SE458244B - BEARING ELEMENT FOR AN IC COMPONENT - Google Patents

BEARING ELEMENT FOR AN IC COMPONENT

Info

Publication number
SE458244B
SE458244B SE8107263A SE8107263A SE458244B SE 458244 B SE458244 B SE 458244B SE 8107263 A SE8107263 A SE 8107263A SE 8107263 A SE8107263 A SE 8107263A SE 458244 B SE458244 B SE 458244B
Authority
SE
Sweden
Prior art keywords
carrier
film
component
module
conductor tracks
Prior art date
Application number
SE8107263A
Other languages
Swedish (sv)
Other versions
SE8107263L (en
Inventor
Y Haghiri-Tehrani
J Hoppe
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of SE8107263L publication Critical patent/SE8107263L/en
Publication of SE458244B publication Critical patent/SE458244B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut

Abstract

A carrier element for an IC module (integrated circuit) comprising leads which are connected at one end with the corresponding terminals of the module and at the other end have a contact surface. The ends of the leads running into the contact surfaces extend unsupported beyond the edge of the carrier so that they can be bent into the desired position according to the intended purpose of the carrier element. When the leads are bent around the carrier plane towards the back surface of the module and united by using a castable material in a casting the result is a compact carrier element well adapted to the dimensions of the IC module. For the incorporation of the carrier element according to the invention into an identification card the free ends of the leads can be directed through corresponding recesses in the cover film of the card. During lamination of the layers of the identification card the ends of the leads are bent onto the cover film and thus pressed into the film material.

Description

458 244 10 15 20 25 30 35 40 mande av att de på bäraren fixerade kontaktytorna är tillgäng- liga, är identitetskortet försett med motsvarande genombryt- ningar. Dessa måste, om man vill undvika snabb nedsmutsning av kontakterna, fyllas med ett ledande material. Bortsett från det härför erforderliga extra arbetsmomentet förorsakas genom denna åtgärd ett ytterligare kontaktställe och därmed en ytter- ligare risk för störningar, avbrott etc under användningen av identitetskortet. Ändamålet med uppfinningen består därför i att föreslå ett bärelement av det ovan angivna slaget i möjligaste man nära storleken på IC-kom medger en för stora serier lämplig enkel bäraren, exempelvis i identitetskort. , vars storlek kommer ponenten och vilket integrering i data- Ändamålet uppnås enligt uppfinningen genom att ledarbanor- na när utanför bärarens kant med kontaktytorna och är fritt böjliga. . 458 244 10 15 20 25 30 35 40 If the contact surfaces fixed to the carrier are available, the identity card is provided with corresponding breakthroughs. If you want to avoid rapid soiling of the contacts, these must be filled with a conductive material. Apart from the extra work step required for this, this measure causes an additional point of contact and thus an additional risk of disturbances, interruptions, etc. during the use of the identity card. The object of the invention is therefore to propose a carrier element of the type indicated above in the simplest possible manner close to the size of the IC grain, allowing a simple carrier suitable for large series, for example in identity cards. The size of the component and the integration in the data The object is achieved according to the invention by the conductor tracks reaching beyond the edge of the carrier with the contact surfaces and being freely flexible. .

Bärelementen är sålunda utförda på det sättet, att de ut- löpande ändarna av anslutningsledningarna eller le darbanorna förblir fritt rörliga och sålunda kan böjas vid färdigställan- det och inbyggnaden av bärelementen i det önskade läget.The support elements are thus designed in such a way that the projecting ends of the connecting lines or conductor tracks remain freely movable and thus can be bent at the completion and installation of the support elements in the desired position.

Om de i kontaktytorna utlöpande ledarbanändarna böjes tillbaka exempelvis omkring bärarens plan i riktning mot IC- komponenten eller över komponentens yta, erhålles ett kontakt- och efter dimensionerna på IC- komponenten optimalt anpassat bärelement.If the conductor track ends extending in the contact surfaces are bent back, for example around the carrier's plane in the direction of the IC component or over the surface of the component, a contact element which is optimally adapted to the support component and the dimensions of the IC component is obtained.

Elementet kan med fördel insättas överallt där små dimen- sioner spelar en viktig roll, exempelvis i hybridkretsar för klockor eller liknande..The element can advantageously be used wherever small dimensions play an important role, for example in hybrid circuits for clocks or the like.

I samband med identitetskort eller liknande databärare kan elementet utan några som helst tillsatsåtgärder inklistras i ett på lämpligt sätt förberett bottenhål i kortet på minsta utrymme.In connection with identity cards or similar data carriers, the element can be pasted into a suitably prepared bottom hole in the card in the smallest space without any additional measures.

Den ringa storleken hos bärelementet garanterar hög sä- kerhet vid handhavandet av kortet, då den mekaniska angrepps- ytan är i motsvarande grad liten.The small size of the support element guarantees high security when handling the card, as the mechanical contact surface is correspondingly small.

Vid inbyggnad av de enligt uppfinningen föreslagna bär- elementen i identitetskort under varmkascheringsprocessen är en enkel tillverkningsteknik möjlig, om de fria ledarbanändarna först föres genom förberedda urtagningar i kortets täckfolie och under kascheringen av täckfolierna med de övriga kortskikten 10 l5 20 25 30 35 40 458 244 böjas tillbaka mot det över komponentens yta belägna området av täckfolien och därvid pressas in i foliematerialet.When incorporating the support elements proposed according to the invention in identity cards during the hot-lacing process, a simple manufacturing technique is possible, if the free conductor track ends are first passed through prepared recesses in the cover foil of the card and during the laminating of the cover foils with the other card layers. is bent back towards the area of the cover foil located above the component and is thereby pressed into the foil material.

Kortet uppvisar på grund av de sömlösa Övergångarna mellan kontaktomràdena och täckfolien ett tilltalande utseen- de. Det centralt i kortet lagrade bärelementet är optimalt skyddat, varvid komponenten blott över ett enda kontaktställe är förbunden med de externt tillgängliga kontaktytorna.Due to the seamless transitions between the contact areas and the cover foil, the card has an attractive appearance. The support element stored centrally in the card is optimally protected, the component being connected to the externally accessible contact surfaces over only a single contact point.

Ytterligare fördelar med och vidareutvecklingar av upp- finningen framgår av underkraven. I det följande är utförings- former av bärelementet beskrivna som exempel i anslutning till bifogade ritningar, pà vilka Fig 1 - 3 visar ett exempel på framställningen av bär- elementet enligt uppfinningen, Fig 4a, 4b, Sa och 5b visar vidareutvecklingar av de i Fig l - 3 visade bärelementen, Fig 6a - 6c visar ett bärelement med relativt komponenten tunnare bärfolie, Fig 7 resp 8 visar ett förfarande för inbyggnad av bär- elementet enligt uppfinningen i identitetskort samt det färdiga identitetskortet, Fig 9a och 9b visar en fördelaktig utföringsform av den under framställningsförfarandet använda täckfolien, Fig 10 visar ett bärelement, vid vilket den komponenten uppbärande folien är identisk med kortets täckfolie, Fig ll, 12 och 13 visar ett bärelement med ett gjutet hölje som bärare för IC-komponenten i tre faser av till- verkningen av detsamma, samt Fig 14 visar framställningen av ett bärelement utan an- vändning av någon bärfilm.Further advantages and further developments of the invention appear from the subclaims. In the following, embodiments of the support element are described as examples in connection with the accompanying drawings, in which Figs. 1-3 show an example of the production of the support element according to the invention, Figs. 4a, 4b, 5a and 5b show further developments of those in Figs. 1 - 3, Figs. 6a - 6c show a support element with relatively thinner support foil component, Figs. 7 and 8 show a method for incorporating the support element according to the invention in identity cards and the finished identity card, Figs. 9a and 9b show an advantageous embodiment of the cover foil used during the manufacturing process, Fig. 10 shows a carrier element, in which the component supporting foil is identical to the cover foil of the card, Figs. 11, 12 and 13 show a carrier element with a molded casing as carrier for the IC component in three phases of manufacture of the same, and Fig. 14 shows the production of a carrier element without the use of any carrier film.

I Fig 1 - 3 visas ett exempel på framställningen av bär- elementet enligt uppfinningen. Som bärare för IC-komponenten kan användas folie- resp filmmaterial. Den vanligtvis vid filmerna 1 förefintliga perforeringen 2 utnyttjas under de enskilda produktionstempona till transport resp till juste- ring av filmen, exempelvis i kontaktgivningsanordningen.Figs. 1-3 show an example of the production of the support element according to the invention. Foil or film material can be used as the carrier for the IC component. The perforation 2 usually present in the films 1 is used during the individual production tempos for transport or for adjusting the film, for example in the contacting device.

Den komponenten 3 med bäraren l förbindande kontaktspin- _ deln med sina ledarbanor 4 är i det visade utföringsexemplet utetsad från ett ledande filmskikt.enligt känt förfarande.The component 3 with the carrier 1 connecting the contact spindle with its conductor tracks 4 is in the embodiment shown etched from a conductive film layer according to a known method.

I samband med kontaktgivningen vid halvledarkomponenter är det också känt att framställa kontaktspindeln oberoende 458 244 10 15 20 25 3D 35 40 av filmen i ett separat förfarandesteg. I detta fall positione- ras kontaktspindeln först under kontaktgivningsförloppet på bärarfilmen och förbindes där med bäraren och komponentens mot- svarande anslutningspunkter. 1 Oberoende av framställningen av kontaktspindeln förbindes ledarbanan 4 i ena änden med komponentens 3 motsvarande anslut- ningspunkter 6. De i kontaktytorna 4a utlöpande ändarna av le- darbanorna 4 är i detta utföringsexempel på uppfinningen anord- nade fritt rörliga över utstansade fönster 7.In connection with the contacting with semiconductor components, it is also known to produce the contact spindle independently of the film in a separate process step. In this case, the contact spindle is first positioned during the contacting process on the carrier film and is connected there to the carrier and the corresponding connection points of the component. Independently of the production of the contact spindle, the conductor track 4 is connected at one end to the corresponding connection points 6 of the component 3. The ends of the conductor tracks 4 extending in the contact surfaces 4a are in this exemplary embodiment of the invention arranged freely movable over punched windows 7.

Fig 2 visar anordningen i Fig 1 i sektion. I det visade exemplet är den komponenten 3 uppbärande filmen 1 tjockare än komponenten inbegripet de kontaktgivande ledarbanorna 4.' Denna uppbyggnad erbjuder optimalt skydd för komponenten med dess anslutningsledningar.Fig. 2 shows the device of Fig. 1 in section. In the example shown, the component 3 supporting the film 1 is thicker than the component including the contacting conductor tracks 4. ' This structure offers optimal protection for the component with its connecting cables.

Ledarbanorna 4 är blott på ett relativt smalt område för-D bundna med filmen 1, så att ledarbanornas ändar förblir fritt rörliga.The conductor tracks 4 are connected to the film 1 only in a relatively narrow area, so that the ends of the conductor tracks remain freely movable.

Fig 3 visar det från filmen utstansade bärelementet 10, varvid de i Fig 1 medelst streckade linjer antydda liven 11 kapas. Om längden på ledarbanorna 4 är så vald relativt bred- den hos fönstret 7, att ledarbanorna överbryggar fönstret (visat streckat i Fig 1), måste under utstansningsförloppet även ledarbanorna kapas.Fig. 3 shows the support element 10 punched out of the film, the webs 11 indicated by dashed lines being cut in Fig. 1. If the length of the conductor tracks 4 is so chosen relative to the width of the window 7 that the conductor tracks bridge the window (shown in dashed lines in Fig. 1), the conductor tracks must also be cut during the punching process.

I det följande beskrives fördelaktiga vidareutvecklingar av det i Fig 1 - 3 visade bärelementet.In the following, advantageous further developments of the support element shown in Figs. 1-3 are described.

Vid den i Fig 4a och 4b visade utföringsformen böjes ändar- na 4a av ledarbanorna 4 omkring bärarens 1 plan in över kompo- nenten 3. Därefter gjutes ett lämpligt material i hâlrummet 15 för att skydda IC-komponenten 3 och anslutningarna. Därvid in- gjutes även ändarna 4a på de ombockade ledarbanorna (kontaktytor- na) och fästes sålunda automatiskt.In the embodiment shown in Figs. 4a and 4b, the ends 4a of the conductor tracks 4 around the plane of the carrier 1 are bent in over the component 3. Thereafter, a suitable material is cast in the cavity 15 to protect the IC component 3 and the connections. The ends 4a of the folded conductor tracks (contact surfaces) are also cast in and are thus attached automatically.

Böjningen av ledarbanorna och igjutningen av hâlrummen ge~ nomföres för underlättande av förfarandestegen företrädesvis vid det ännu med filmen förbundna elementet. Det slutligen från filmen utstansade bärelementet 16 visas i Fig 4b. Som man ser, ger den speciella utformningen av ledarbanorna ett mycket kompakt och med avseende på dimensionerna efter storleken på IC-komponenten optimalt anpassat bärelement- Fig Sa och Sb visar en utföringsform av uppfinningen, vid vilken ledarbanorna hos kontaktspindeln framställes i ett separat 10 15 20 25 30 35 40 458 244 arbetssteg och inte i samband med bärfilmen. I detta fall är det nödvändigt, att ledarbanorna 4 hos kontaktspindeln före eller under kontaktgivningen förbindes medelst ett lämpligt lim 17 med bärfilmen 1. Omböjningen av ledarbanorna och igjut- ningen av bärelementet kan genomföras såsom ovan beskrivits.The bending of the conductor tracks and the casting of the cavities are carried out to facilitate the process steps, preferably at the element still connected to the film. The support element 16 finally punched out of the film is shown in Fig. 4b. As can be seen, the special design of the conductor tracks provides a very compact and with respect to the dimensions according to the size of the IC component optimally adapted support element. Figs. 5a and 5b show an embodiment of the invention, in which the conductor tracks of the contact spindle are manufactured in a separate 25 30 35 40 458 244 working steps and not in connection with the carrier film. In this case, it is necessary that the conductor tracks 4 of the contact spindle before or during the contacting are connected by means of a suitable adhesive 17 to the carrier film 1. The bending of the conductor tracks and the casting of the carrier element can be carried out as described above.

Såsom även Fig 5b visar, föres ledarbanorna 4 vid detta utföringsexempel dessutom genom urtagningar 18, som är anord- nade vid bärelementets kant, och fastgjutes i dessa. Denna åtgärd främjar hâllfastheten hos ledarbanornas förbindning med bäraren.As Fig. 5b also shows, in this exemplary embodiment the conductor tracks 4 are also passed through recesses 18, which are arranged at the edge of the support element, and are cast into them. This measure promotes the strength of the conductor tracks' connection to the carrier.

Fig 6a - 6c visar ett utföringsexempel på uppfinningen, vid vilket den till kontaktgivningen med komponenten 3 använda filmen 25 är tunnare än komponenten. Som man kan se i Fig 6a, är vid denna utföringsform de utlöpande ändarna 4a av ledar- banorna 4 anordnade på ett fritt rörligt avsnitt 26 av bär- filmen 25. Det vinkelrätt mot filmplanet rörliga avsnittet utstansas i sådan form från filmen 25, att det endast över de smala liven 27 är förbundet med filmen. Efter kontaktgivningen med IC-komponenten 3 böjes de i kontaktytorna 4a utlöpande ändarna av ledarbanorna, såsom visas med pilarna 28 i Fig 6b, tillsamman med avsnittet 26 mot filmens baksida. Det komponen- ten 3 omgivande hålrummet 29 kan därefter igjutas.Figures 6a - 6c show an embodiment of the invention, in which the film 25 used for the contacting with the component 3 is thinner than the component. As can be seen in Fig. 6a, in this embodiment, the tapered ends 4a of the conductor tracks 4 are arranged on a freely movable section 26 of the carrier film 25. The section perpendicular to the film plane is punched out in such a shape from the film 25 that only over the narrow webs 27 is connected to the film. After the contacting with the IC component 3, the ends of the conductor tracks extending in the contact surfaces 4a are bent, as shown by the arrows 28 in Fig. 6b, together with the section 26 towards the back of the film. The cavity 29 surrounding the component 3 can then be cast.

Liksom vid de tidigare beskrivna utföringsformerna upp- visar bärelementet 30, som genom enkel genomskärning av liven 52 längs de streckade linjerna kan utstansas från filmen 25, en efter komponentens storlek väl anpassad konstruktion. Med det beskrivna förfarandet fördubblas filmens tjocklek, så att också här komponenten är anordnad skyddad i det mittre planet av bärelementet. 4 I anslutning till Fig 7 beskrives i det följande ett för- farande, varmed ett enligt uppfinningen framställt bärelement på enkelt sätt kan byggas in i identitetskort eller liknande databärare.As in the previously described embodiments, the support element 30, which can be punched out of the film 25 along the dashed lines by simple cross-section, has a construction well adapted to the size of the component. With the described method, the thickness of the film is doubled, so that here too the component is arranged protected in the middle plane of the support element. In connection with Fig. 7, a method is described in the following, by means of which a support element produced according to the invention can be easily built into identity cards or similar data carriers.

Först insättes bärelementet 40 i en förberedd, efter ele- mentets storlek anpassad urtagning 45 i kortkärnan 42 och hål- les i detta läge medelst den bakre täckfolien 43. Därefter lägges den främre täckfolien 41 på sådant sätt på den med bär- elementet 40 bestyckade kortkärnan 42, att_ledarbanornas ändar 4a föres genom motsvarande snitt eller slitsar 44 i täckfolien.First, the support element 40 is inserted into a prepared recess 45 adapted to the size of the element in the card core 42 and is held in this position by means of the rear cover foil 43. Thereafter, the front cover foil 41 is laid in such a manner on the card core equipped with the support element 40. 42, that the ends 4a of the conductor tracks are passed through corresponding cuts or slots 44 in the cover foil.

Efter omböjningen av ledarbanornas ändar mot den främre täck- 458 244 10 15 20 25 30 35 40 folien 41 förbindes de enskilda folierna med varandra och med ba. elementet exempelvis genom 'varmkascheringsförfarandet.After the ends of the conductor tracks are bent towards the front cover foil 41, the individual foils are connected to each other and to ba. the element, for example, by the hot laminating process.

Såsom framgår av det färdigkascherade identitetskortet (Fig 8), är ledarbanornas ändar resp kontaktytorna 4a på bär- elementet sömlöst inpressade i den främre täckfolien 41. Däri- genom erhåller kortet ett snyggt utseende och erhålles dess- utom den fördelen, att kontaktytorna på enkelt sätt kan hållas rena .As can be seen from the pre-laminated identity card (Fig. 8), the ends of the conductor tracks or the contact surfaces 4a of the support element are seamlessly pressed into the front cover foil 41. Thereby the card obtains a nice appearance and also has the advantage that the contact surfaces are easily can be kept clean.

Såsom man också kan se i Fig 8, är IC-komponenten endast över ett enda kontaktställe förbundet med den till kortets yta framdragna och direkt för perifera apparater tillgängliga kon- taktytan 4a, varigenom driftsäkerheten i förhållande till kända identitetskort med integrerade kretsar förbättras.As can also be seen in Fig. 8, the IC component is connected only via a single contact point to the contact surface 4a extended to the surface of the card and directly accessible to peripheral devices, whereby the operational reliability in relation to known identity cards with integrated circuits is improved.

Fig 9a resp 9b visar en fördelaktig utföringsform av en folie 48, som kan användas som täckfolie i det ovan beskrivna förfarandet. Slitsarna 49 i folien är, såsom ningen, så utförda underlättas. framgår av rit- , att genomföringen av ledarbanornas ändar Dessutom böjes ledarbanornas ändar redan under genomföringen till täckfoliens yta, så att de under kasche- ringsförloppet automatiskt tryckes till det slutgiltiga läget medelst kascheringsplattan.Figs. 9a and 9b, respectively, show an advantageous embodiment of a foil 48, which can be used as a cover foil in the method described above. The slits 49 in the foil are, like the ning, so designed to be facilitated. It can be seen from the drawing that the bushing ends of the conductor tracks In addition, the ends of the conductor tracks are already bent during the bushing to the surface of the cover foil, so that during the laminating process they are automatically pressed to the final position by means of the laminating plate.

Fig 10 visar slutligen en utföringsform av uppfinningen, vid vilken IC-komponenten 3 före kont på en med bärfilmen l förbunden fol lämpligt klister 51 aktgivningen först fästes ie 50 med hjälp av något . En fördel med den sista utföringsformen det i Fig 8 visade identitetskortet, varigenom framställningen av identitetskort med integrerade k retsar ytterligare förenk- las.Fig. 10 finally shows an embodiment of the invention, in which the IC component 3 before attachment to a suitable adhesive 51 connected to the carrier film 1 is first attached to the device 50 by means of something. An advantage of the last embodiment is the identity card shown in Fig. 8, whereby the production of identity cards with integrated circuits is further simplified.

Fig 11 - 13 visar en utföringsform av uppfinningen, vid vilken som bärare för IC-komponenten användes ett gjutet hölje.Figs. 11 to 13 show an embodiment of the invention, in which a cast casing was used as the carrier for the IC component.

Med komponenten 3 åstadkommas först kontaktgivning, exem- I pelvis såsom redan ovan beskrivits i samband med Fig 1 - 3.With the component 3 first contact is provided, for example as already described above in connection with Figs. 1-3.

Endast den i ett fönster 51 i filmen 60 anordnade komponenten förses därpå i en lämplig gjutstation (inte visad i figurerna) med det Qjuïna höljet 63. Det från fönstret 61 i filmen vid ledarbanornas ändar 4a utstansade bärelementet 64 är visat i Fig 13. De från komponentbärarens kant resp det gjutna höljet 63 utskjutande ändarna 4a av ledarbanorna är fritt böjliga och kan böjas exempelvis mot bärarens resp komponentens yta. 10 15 458 244 ~ Den sistnämnda utföringsformen av uppfinningen utmärker sig genom en mycket kompakt och efter komponentens 3 dimen- sioner anpassad konstruktion. Bärelementet innehåller endast IC-komponenten och ledarbanorna-4 resp 4a men inte längre bärfilmen 60, pà vilken ledarbanorna var fästa under kontakt- givningen.Only the component arranged in a window 51 in the film 60 is then provided in a suitable casting station (not shown in the figures) with the Qjuina housing 63. The support element 64 punched out of the window 61 in the film at the ends 4a of the conductor tracks is shown in Fig. 13. the edge 4a of the component carrier or the cast housing 63 projecting the ends 4a of the conductor tracks are freely flexible and can be bent, for example, towards the surface of the carrier or component. The latter embodiment of the invention is characterized by a very compact construction adapted to the 3 dimensions of the component. The carrier element contains only the IC component and the conductor tracks-4 and 4a, respectively, but no longer the carrier film 60, to which the conductor tracks were attached during the contacting.

Fig 14 visar slutligen en utföringsform av uppfinningen, vid vilken bärfilm utelämnas redan under kontaktgivningen.Fig. 14 finally shows an embodiment of the invention, in which carrier film is omitted already during the contacting.

För kontaktgivningen med komponenten 3 användes en elektriskt ledande film 65, från vilken, såsom visas i figuren, ledarbanor- na 4 utstansas eller utetsas. Perforeringen 66 tjänar till trans- port av filmen under bearbetningsfaserna.For the contacting with the component 3, an electrically conductive film 65 is used, from which, as shown in the figure, the conductor tracks 4 are punched out or etched out. The perforation 66 serves to transport the film during the processing phases.

Efter inkapslingen av komponenten i ett gjutet hölje 63 utstansas det egentliga bärelementet från filmen, i det att liven 68, som i detta fall är identiska med ledarbanornas än- dar 4a, genomskäres. Slutprodukten har den i Fig 13 visade konstruktionen.After the encapsulation of the component in a molded casing 63, the actual support element is punched out of the film, in that the web 68, which in this case is identical with the ends 4a of the conductor tracks, is cut through. The end product has the construction shown in Fig. 13.

\ J___í\ J ___ í

Claims (3)

1. 458 244 10 15 20 25 30 35 PATENTKRAV l. Bärelement för en IC-modul och en bärare, vid vil- ket en IC-modul är infäst till en bärarfilm medelst en kontaktspindel på så sätt, att kontaktspindeln uppvisar ledare som vid den ena änden är ansluten till motsva- rande terminaler pâ modulen, och vid den andra änden löper ut i kontaktytor, k ä n n e t e c k n a t av att ledarna sträcker sig fram till delar av bärfilmen som är ombockade mot baksidan av bärarfilmen i syfte att fördubbla bärarens tjocklek.1. 458 244 10 15 20 25 30 35 PATENT CLAIMS 1. Support element for an IC module and a carrier, to which an IC module is attached to a carrier film by means of a contact spindle in such a way that the contact spindle has conductors which at the one end is connected to the corresponding terminals on the module, and at the other end runs out into contact surfaces, characterized in that the conductors extend to parts of the carrier film which are bent towards the back of the carrier film in order to double the thickness of the carrier. 2. Bärelement enligt krav l, k ä n n e t e c k n a t av att IC-modulen är inkapslad medelst lämpligt mate- rial för att skydda IC-modulen och de delar av ledarna, som ej är anordnade under bärarfilmen.Support element according to claim 1, characterized in that the IC module is encapsulated by means of suitable material to protect the IC module and the parts of the conductors which are not arranged under the support film. 3. Bärelement bestående av ett flertal aggregat en- ligt något av kraven l och 2, anordnade i fönster i en filmremsa, varvid varje dylikt aggregat är anslutet till filmremsan medelst lätt avskiljbara liv.Support element consisting of a plurality of assemblies according to any one of claims 1 and 2, arranged in windows in a film strip, each such assembly being connected to the film strip by means of easily separable webs.
SE8107263A 1980-12-08 1981-12-04 BEARING ELEMENT FOR AN IC COMPONENT SE458244B (en)

Applications Claiming Priority (2)

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DE3046193 1980-12-08
DE3123198A DE3123198C2 (en) 1980-12-08 1981-06-11 Carrier elements for an IC chip

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DE (1) DE3123198C2 (en)
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IT (1) IT1145229B (en)
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Also Published As

Publication number Publication date
JPH0558920B2 (en) 1993-08-27
JPH054479A (en) 1993-01-14
CH654143A5 (en) 1986-01-31
GB8413463D0 (en) 1984-07-04
DE3123198C2 (en) 1993-10-07
SE8107263L (en) 1982-06-09
FR2495839B1 (en) 1986-12-12
GB2140207B (en) 1985-09-18
IT8168596A0 (en) 1981-12-07
GB2140207A (en) 1984-11-21
DE3123198A1 (en) 1982-07-08
IT1145229B (en) 1986-11-05
FR2495839A1 (en) 1982-06-11
GB2090466A (en) 1982-07-07
NL8105344A (en) 1982-07-01
US4460825A (en) 1984-07-17
GB2090466B (en) 1985-09-18

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