JPS57177578A - Led lamp and manufacture thereof - Google Patents
Led lamp and manufacture thereofInfo
- Publication number
- JPS57177578A JPS57177578A JP56061490A JP6149081A JPS57177578A JP S57177578 A JPS57177578 A JP S57177578A JP 56061490 A JP56061490 A JP 56061490A JP 6149081 A JP6149081 A JP 6149081A JP S57177578 A JPS57177578 A JP S57177578A
- Authority
- JP
- Japan
- Prior art keywords
- bowl
- led lamp
- support
- behind
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
PURPOSE:To take out light emission from a chip with high efficiency, by constituting a bowl of resin mixed with reflection agent with a lead terminal surface for chip bonding exposed on an internal bottom surface in an LED lamp mounted with the LED chip mounted on the bowl thereof. CONSTITUTION:The LED lamp body 10 is constituted of the bowl 11 having a light guide part 20 on the top end thereof and a columnar insulating joint support 12 positioned behind thereof. External connecting joints 13 and 14 projected behind of the support are provided on the support 12, and an arrow-head insulating guide 15 is provided behind the joints with external lead wires 16 and 17 therein. In this constitution, the body 10 is formed of epoxy thermosetting resin mixed with 5% or more of reflection agent, e.g. TiO2, Al2O3 with a plurality of diodes D1-D4 fixed on the guide part side 20 of the bowl 11. Thereafter, this bowl 11 is inserted into a socket not illustrated here.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56061490A JPS57177578A (en) | 1981-04-24 | 1981-04-24 | Led lamp and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56061490A JPS57177578A (en) | 1981-04-24 | 1981-04-24 | Led lamp and manufacture thereof |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62034568A Division JPS62202574A (en) | 1987-02-19 | 1987-02-19 | Led lamp and manufacture of the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57177578A true JPS57177578A (en) | 1982-11-01 |
Family
ID=13172579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56061490A Pending JPS57177578A (en) | 1981-04-24 | 1981-04-24 | Led lamp and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57177578A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0329382A (en) * | 1989-06-26 | 1991-02-07 | Sharp Corp | Manufacture of led lamp |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5257797A (en) * | 1975-10-31 | 1977-05-12 | Western Electric Co | Light emitting display unit |
-
1981
- 1981-04-24 JP JP56061490A patent/JPS57177578A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5257797A (en) * | 1975-10-31 | 1977-05-12 | Western Electric Co | Light emitting display unit |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0329382A (en) * | 1989-06-26 | 1991-02-07 | Sharp Corp | Manufacture of led lamp |
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