03-06 1999-03-08 광전 다중칩 모듈
AU31780/99A AU3178099A (en) 1998-03-06 1999-03-08 Optoelectric multichip module
JP2000534898A JP2002506223A (ja) 1998-03-06 1999-03-08 光電子マルチチップ・モジュール
CA002322314A CA2322314A1 (en) 1998-03-06 1999-03-08 Optoelectric multichip module
TW088104491A TW430747B (en) 1998-03-06 1999-03-22 Optoelectric multichip module
HK01108507A HK1037929A1 (en) 1998-03-06 2001-12-04 Optoelectric multichip module.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9800757A SE513858C2 (sv) 1998-03-06 1998-03-06 Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler

Publications (3)

Publication Number Publication Date
SE9800757D0 true SE9800757D0 (sv) 1998-03-06
SE9800757L SE9800757L (sv) 1999-09-07
SE513858C2 SE513858C2 (sv) 2000-11-13

Family

ID=20410471

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9800757A SE513858C2 (sv) 1998-03-06 1998-03-06 Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler

Country Status (11)

Country Link
US (1) US6343164B1 (sv)
EP (1) EP1070269A2 (sv)
JP (1) JP2002506223A (sv)
KR (1) KR20010041556A (sv)
CN (1) CN1154858C (sv)
AU (1) AU3178099A (sv)
CA (1) CA2322314A1 (sv)
HK (1) HK1037929A1 (sv)
SE (1) SE513858C2 (sv)
TW (1) TW430747B (sv)
WO (1) WO1999045416A2 (sv)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1093600B1 (en) * 1998-07-08 2004-09-15 E Ink Corporation Methods for achieving improved color in microencapsulated electrophoretic devices
WO2001007961A1 (en) * 1999-07-21 2001-02-01 E Ink Corporation Use of a storage capacitor to enhance the performance of an active matrix driven electronic display
JP2003531487A (ja) * 2000-04-18 2003-10-21 イー−インク コーポレイション 薄膜トランジスタを製造するためのプロセス
US7893435B2 (en) * 2000-04-18 2011-02-22 E Ink Corporation Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough
US7034775B2 (en) * 2001-03-26 2006-04-25 Seiko Epson Corporation Display device and method for manufacturing the same
FR2824920B1 (fr) 2001-05-15 2003-10-17 Opsitech Optical Sys On A Chip Structure optique integree a parties conductrices de l'electricite
US6967640B2 (en) * 2001-07-27 2005-11-22 E Ink Corporation Microencapsulated electrophoretic display with integrated driver
FR2832224B1 (fr) * 2001-11-15 2004-01-16 Commissariat Energie Atomique Dispositif electronique monolithique multicouches et procede de realisation d'un tel dispositif
DE10202277A1 (de) * 2002-01-22 2003-07-31 Siemens Ag Elektrisch-optischer Schaltungsträger und Verfahren zu dessen Herstellung
US6907178B2 (en) * 2002-06-13 2005-06-14 Steve Lerner Optoelectronic assembly with embedded optical and electrical components
GB0329516D0 (en) * 2003-12-19 2004-01-28 Univ Kent Canterbury Integrated circuit with debug support interface
US7369718B2 (en) * 2004-01-23 2008-05-06 Intel Corporation Package substrate pattern to accommodate optical waveguide
KR101111473B1 (ko) * 2004-07-08 2012-02-21 겜파이어 코포레이션 단거리 광 상호접속 장치
US20060024060A1 (en) * 2004-07-30 2006-02-02 Roth Weston C Apparatus and method for optical interconnects on a carrier substrate
US7492982B2 (en) * 2006-02-06 2009-02-17 Samsung Electronics Co., Ltd. Optical module
US7486847B1 (en) 2008-03-31 2009-02-03 International Business Machines Corporation Chip carrier package with optical vias
US8346039B2 (en) * 2008-11-05 2013-01-01 Rochester Institute Of Technology Methods for three-dimensional nanofocusing of light and systems thereof
JP5267426B2 (ja) * 2009-11-04 2013-08-21 住友ベークライト株式会社 光素子搭載基板、光電気混載基板および電子機器
JP5495896B2 (ja) * 2010-03-30 2014-05-21 京セラ株式会社 光電気配線基板の製造方法
CN103135182B (zh) * 2011-12-02 2016-09-14 鸿富锦精密工业（深圳）有限公司 光学元件封装结构及其封装方法
TWI575275B (zh) * 2012-12-21 2017-03-21 鴻海精密工業股份有限公司 光學通訊模組
CN103885135A (zh) * 2012-12-22 2014-06-25 鸿富锦精密工业（深圳）有限公司 光学通讯装置
JP6286853B2 (ja) * 2013-04-04 2018-03-07 富士通株式会社 電子装置とその製造方法、及び電子機器
CN104166188B (zh) * 2013-05-16 2017-07-21 赛恩倍吉科技顾问（深圳）有限公司 光通讯装置
JP6168602B2 (ja) * 2013-10-31 2017-07-26 日東電工株式会社 光電気混載モジュール
US9854687B2 (en) * 2014-08-13 2017-12-26 Finisar Corporation Multi-layer substrates including thin film signal lines
US9848498B2 (en) 2014-08-13 2017-12-19 Finisar Corporation Optoelectronic subassembly with components mounted on top and bottom of substrate
WO2016069786A1 (en) * 2014-10-28 2016-05-06 Finisar Corporation Multi-layer substrates
US9389362B1 (en) * 2015-11-16 2016-07-12 International Business Machines Corporation Adaptive optical interconnection of components of an electro-optical circuit
CN106980159B (zh) * 2017-03-07 2019-01-22 中国科学院微电子研究所 基于光电混合集成的光电模块封装结构
IT201800005891A1 (it) 2018-05-31 2019-12-01 Procedimento per realizzare un dispositivo per accoppiamento adiabatico, dispositivo e sistema corrispondenti
CN116263524A (zh) * 2021-12-13 2023-06-16 中兴通讯股份有限公司 一种光连接器及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62500471A (ja) 1984-09-28 1987-02-26 アメリカン テレフオン アンド テレグラフ カムパニ− 光導波管の横方向整合装置
EP0219359B1 (en) 1985-10-16 1990-03-07 BRITISH TELECOMMUNICATIONS public limited company Fabry-perot interferometer
US5292620A (en) * 1988-01-15 1994-03-08 E. I. Du Pont De Nemours And Company Optical waveguide devices, elements for making the devices and methods of making the devices and elements
US5077878A (en) 1990-07-11 1992-01-07 Gte Laboratories Incorporated Method and device for passive alignment of diode lasers and optical fibers
US5125054A (en) * 1991-07-25 1992-06-23 Motorola, Inc. Laminated polymer optical waveguide interface and method of making same
JPH05173046A (ja) 1991-12-20 1993-07-13 Sony Corp 光導波路装置
WO1993015424A1 (en) 1992-01-28 1993-08-05 British Telecommunications Public Limited Company Alignment of integrated optical components
DE4206328A1 (de) * 1992-02-29 1993-09-02 Sel Alcatel Ag Verfahren zur herstellung optoelektronischer bauelemente
US5917980A (en) * 1992-03-06 1999-06-29 Fujitsu Limited Optical circuit device, its manufacturing process and a multilayer optical circuit using said optical circuit device
US5271083A (en) * 1992-07-27 1993-12-14 Motorola, Inc. Molded optical waveguide with contacts utilizing leadframes and method of making same
US5388174A (en) 1993-02-22 1995-02-07 At&T Corp. Optical fiber connector techniques
JP3484543B2 (ja) * 1993-03-24 2004-01-06 富士通株式会社 光結合部材の製造方法及び光装置
US5544268A (en) * 1994-09-09 1996-08-06 Deacon Research Display panel with electrically-controlled waveguide-routing
US5659648A (en) 1995-09-29 1997-08-19 Motorola, Inc. Polyimide optical waveguide having electrical conductivity
KR100219712B1 (ko) * 1997-02-26 1999-09-01 윤종용 저손실 능동광소자 및 그 제조방법
US5974214A (en) * 1997-04-08 1999-10-26 Alliedsignal Inc. Raised rib waveguide ribbon for precision optical interconnects
US5887116A (en) * 1997-06-11 1999-03-23 The United States Of America As Represented By The Secretary Of The Air Force Integrated circuit compatible electro-optic device using conductive polymer cladding layers

Also Published As

Publication number Publication date
CN1299471A (zh) 2001-06-13
CA2322314A1 (en) 1999-09-10
TW430747B (en) 2001-04-21
WO1999045416A3 (en) 2000-01-06
CN1154858C (zh) 2004-06-23
JP2002506223A (ja) 2002-02-26
HK1037929A1 (en) 2002-02-22
EP1070269A2 (en) 2001-01-24
SE9800757L (sv) 1999-09-07
WO1999045416A2 (en) 1999-09-10
US6343164B1 (en) 2002-01-29
AU3178099A (en) 1999-09-20
KR20010041556A (ko) 2001-05-25
SE513858C2 (sv) 2000-11-13

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