FR2330105B1 - - Google Patents

Info

Publication number
FR2330105B1
FR2330105B1 FR7632397A FR7632397A FR2330105B1 FR 2330105 B1 FR2330105 B1 FR 2330105B1 FR 7632397 A FR7632397 A FR 7632397A FR 7632397 A FR7632397 A FR 7632397A FR 2330105 B1 FR2330105 B1 FR 2330105B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7632397A
Other versions
FR2330105A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2330105A1 publication Critical patent/FR2330105A1/fr
Application granted granted Critical
Publication of FR2330105B1 publication Critical patent/FR2330105B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
FR7632397A 1975-10-31 1976-10-27 Dispositif d'affichage a emission de lumiere Granted FR2330105A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62780675A 1975-10-31 1975-10-31
US05/695,331 US4054814A (en) 1975-10-31 1976-06-14 Electroluminescent display and method of making

Publications (2)

Publication Number Publication Date
FR2330105A1 FR2330105A1 (fr) 1977-05-27
FR2330105B1 true FR2330105B1 (fr) 1981-07-31

Family

ID=27090536

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7632397A Granted FR2330105A1 (fr) 1975-10-31 1976-10-27 Dispositif d'affichage a emission de lumiere

Country Status (13)

Country Link
US (1) US4054814A (fr)
JP (1) JPS5831737B2 (fr)
AU (1) AU500727B2 (fr)
CA (1) CA1063216A (fr)
DE (1) DE2648979C3 (fr)
ES (1) ES452842A1 (fr)
FR (1) FR2330105A1 (fr)
GB (1) GB1554600A (fr)
HK (1) HK28180A (fr)
IT (1) IT1075867B (fr)
MY (1) MY8100019A (fr)
NL (1) NL174307C (fr)
SE (1) SE409261B (fr)

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JPS62202574A (ja) * 1987-02-19 1987-09-07 Nippon Denyo Kk Ｌｅｄランプ及びその製法
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US6781329B2 (en) 1997-08-26 2004-08-24 Color Kinetics Incorporated Methods and apparatus for illumination of liquids
US7187141B2 (en) 1997-08-26 2007-03-06 Color Kinetics Incorporated Methods and apparatus for illumination of liquids
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US7202613B2 (en) 2001-05-30 2007-04-10 Color Kinetics Incorporated Controlled lighting methods and apparatus
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US7042172B2 (en) 2000-09-01 2006-05-09 Color Kinetics Incorporated Systems and methods for providing illumination in machine vision systems
US7303300B2 (en) 2000-09-27 2007-12-04 Color Kinetics Incorporated Methods and systems for illuminating household products
US7038399B2 (en) 2001-03-13 2006-05-02 Color Kinetics Incorporated Methods and apparatus for providing power to lighting devices
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Also Published As

Publication number Publication date
SE409261B (sv) 1979-08-06
DE2648979B2 (de) 1980-01-10
JPS5257797A (en) 1977-05-12
GB1554600A (en) 1979-10-24
MY8100019A (en) 1981-12-31
HK28180A (en) 1980-05-30
SE7611555L (sv) 1977-05-01
NL7611797A (nl) 1977-05-03
NL174307C (nl) 1984-05-16
DE2648979C3 (de) 1981-05-07
NL174307B (nl) 1983-12-16
AU1904076A (en) 1978-05-04
FR2330105A1 (fr) 1977-05-27
US4054814A (en) 1977-10-18
IT1075867B (it) 1985-04-22
JPS5831737B2 (ja) 1983-07-08
DE2648979A1 (de) 1977-05-12
ES452842A1 (es) 1978-01-16
CA1063216A (fr) 1979-09-25
AU500727B2 (en) 1979-05-31

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