SE470277B - Förfarande vid mönsterkortstillverkning samt användning därvid - Google Patents
Förfarande vid mönsterkortstillverkning samt användning därvidInfo
- Publication number
- SE470277B SE470277B SE9203327A SE9203327A SE470277B SE 470277 B SE470277 B SE 470277B SE 9203327 A SE9203327 A SE 9203327A SE 9203327 A SE9203327 A SE 9203327A SE 470277 B SE470277 B SE 470277B
- Authority
- SE
- Sweden
- Prior art keywords
- copper
- aluminum
- foil
- layers
- alloy
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910052802 copper Inorganic materials 0.000 claims abstract description 59
- 239000010949 copper Substances 0.000 claims abstract description 59
- 239000011888 foil Substances 0.000 claims abstract description 41
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 35
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims abstract description 13
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000011152 fibreglass Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 2
- 239000002650 laminated plastic Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 15
- 238000005530 etching Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- -1 alkali metal zincate Chemical class 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Reinforced Plastic Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- General Factory Administration (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9203327A SE470277B (sv) | 1992-11-06 | 1992-11-06 | Förfarande vid mönsterkortstillverkning samt användning därvid |
| EP93924845A EP0672334B1 (de) | 1992-11-06 | 1993-09-30 | Verfahren und anwendung zur herstellung von leiterplatten |
| DE69330253T DE69330253D1 (de) | 1992-11-06 | 1993-09-30 | Verfahren und anwendung zur herstellung von leiterplatten |
| PCT/SE1993/000786 WO1994012008A1 (en) | 1992-11-06 | 1993-09-30 | Process for production of printed circuit boards and use thereby |
| AT93924845T ATE201549T1 (de) | 1992-11-06 | 1993-09-30 | Verfahren und anwendung zur herstellung von leiterplatten |
| US08/424,378 US5617629A (en) | 1992-11-06 | 1993-09-30 | Process for production of printed circuit boards and use thereby |
| JP6511508A JPH08503174A (ja) | 1992-11-06 | 1993-09-30 | プリント回路基板の製造法およびその使用部材 |
| AU54353/94A AU5435394A (en) | 1992-11-06 | 1993-09-30 | Process for production of printed circuit boards and use thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9203327A SE470277B (sv) | 1992-11-06 | 1992-11-06 | Förfarande vid mönsterkortstillverkning samt användning därvid |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE9203327D0 SE9203327D0 (sv) | 1992-11-06 |
| SE9203327L SE9203327L (sv) | 1993-12-20 |
| SE470277B true SE470277B (sv) | 1993-12-20 |
Family
ID=20387737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9203327A SE470277B (sv) | 1992-11-06 | 1992-11-06 | Förfarande vid mönsterkortstillverkning samt användning därvid |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5617629A (de) |
| EP (1) | EP0672334B1 (de) |
| JP (1) | JPH08503174A (de) |
| AT (1) | ATE201549T1 (de) |
| AU (1) | AU5435394A (de) |
| DE (1) | DE69330253D1 (de) |
| SE (1) | SE470277B (de) |
| WO (1) | WO1994012008A1 (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6085414A (en) * | 1996-08-15 | 2000-07-11 | Packard Hughes Interconnect Company | Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom |
| EP0948247B1 (de) * | 1998-04-01 | 2005-08-31 | Mitsui Mining & Smelting Co., Ltd. | Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte |
| JP3612594B2 (ja) * | 1998-05-29 | 2005-01-19 | 三井金属鉱業株式会社 | 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法 |
| US6183880B1 (en) | 1998-08-07 | 2001-02-06 | Mitsui Mining & Smelting Co., Ltd. | Composite foil of aluminum and copper |
| WO2000042830A1 (de) * | 1999-01-14 | 2000-07-20 | Schaefer Hans Juergen | Verfahren und vorrichtung zur herstellung von kupferfolie, die beidseitig mit polymeren beschichtet ist und die auf leiterplatten laminiert wird |
| US6356002B1 (en) * | 1999-02-08 | 2002-03-12 | Northrop Grumman Corporation | Electrical slip ring having a higher circuit density |
| US6569543B2 (en) | 2001-02-15 | 2003-05-27 | Olin Corporation | Copper foil with low profile bond enahncement |
| US6379487B1 (en) * | 2000-05-05 | 2002-04-30 | Ga-Tek Inc. | Component of printed circuit board |
| US6467138B1 (en) * | 2000-05-24 | 2002-10-22 | Vermon | Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same |
| US6454878B1 (en) * | 2000-11-01 | 2002-09-24 | Visteon Global Technologies, Inc. | Cladded material construction for etched-tri-metal circuits |
| US6588099B2 (en) * | 2001-01-22 | 2003-07-08 | Sankyo Kasei Kabushiki Kaisha | Process for manufacturing molded circuit board |
| US6893742B2 (en) * | 2001-02-15 | 2005-05-17 | Olin Corporation | Copper foil with low profile bond enhancement |
| US6984915B2 (en) | 2002-01-22 | 2006-01-10 | Electro-Tec Corp. | Electrical slip ring platter multilayer printed circuit board and method for making same |
| US7132158B2 (en) * | 2003-10-22 | 2006-11-07 | Olin Corporation | Support layer for thin copper foil |
| JP3972895B2 (ja) * | 2003-12-10 | 2007-09-05 | 松下電器産業株式会社 | 回路基板の製造方法 |
| JP4570070B2 (ja) * | 2004-03-16 | 2010-10-27 | 三井金属鉱業株式会社 | 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法 |
| US8861167B2 (en) | 2011-05-12 | 2014-10-14 | Global Plasma Solutions, Llc | Bipolar ionization device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE29820E (en) * | 1971-08-30 | 1978-10-31 | Perstorp, Ab | Method for the production of material for printed circuits |
| BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
| US3936548A (en) * | 1973-02-28 | 1976-02-03 | Perstorp Ab | Method for the production of material for printed circuits and material for printed circuits |
| DE2413932C2 (de) | 1973-04-25 | 1984-08-30 | Yates Industries, Inc., Bordentown, N.J. | Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise |
| US4073699A (en) * | 1976-03-01 | 1978-02-14 | Hutkin Irving J | Method for making copper foil |
| US4088544A (en) * | 1976-04-19 | 1978-05-09 | Hutkin Irving J | Composite and method for making thin copper foil |
| US4401521A (en) * | 1980-11-28 | 1983-08-30 | Asahi Kasei Kogyo Kabushiki Kaisha | Method for manufacturing a fine-patterned thick film conductor structure |
| US4503112A (en) * | 1981-06-12 | 1985-03-05 | Oak Industries Inc. | Printed circuit material |
| US4394419A (en) * | 1981-06-12 | 1983-07-19 | Oak Industries Inc. | Printed circuit material |
| US4421608A (en) * | 1982-03-01 | 1983-12-20 | International Business Machines Corporation | Method for stripping peel apart conductive structures |
| GB8333753D0 (en) * | 1983-12-19 | 1984-01-25 | Thorpe J E | Dielectric boards |
| US5049434A (en) * | 1984-04-30 | 1991-09-17 | National Starch And Chemical Investment Holding Corporation | Pre-patterned device substrate device-attach adhesive transfer system |
| JPS63103075A (ja) * | 1986-10-14 | 1988-05-07 | エドワ−ド アドラ− | マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品 |
-
1992
- 1992-11-06 SE SE9203327A patent/SE470277B/sv not_active IP Right Cessation
-
1993
- 1993-09-30 US US08/424,378 patent/US5617629A/en not_active Expired - Fee Related
- 1993-09-30 AT AT93924845T patent/ATE201549T1/de not_active IP Right Cessation
- 1993-09-30 EP EP93924845A patent/EP0672334B1/de not_active Expired - Lifetime
- 1993-09-30 JP JP6511508A patent/JPH08503174A/ja active Pending
- 1993-09-30 DE DE69330253T patent/DE69330253D1/de not_active Expired - Lifetime
- 1993-09-30 WO PCT/SE1993/000786 patent/WO1994012008A1/en not_active Ceased
- 1993-09-30 AU AU54353/94A patent/AU5435394A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| SE9203327L (sv) | 1993-12-20 |
| US5617629A (en) | 1997-04-08 |
| EP0672334A1 (de) | 1995-09-20 |
| SE9203327D0 (sv) | 1992-11-06 |
| AU5435394A (en) | 1994-06-08 |
| ATE201549T1 (de) | 2001-06-15 |
| EP0672334B1 (de) | 2001-05-23 |
| WO1994012008A1 (en) | 1994-05-26 |
| JPH08503174A (ja) | 1996-04-09 |
| DE69330253D1 (de) | 2001-06-28 |
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