SE7611555L - Ljusavgivande indikatoranordning - Google Patents

Ljusavgivande indikatoranordning

Info

Publication number
SE7611555L
SE7611555L SE7611555A SE7611555A SE7611555L SE 7611555 L SE7611555 L SE 7611555L SE 7611555 A SE7611555 A SE 7611555A SE 7611555 A SE7611555 A SE 7611555A SE 7611555 L SE7611555 L SE 7611555L
Authority
SE
Sweden
Prior art keywords
contacts
elongated
light emission
indicator device
base
Prior art date
Application number
SE7611555A
Other languages
English (en)
Other versions
SE409261B (sv
Inventor
C R Fegley
F J Valentino
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7611555L publication Critical patent/SE7611555L/sv
Publication of SE409261B publication Critical patent/SE409261B/sv

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
SE7611555A 1975-10-31 1976-10-18 Ljusemitterande indikatoranordning SE409261B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62780675A 1975-10-31 1975-10-31
US05/695,331 US4054814A (en) 1975-10-31 1976-06-14 Electroluminescent display and method of making

Publications (2)

Publication Number Publication Date
SE7611555L true SE7611555L (sv) 1977-05-01
SE409261B SE409261B (sv) 1979-08-06

Family

ID=27090536

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7611555A SE409261B (sv) 1975-10-31 1976-10-18 Ljusemitterande indikatoranordning

Country Status (13)

Country Link
US (1) US4054814A (sv)
JP (1) JPS5831737B2 (sv)
AU (1) AU500727B2 (sv)
CA (1) CA1063216A (sv)
DE (1) DE2648979C3 (sv)
ES (1) ES452842A1 (sv)
FR (1) FR2330105A1 (sv)
GB (1) GB1554600A (sv)
HK (1) HK28180A (sv)
IT (1) IT1075867B (sv)
MY (1) MY8100019A (sv)
NL (1) NL174307C (sv)
SE (1) SE409261B (sv)

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US4394602A (en) * 1981-11-25 1983-07-19 Western Electric Co., Inc. Enclosed electrical devices
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JPS59165472A (ja) * 1983-03-09 1984-09-18 Idec Izumi Corp 発光ダイオ−ドランプ用リ−ド基板
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US20030133292A1 (en) 1999-11-18 2003-07-17 Mueller George G. Methods and apparatus for generating and modulating white light illumination conditions
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US7642730B2 (en) * 2000-04-24 2010-01-05 Philips Solid-State Lighting Solutions, Inc. Methods and apparatus for conveying information via color of light
US7320632B2 (en) * 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
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US7202613B2 (en) 2001-05-30 2007-04-10 Color Kinetics Incorporated Controlled lighting methods and apparatus
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US7042172B2 (en) 2000-09-01 2006-05-09 Color Kinetics Incorporated Systems and methods for providing illumination in machine vision systems
US7303300B2 (en) 2000-09-27 2007-12-04 Color Kinetics Incorporated Methods and systems for illuminating household products
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US7300192B2 (en) 2002-10-03 2007-11-27 Color Kinetics Incorporated Methods and apparatus for illuminating environments
US20080102726A2 (en) * 2003-03-12 2008-05-01 Balu Jeganathan Lamp and a process for producing a lamp
US7178941B2 (en) 2003-05-05 2007-02-20 Color Kinetics Incorporated Lighting methods and systems
JP2006286699A (ja) * 2005-03-31 2006-10-19 Toyoda Gosei Co Ltd Ledランプ装置及びその製造方法。
JP4946363B2 (ja) * 2005-12-07 2012-06-06 豊田合成株式会社 Ledランプ装置およびledランプ装置用のメタル基板パッケージ
US10321528B2 (en) 2007-10-26 2019-06-11 Philips Lighting Holding B.V. Targeted content delivery using outdoor lighting networks (OLNs)
US8118447B2 (en) * 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
US7712918B2 (en) * 2007-12-21 2010-05-11 Altair Engineering , Inc. Light distribution using a light emitting diode assembly
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Also Published As

Publication number Publication date
DE2648979C3 (de) 1981-05-07
MY8100019A (en) 1981-12-31
NL174307B (nl) 1983-12-16
JPS5831737B2 (ja) 1983-07-08
AU500727B2 (en) 1979-05-31
IT1075867B (it) 1985-04-22
NL174307C (nl) 1984-05-16
JPS5257797A (en) 1977-05-12
GB1554600A (en) 1979-10-24
DE2648979A1 (de) 1977-05-12
DE2648979B2 (de) 1980-01-10
CA1063216A (en) 1979-09-25
US4054814A (en) 1977-10-18
FR2330105A1 (fr) 1977-05-27
NL7611797A (nl) 1977-05-03
SE409261B (sv) 1979-08-06
ES452842A1 (es) 1978-01-16
HK28180A (en) 1980-05-30
FR2330105B1 (sv) 1981-07-31
AU1904076A (en) 1978-05-04

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