SE518544C2 - Elektrisk anordning med ett kretskort och förfarande för att passa in anordningen - Google Patents
Elektrisk anordning med ett kretskort och förfarande för att passa in anordningenInfo
- Publication number
- SE518544C2 SE518544C2 SE9802689A SE9802689A SE518544C2 SE 518544 C2 SE518544 C2 SE 518544C2 SE 9802689 A SE9802689 A SE 9802689A SE 9802689 A SE9802689 A SE 9802689A SE 518544 C2 SE518544 C2 SE 518544C2
- Authority
- SE
- Sweden
- Prior art keywords
- housing
- circuit board
- heat
- wall
- cover
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19734110A DE19734110C1 (de) | 1997-08-07 | 1997-08-07 | Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9802689D0 SE9802689D0 (sv) | 1998-08-07 |
SE9802689L SE9802689L (sv) | 1999-02-08 |
SE518544C2 true SE518544C2 (sv) | 2002-10-22 |
Family
ID=7838199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9802689A SE518544C2 (sv) | 1997-08-07 | 1998-08-07 | Elektrisk anordning med ett kretskort och förfarande för att passa in anordningen |
Country Status (4)
Country | Link |
---|---|
US (1) | US6094349A (de) |
JP (1) | JPH11112172A (de) |
DE (1) | DE19734110C1 (de) |
SE (1) | SE518544C2 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10038161A1 (de) * | 2000-08-04 | 2002-02-21 | Infineon Technologies Ag | Kühlvorrichtung für elektronische Bauteile und Verfahren zur Herstellung der Kühlvorrichtung |
FR2822015B1 (fr) * | 2001-03-09 | 2003-04-25 | Valeo Electronique | Boitier electronique sans couvercle d'ouverture |
AT411808B (de) * | 2002-03-25 | 2004-05-25 | Siemens Ag Oesterreich | Elektronisches gerät |
DE10234500A1 (de) * | 2002-07-23 | 2004-02-19 | Siemens Ag | Verfahren zur Wärmeableitung in Mobilfunkgeräten und ein entsprechendes Mobilfunkgerät |
KR100585754B1 (ko) * | 2003-12-18 | 2006-06-07 | 엘지전자 주식회사 | 휴대용 단말기의 키패드 방열장치 |
FR2867014B1 (fr) * | 2004-03-01 | 2006-06-23 | Giga Byte Tech Co Ltd | Procede de dissipation thermique pour un appareil electronique |
US7118646B2 (en) * | 2004-03-15 | 2006-10-10 | Delphi Technologies, Inc. | Method of manufacturing a sealed electronic module |
DE202004012318U1 (de) * | 2004-08-06 | 2005-12-15 | Krauss-Maffei Wegmann Gmbh & Co. Kg | Knoten- oder Verteilerelement für ein CAN-Bussystem zum Einsatz in insbesondere militärischen Fahrzeugen |
US7190589B2 (en) * | 2004-10-19 | 2007-03-13 | Cinch Connectors, Inc. | Electronic control enclosure |
US7248479B2 (en) * | 2005-03-29 | 2007-07-24 | Intel Corporation | Thermal management for hot-swappable module |
US7463485B1 (en) * | 2005-10-28 | 2008-12-09 | Yamaichi Electronics U.S.A., Inc. | Circuit board housing and circuit board assembly |
KR100677620B1 (ko) * | 2005-11-22 | 2007-02-02 | 삼성전자주식회사 | 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기 |
JP2007157568A (ja) * | 2005-12-07 | 2007-06-21 | Mitsubishi Electric Corp | 電子装置 |
DE202006007475U1 (de) * | 2006-05-09 | 2007-09-13 | ICOS Gesellschaft für Industrielle Communications-Systeme mbH | Schalteranordnung für Kommunikations-Datenströme, Schaltermodul für eine derartige Schalteranordnung sowie Kühlanordnung hierfür |
DE102007025957A1 (de) * | 2007-06-04 | 2008-12-11 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Festlegen eines eine elektrische Schaltung oder dergleichen aufweisenden Flächensubstrats in einer Einbauposition |
EP2071911B1 (de) * | 2007-12-11 | 2011-12-21 | Denso Corporation | Elektrische Steuervorrichtung und Herstellungsverfahren dafür |
DE102008040501A1 (de) * | 2008-07-17 | 2010-01-21 | Robert Bosch Gmbh | Verbesserte Wärmeabfuhr aus einem Steuergerät |
DE102008047649B4 (de) * | 2008-09-15 | 2011-03-31 | Gerhard Menninga | Platte zum Ausgleichen von Wärme in einer Leiterplatte und zum Abführen von Wärme von einer Leiterplatte und Anordnung einer solchen Platte mit einer Leiterplatte |
DE102008051547A1 (de) | 2008-10-14 | 2010-04-15 | Continental Automotive Gmbh | Elektronisches Gerät mit Bechergehäuse und Verfahren zur Herstellung desselben |
US8535787B1 (en) | 2009-06-29 | 2013-09-17 | Juniper Networks, Inc. | Heat sinks having a thermal interface for cooling electronic devices |
US8534930B1 (en) | 2009-09-24 | 2013-09-17 | Juniper Networks, Inc. | Circuit boards defining openings for cooling electronic devices |
US8223498B2 (en) * | 2009-11-11 | 2012-07-17 | Juniper Networks, Inc. | Thermal interface members for removable electronic devices |
WO2011069533A1 (en) * | 2009-12-07 | 2011-06-16 | Telefonaktiebolaget Lm Ericsson (Publ) | An electronics arrangement |
FR2963199B1 (fr) * | 2010-07-23 | 2012-09-14 | Pompes Salmson Sa | Dispositif de commande d'une pompe avec un dissipateur thermique |
JP2012129410A (ja) * | 2010-12-16 | 2012-07-05 | Hitachi Chem Co Ltd | 電子部品の製造方法 |
US9066446B1 (en) * | 2012-02-22 | 2015-06-23 | SeeScan, Inc. | Thermal extraction architecture for camera heads, inspection systems, and other devices and systems |
US8913390B2 (en) * | 2012-06-28 | 2014-12-16 | Apple Inc. | Thermally conductive printed circuit board bumpers |
KR101460896B1 (ko) | 2013-06-07 | 2014-11-12 | 현대오트론 주식회사 | 차량의 전자제어장치 |
JP6401534B2 (ja) * | 2014-07-29 | 2018-10-10 | 株式会社デンソーテン | 制御装置 |
JP6366413B2 (ja) * | 2014-08-06 | 2018-08-01 | アルパイン株式会社 | 電子回路ユニット |
DE102014217552A1 (de) * | 2014-09-03 | 2016-03-03 | Conti Temic Microelectronic Gmbh | Steuergerätevorrichtung für ein Kraftfahrzeug sowie Verfahren zum Herstellen einer solchen |
KR101575268B1 (ko) * | 2014-09-30 | 2015-12-07 | 현대오트론 주식회사 | 고정 부재를 이용한 차량의 전자 제어 장치 및 그 제조 방법 |
KR101575265B1 (ko) * | 2014-09-30 | 2015-12-07 | 현대오트론 주식회사 | 고정 부재를 이용한 차량의 전자 제어 장치 및 그 제조 방법 |
JP6296004B2 (ja) * | 2015-06-08 | 2018-03-20 | 株式会社デンソー | 電子機器 |
SE540653C2 (sv) * | 2016-03-29 | 2018-10-09 | Atlas Copco Airpower Nv | Arrangemang anordnat att innesluta ett kretskort innefattande elektroniska komponenter och ett verktyg innefattande arrangemanget |
USD827575S1 (en) | 2016-11-04 | 2018-09-04 | Phoenix Contact Development and Manufacturing, Inc. | Electrical enclosure |
US9967993B1 (en) | 2016-11-07 | 2018-05-08 | Phoenix Contact Development and Manufacturing, Inc. | Printed circuit board enclosure assembly |
CN110087851B (zh) * | 2016-12-22 | 2024-04-12 | 日立安斯泰莫株式会社 | 电子控制装置 |
WO2019012898A1 (ja) * | 2017-07-14 | 2019-01-17 | 日立オートモティブシステムズ株式会社 | 電子制御装置および電子制御装置の製造方法 |
JP6599967B2 (ja) * | 2017-12-25 | 2019-10-30 | ファナック株式会社 | 電子装置 |
DE202018100186U1 (de) * | 2018-01-15 | 2018-01-26 | Sensirion Automotive Solutions Ag | Sensormodul zur Luftgütemessung |
JP7006383B2 (ja) * | 2018-03-06 | 2022-01-24 | 住友電気工業株式会社 | 光トランシーバ |
WO2023066919A1 (en) | 2021-10-20 | 2023-04-27 | Signify Holding B.V. | An electronic assembly |
CN116136618A (zh) * | 2021-11-16 | 2023-05-19 | 中兴智能科技南京有限公司 | 一种光模块散热装置及通讯设备 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5020149A (en) * | 1987-09-30 | 1991-05-28 | Conifer Corporation | Integrated down converter and interdigital filter apparatus and method for construction thereof |
CA1307355C (en) * | 1988-05-26 | 1992-09-08 | David C. Degree | Soft-faced semiconductor component backing |
US4974119A (en) * | 1988-09-14 | 1990-11-27 | The Charles Stark Draper Laboratories, Inc. | Conforming heat sink assembly |
US4979074A (en) * | 1989-06-12 | 1990-12-18 | Flavors Technology | Printed circuit board heat sink |
DE4222838C2 (de) * | 1991-09-21 | 2002-03-28 | Bosch Gmbh Robert | Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge |
US5541448A (en) * | 1991-10-16 | 1996-07-30 | Texas Instruments Inc. | Electronic circuit card |
DE4433826C2 (de) * | 1994-09-22 | 1996-10-02 | Fichtel & Sachs Ag | Stelleinrichtung mit einem Gehäuse |
US5694037A (en) * | 1995-07-26 | 1997-12-02 | Lucent Technologies Inc. | System and method for calibrating multi-axial measurement devices using multi-dimensional surfaces in the presence of a uniform field |
-
1997
- 1997-08-07 DE DE19734110A patent/DE19734110C1/de not_active Expired - Fee Related
-
1998
- 1998-08-03 US US09/128,174 patent/US6094349A/en not_active Expired - Fee Related
- 1998-08-06 JP JP10223154A patent/JPH11112172A/ja active Pending
- 1998-08-07 SE SE9802689A patent/SE518544C2/sv not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SE9802689L (sv) | 1999-02-08 |
DE19734110C1 (de) | 1998-11-19 |
SE9802689D0 (sv) | 1998-08-07 |
US6094349A (en) | 2000-07-25 |
JPH11112172A (ja) | 1999-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |