JPS57177578A - Led lamp and manufacture thereof - Google Patents

Led lamp and manufacture thereof

Info

Publication number
JPS57177578A
JPS57177578A JP56061490A JP6149081A JPS57177578A JP S57177578 A JPS57177578 A JP S57177578A JP 56061490 A JP56061490 A JP 56061490A JP 6149081 A JP6149081 A JP 6149081A JP S57177578 A JPS57177578 A JP S57177578A
Authority
JP
Japan
Prior art keywords
bowl
led lamp
support
behind
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56061490A
Other languages
Japanese (ja)
Inventor
Osamu Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIHON DENYOO KK
Nippon Denyo Co Ltd
Original Assignee
NIHON DENYOO KK
Nippon Denyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIHON DENYOO KK, Nippon Denyo Co Ltd filed Critical NIHON DENYOO KK
Priority to JP56061490A priority Critical patent/JPS57177578A/en
Publication of JPS57177578A publication Critical patent/JPS57177578A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To take out light emission from a chip with high efficiency, by constituting a bowl of resin mixed with reflection agent with a lead terminal surface for chip bonding exposed on an internal bottom surface in an LED lamp mounted with the LED chip mounted on the bowl thereof. CONSTITUTION:The LED lamp body 10 is constituted of the bowl 11 having a light guide part 20 on the top end thereof and a columnar insulating joint support 12 positioned behind thereof. External connecting joints 13 and 14 projected behind of the support are provided on the support 12, and an arrow-head insulating guide 15 is provided behind the joints with external lead wires 16 and 17 therein. In this constitution, the body 10 is formed of epoxy thermosetting resin mixed with 5% or more of reflection agent, e.g. TiO2, Al2O3 with a plurality of diodes D1-D4 fixed on the guide part side 20 of the bowl 11. Thereafter, this bowl 11 is inserted into a socket not illustrated here.
JP56061490A 1981-04-24 1981-04-24 Led lamp and manufacture thereof Pending JPS57177578A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56061490A JPS57177578A (en) 1981-04-24 1981-04-24 Led lamp and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56061490A JPS57177578A (en) 1981-04-24 1981-04-24 Led lamp and manufacture thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP62034568A Division JPS62202574A (en) 1987-02-19 1987-02-19 Led lamp and manufacture of the same

Publications (1)

Publication Number Publication Date
JPS57177578A true JPS57177578A (en) 1982-11-01

Family

ID=13172579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56061490A Pending JPS57177578A (en) 1981-04-24 1981-04-24 Led lamp and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS57177578A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329382A (en) * 1989-06-26 1991-02-07 Sharp Corp Manufacture of led lamp

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5257797A (en) * 1975-10-31 1977-05-12 Western Electric Co Light emitting display unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5257797A (en) * 1975-10-31 1977-05-12 Western Electric Co Light emitting display unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329382A (en) * 1989-06-26 1991-02-07 Sharp Corp Manufacture of led lamp

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