SE8102651L - Halvledaranordning - Google Patents
HalvledaranordningInfo
- Publication number
- SE8102651L SE8102651L SE8102651A SE8102651A SE8102651L SE 8102651 L SE8102651 L SE 8102651L SE 8102651 A SE8102651 A SE 8102651A SE 8102651 A SE8102651 A SE 8102651A SE 8102651 L SE8102651 L SE 8102651L
- Authority
- SE
- Sweden
- Prior art keywords
- devices
- semiconductor device
- breakdown voltage
- sipos
- alloying
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 230000015556 catabolic process Effects 0.000 abstract 2
- 238000005275 alloying Methods 0.000 abstract 1
- 238000000137 annealing Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/905—Plural dram cells share common contact or common trench
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/958—Passivation layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/146,380 US4297149A (en) | 1980-05-05 | 1980-05-05 | Method of treating SiPOS passivated high voltage semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SE8102651L true SE8102651L (sv) | 1981-11-06 |
Family
ID=22517112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8102651A SE8102651L (sv) | 1980-05-05 | 1981-04-27 | Halvledaranordning |
Country Status (6)
Country | Link |
---|---|
US (1) | US4297149A (sv) |
JP (1) | JPS572529A (sv) |
DE (1) | DE3116998A1 (sv) |
IT (1) | IT1137677B (sv) |
SE (1) | SE8102651L (sv) |
YU (1) | YU108981A (sv) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4349408A (en) * | 1981-03-26 | 1982-09-14 | Rca Corporation | Method of depositing a refractory metal on a semiconductor substrate |
US4516145A (en) * | 1983-08-31 | 1985-05-07 | Storage Technology Partners | Reduction of contact resistance in CMOS integrated circuit chips and the product thereof |
US4580156A (en) * | 1983-12-30 | 1986-04-01 | At&T Bell Laboratories | Structured resistive field shields for low-leakage high voltage devices |
USH665H (en) | 1987-10-19 | 1989-08-01 | Bell Telephone Laboratories, Incorporated | Resistive field shields for high voltage devices |
US5374843A (en) * | 1991-05-06 | 1994-12-20 | Silinconix, Inc. | Lightly-doped drain MOSFET with improved breakdown characteristics |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE300472B (sv) * | 1965-03-31 | 1968-04-29 | Asea Ab | |
US3674995A (en) * | 1970-08-31 | 1972-07-04 | Texas Instruments Inc | Computer controlled device testing and subsequent arbitrary adjustment of device characteristics |
JPS523277B2 (sv) * | 1973-05-19 | 1977-01-27 | ||
JPS541431B2 (sv) * | 1973-12-26 | 1979-01-24 |
-
1980
- 1980-05-05 US US06/146,380 patent/US4297149A/en not_active Expired - Lifetime
-
1981
- 1981-04-08 IT IT20995/81A patent/IT1137677B/it active
- 1981-04-27 YU YU01089/81A patent/YU108981A/xx unknown
- 1981-04-27 SE SE8102651A patent/SE8102651L/sv not_active Application Discontinuation
- 1981-04-29 DE DE19813116998 patent/DE3116998A1/de not_active Withdrawn
- 1981-04-30 JP JP6680881A patent/JPS572529A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US4297149A (en) | 1981-10-27 |
YU108981A (en) | 1983-09-30 |
IT8120995A1 (it) | 1982-10-08 |
JPS572529A (en) | 1982-01-07 |
DE3116998A1 (de) | 1982-02-04 |
IT8120995A0 (it) | 1981-04-08 |
IT1137677B (it) | 1986-09-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 8102651-0 |