FR2330105A1 - Dispositif d'affichage a emission de lumiere - Google Patents

Dispositif d'affichage a emission de lumiere

Info

Publication number
FR2330105A1
FR2330105A1 FR7632397A FR7632397A FR2330105A1 FR 2330105 A1 FR2330105 A1 FR 2330105A1 FR 7632397 A FR7632397 A FR 7632397A FR 7632397 A FR7632397 A FR 7632397A FR 2330105 A1 FR2330105 A1 FR 2330105A1
Authority
FR
France
Prior art keywords
display device
light emission
emission display
light
emission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7632397A
Other languages
English (en)
Other versions
FR2330105B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2330105A1 publication Critical patent/FR2330105A1/fr
Application granted granted Critical
Publication of FR2330105B1 publication Critical patent/FR2330105B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
FR7632397A 1975-10-31 1976-10-27 Dispositif d'affichage a emission de lumiere Granted FR2330105A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62780675A 1975-10-31 1975-10-31
US05/695,331 US4054814A (en) 1975-10-31 1976-06-14 Electroluminescent display and method of making

Publications (2)

Publication Number Publication Date
FR2330105A1 true FR2330105A1 (fr) 1977-05-27
FR2330105B1 FR2330105B1 (fr) 1981-07-31

Family

ID=27090536

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7632397A Granted FR2330105A1 (fr) 1975-10-31 1976-10-27 Dispositif d'affichage a emission de lumiere

Country Status (13)

Country Link
US (1) US4054814A (fr)
JP (1) JPS5831737B2 (fr)
AU (1) AU500727B2 (fr)
CA (1) CA1063216A (fr)
DE (1) DE2648979C3 (fr)
ES (1) ES452842A1 (fr)
FR (1) FR2330105A1 (fr)
GB (1) GB1554600A (fr)
HK (1) HK28180A (fr)
IT (1) IT1075867B (fr)
MY (1) MY8100019A (fr)
NL (1) NL174307C (fr)
SE (1) SE409261B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078037A2 (fr) * 1981-10-23 1983-05-04 Izumi Denki Corporation Lampe à diodes électroluminescentes et son procédé de fabrication
EP0107480A2 (fr) * 1982-10-21 1984-05-02 Idec Izumi Corporation Lampe à diode émettrice de lumière et procédé pour sa fabrication
EP0755083A2 (fr) * 1995-07-19 1997-01-22 Preh-Werke GmbH & Co. KG Boîtier pour LED avec connecteur à fiches et résistance shunt et méthode de fabrication

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US4157486A (en) * 1977-12-19 1979-06-05 Western Electric Company, Inc. Electroluminescent display and circuit protective device and method of making
US4179032A (en) * 1978-09-11 1979-12-18 Western Electric Co., Inc. Methods of and apparatus for conveying, orienting, testing and sorting articles
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JPS582080A (ja) * 1981-06-29 1983-01-07 Nippon Denyo Kk Ｌｅｄランプ
JPS582079A (ja) * 1981-06-29 1983-01-07 Nippon Denyo Kk Ｌｅｄランプ及びその製法
US4394602A (en) * 1981-11-25 1983-07-19 Western Electric Co., Inc. Enclosed electrical devices
JPS59165472A (ja) * 1983-03-09 1984-09-18 Idec Izumi Corp 発光ダイオ−ドランプ用リ−ド基板
JPS62202574A (ja) * 1987-02-19 1987-09-07 Nippon Denyo Kk Ｌｅｄランプ及びその製法
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US20040052076A1 (en) 1997-08-26 2004-03-18 Mueller George G. Controlled lighting methods and apparatus
US6936978B2 (en) 1997-08-26 2005-08-30 Color Kinetics Incorporated Methods and apparatus for remotely controlled illumination of liquids
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US6965205B2 (en) 1997-08-26 2005-11-15 Color Kinetics Incorporated Light emitting diode based products
US6869204B2 (en) 1997-08-26 2005-03-22 Color Kinetics Incorporated Light fixtures for illumination of liquids
US6548967B1 (en) 1997-08-26 2003-04-15 Color Kinetics, Inc. Universal lighting network methods and systems
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US7642730B2 (en) * 2000-04-24 2010-01-05 Philips Solid-State Lighting Solutions, Inc. Methods and apparatus for conveying information via color of light
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US7303300B2 (en) 2000-09-27 2007-12-04 Color Kinetics Incorporated Methods and systems for illuminating household products
US7038399B2 (en) 2001-03-13 2006-05-02 Color Kinetics Incorporated Methods and apparatus for providing power to lighting devices
US6801003B2 (en) 2001-03-13 2004-10-05 Color Kinetics, Incorporated Systems and methods for synchronizing lighting effects
US7598684B2 (en) 2001-05-30 2009-10-06 Philips Solid-State Lighting Solutions, Inc. Methods and apparatus for controlling devices in a networked lighting system
US7358679B2 (en) 2002-05-09 2008-04-15 Philips Solid-State Lighting Solutions, Inc. Dimmable LED-based MR16 lighting apparatus and methods
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US7300192B2 (en) 2002-10-03 2007-11-27 Color Kinetics Incorporated Methods and apparatus for illuminating environments
US20080102726A2 (en) * 2003-03-12 2008-05-01 Balu Jeganathan Lamp and a process for producing a lamp
US7178941B2 (en) 2003-05-05 2007-02-20 Color Kinetics Incorporated Lighting methods and systems
JP2006286699A (ja) * 2005-03-31 2006-10-19 Toyoda Gosei Co Ltd Ｌｅｄランプ装置及びその製造方法。
JP4946363B2 (ja) * 2005-12-07 2012-06-06 豊田合成株式会社 Ｌｅｄランプ装置およびｌｅｄランプ装置用のメタル基板パッケージ
US10321528B2 (en) 2007-10-26 2019-06-11 Philips Lighting Holding B.V. Targeted content delivery using outdoor lighting networks (OLNs)
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US7712918B2 (en) * 2007-12-21 2010-05-11 Altair Engineering , Inc. Light distribution using a light emitting diode assembly
DE102008013031B4 (de) * 2008-03-07 2019-07-25 Osram Oled Gmbh Optoelektronisches Bauelement
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US8360599B2 (en) * 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US7976196B2 (en) * 2008-07-09 2011-07-12 Altair Engineering, Inc. Method of forming LED-based light and resulting LED-based light
US7946729B2 (en) * 2008-07-31 2011-05-24 Altair Engineering, Inc. Fluorescent tube replacement having longitudinally oriented LEDs
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078037A2 (fr) * 1981-10-23 1983-05-04 Izumi Denki Corporation Lampe à diodes électroluminescentes et son procédé de fabrication
EP0078037A3 (en) * 1981-10-23 1985-07-03 Izumi Denki Corporation Light emission diode lamp and method for producing thereof
EP0107480A2 (fr) * 1982-10-21 1984-05-02 Idec Izumi Corporation Lampe à diode émettrice de lumière et procédé pour sa fabrication
EP0107480A3 (fr) * 1982-10-21 1986-07-16 Idec Izumi Corporation Lampe à diode émettrice de lumière et procédé pour sa fabrication
EP0755083A2 (fr) * 1995-07-19 1997-01-22 Preh-Werke GmbH & Co. KG Boîtier pour LED avec connecteur à fiches et résistance shunt et méthode de fabrication
EP0755083A3 (fr) * 1995-07-19 1999-10-06 Preh-Werke GmbH & Co. KG Boítier pour LED avec connecteur à fiches et résistance shunt et méthode de fabrication

Also Published As

Publication number Publication date
DE2648979C3 (de) 1981-05-07
MY8100019A (en) 1981-12-31
NL174307B (nl) 1983-12-16
JPS5831737B2 (ja) 1983-07-08
SE7611555L (sv) 1977-05-01
AU500727B2 (en) 1979-05-31
IT1075867B (it) 1985-04-22
NL174307C (nl) 1984-05-16
JPS5257797A (en) 1977-05-12
GB1554600A (en) 1979-10-24
DE2648979A1 (de) 1977-05-12
DE2648979B2 (de) 1980-01-10
CA1063216A (fr) 1979-09-25
US4054814A (en) 1977-10-18
NL7611797A (nl) 1977-05-03
SE409261B (sv) 1979-08-06
ES452842A1 (es) 1978-01-16
HK28180A (en) 1980-05-30
FR2330105B1 (fr) 1981-07-31
AU1904076A (en) 1978-05-04

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