FR2337381A1 - PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD - Google Patents

PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD

Info

Publication number
FR2337381A1
FR2337381A1 FR7540361A FR7540361A FR2337381A1 FR 2337381 A1 FR2337381 A1 FR 2337381A1 FR 7540361 A FR7540361 A FR 7540361A FR 7540361 A FR7540361 A FR 7540361A FR 2337381 A1 FR2337381 A1 FR 2337381A1
Authority
FR
France
Prior art keywords
card
manufacturing
signal processing
processing system
electrical signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7540361A
Other languages
French (fr)
Other versions
FR2337381B1 (en
Inventor
Bernard Badet
Francois Guillaume
Karel Kurzweil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SA
Original Assignee
Societe Industrielle Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Industrielle Honeywell Bull filed Critical Societe Industrielle Honeywell Bull
Priority to FR7540361A priority Critical patent/FR2337381A1/en
Priority to IT3018576A priority patent/IT1124741B/en
Priority to CH1558976A priority patent/CH619310A5/en
Priority to CA268,082A priority patent/CA1083714A/en
Priority to GB5321476A priority patent/GB1567784A/en
Priority to ES454567A priority patent/ES454567A1/en
Priority to JP15766976A priority patent/JPS5283132A/en
Priority to SE7614622A priority patent/SE415304B/en
Priority to DE19762659573 priority patent/DE2659573C2/en
Priority to BR7608831A priority patent/BR7608831A/en
Priority to NL7614637A priority patent/NL190131C/en
Publication of FR2337381A1 publication Critical patent/FR2337381A1/en
Priority to US05/931,686 priority patent/US4216577A/en
Priority to US06/004,588 priority patent/US4222516A/en
Application granted granted Critical
Publication of FR2337381B1 publication Critical patent/FR2337381B1/fr
Priority to JP61052763A priority patent/JPS625894A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01063—Europium [Eu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01094—Plutonium [Pu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
FR7540361A 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD Granted FR2337381A1 (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
FR7540361A FR2337381A1 (en) 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD
IT3018576A IT1124741B (en) 1975-12-31 1976-12-09 PORTABLE BOARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEMS AND MANUFACTURING PROCEDURE OF THE BOARD
CH1558976A CH619310A5 (en) 1975-12-31 1976-12-10 Portable card for signal processing system and method of manufacturing this card
CA268,082A CA1083714A (en) 1975-12-31 1976-12-16 Portable card for electrical signal processing system and method for making same
GB5321476A GB1567784A (en) 1975-12-31 1976-12-20 Portable card for systems for processing electrical signals and a method of manufacturing such a card
ES454567A ES454567A1 (en) 1975-12-31 1976-12-23 Portable card for systems for processing electrical signals and a method of manufacturing such a card
JP15766976A JPS5283132A (en) 1975-12-31 1976-12-28 Portable card for electric signal processor and method of fabricating same
SE7614622A SE415304B (en) 1975-12-31 1976-12-28 SIGNAL PROCESSING SYSTEM CARDS AND PROCEDURES FOR PRODUCING THE SAME
DE19762659573 DE2659573C2 (en) 1975-12-31 1976-12-30 Card in the manner of a standardized credit card for processing electrical signals and a method for producing the card
BR7608831A BR7608831A (en) 1975-12-31 1976-12-30 SUPPORTING CARD FOR ELECTRIC SIGNAL TREATMENT SYSTEM AND MANUFACTURING PROCESS FOR THIS CARD
NL7614637A NL190131C (en) 1975-12-31 1976-12-31 SIGNAL PROCESSING SYSTEM CARD.
US05/931,686 US4216577A (en) 1975-12-31 1978-08-07 Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
US06/004,588 US4222516A (en) 1975-12-31 1979-01-18 Standardized information card
JP61052763A JPS625894A (en) 1975-12-31 1986-03-12 Card and manufacture of card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7540361A FR2337381A1 (en) 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD

Publications (2)

Publication Number Publication Date
FR2337381A1 true FR2337381A1 (en) 1977-07-29
FR2337381B1 FR2337381B1 (en) 1979-07-06

Family

ID=9164418

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7540361A Granted FR2337381A1 (en) 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD

Country Status (11)

Country Link
JP (2) JPS5283132A (en)
BR (1) BR7608831A (en)
CA (1) CA1083714A (en)
CH (1) CH619310A5 (en)
DE (1) DE2659573C2 (en)
ES (1) ES454567A1 (en)
FR (1) FR2337381A1 (en)
GB (1) GB1567784A (en)
IT (1) IT1124741B (en)
NL (1) NL190131C (en)
SE (1) SE415304B (en)

Cited By (36)

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Publication number Priority date Publication date Assignee Title
WO1979000543A1 (en) * 1978-01-24 1979-08-09 R Moreno Method and device for electrically connecting a removable article,in particular a portable electronic card
DE2942422A1 (en) * 1978-10-19 1980-04-30 Cii Honeywell Bull CARRIER PLATE FOR INTEGRATED CIRCUITS
FR2477303A1 (en) * 1980-02-28 1981-09-04 Dassault Electronique Printed circuit electronic identification card reader - uses external activation to open shutter to allow card to be drawn in to stop before shutter is closed during processing
FR2480008A1 (en) * 1980-04-04 1981-10-09 Flonic Sa IMPROVEMENTS TO MEMORY CARDS
FR2483128A1 (en) * 1980-05-20 1981-11-27 Gao Ges Automation Org CARRIER ELEMENT FOR PAD WITH INTEGRATED CIRCUITS
FR2486685A1 (en) * 1980-07-09 1982-01-15 Labo Electronique Physique ELECTRONIC PAYMENT CARD AND METHOD OF MAKING SAME
FR2488427A1 (en) * 1980-08-07 1982-02-12 Gao Ges Automation Org IDENTIFICATION CARD WITH AN INTEGRATED CIRCUIT MODULE AND ITS MANUFACTURING METHOD
FR2494908A1 (en) * 1980-11-21 1982-05-28 Gao Ges Automation Org SUPPORT ELEMENT FOR INTEGRATED CIRCUIT MODULES
FR2502816A1 (en) * 1981-03-24 1982-10-01 Gao Ges Automation Org IDENTIFICATION CARD COMPRISING AN INTEGRATED CIRCUIT MODULE
FR2511544A1 (en) * 1981-08-14 1983-02-18 Dassault Electronique ELECTRONIC MODULE FOR AUTOMATIC TRANSACTION CARD AND CARD COMPRISING SUCH A MODULE
FR2519166A1 (en) * 1981-12-24 1983-07-01 Gao Ges Automation Org IDENTIFICATION CARD INCLUDING AN INTEGRATED CIRCUIT MODULE
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
FR2523335A1 (en) * 1982-03-10 1983-09-16 Flonic Sa Contact building method for card-borne integrated circuits - uses conductive pad welded onto foil used as contact to integrated circuit, creating more durable contact
EP0128822A1 (en) * 1983-06-09 1984-12-19 Flonic S.A. Method of producing memory cards, and cards obtained thereby
FR2548409A1 (en) * 1983-06-29 1985-01-04 Sligos METHOD FOR MANUFACTURING MEMORY CARDS, INSTALLATION AND MEMORY CARDS OBTAINED
EP0138219A2 (en) * 1983-10-17 1985-04-24 Kabushiki Kaisha Toshiba Method of storing encrypted data on a card
FR2554275A1 (en) * 1983-10-26 1985-05-03 Radiotechnique Compelec Connection device for a power semiconductor
FR2555780A1 (en) * 1983-11-29 1985-05-31 Flonic Sa Method of manufacturing memory cards and cards obtained by this method
EP0147337A2 (en) * 1983-12-30 1985-07-03 Bull S.A. Method and system for confidentially processing information registered on a portable carrier recording track with optical reading
US4617605A (en) * 1981-07-31 1986-10-14 Gao Gesellschaft Fur Automation Und Organisation Carrier element for an IC module
EP0198376A1 (en) * 1985-04-10 1986-10-22 EM Microelectronic-Marin SA Electronic unit, in particular for a microcircuit card, and card having such a unit
EP0203237A1 (en) * 1985-05-16 1986-12-03 Mips Co., Ltd. Semiconductor integrated circuit card
FR2584236A1 (en) * 1985-06-26 1987-01-02 Bull Sa METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD
FR2584235A1 (en) * 1985-06-26 1987-01-02 Bull Sa METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, DEVICE THEREFOR AND APPLICATION TO AN ELECTRON MICROCIRCUIT BOARD
FR2584862A1 (en) * 1985-07-12 1987-01-16 Eurotechnique Sa PROCESS FOR THE CONTINUOUS PRODUCTION OF MICROMODULES FOR CARDS CONTAINING COMPONENTS, CONTINUOUS STRIP OF MICROMODULES AND MICROMODULES PRODUCED BY SUCH A METHOD
EP0232705A2 (en) * 1986-01-10 1987-08-19 Orga-Kartensysteme GmbH Electronic data carriers and process for their manufacture
EP0246973A1 (en) * 1986-05-21 1987-11-25 Gérard Jacques Guy Michot Object associated with an electronic element and manufacturing method
EP0299530A1 (en) * 1987-07-16 1989-01-18 GAO Gesellschaft für Automation und Organisation mbH Support for inclusion into identity cards
US4810865A (en) * 1985-11-08 1989-03-07 Eurotechnique Method for recycling a card having an incorporated component, and a card designed to permit recycling
US4822988A (en) * 1985-11-08 1989-04-18 Eurotechnique Card containing a component and a micromodule having side contacts
EP0211360A3 (en) * 1985-07-27 1989-04-26 Dai Nippon Insatsu Kabushiki Kaisha Ic card
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DE9100665U1 (en) * 1991-01-21 1992-07-16 Telbus Gesellschaft Fuer Elektronische Kommunikations-Systeme Mbh, 8057 Eching, De
DE4209184C1 (en) * 1992-03-21 1993-05-19 Orga Kartensysteme Gmbh, 6072 Dreieich, De
DE4319878A1 (en) * 1992-06-17 1993-12-23 Micron Technology Inc High frequency identification system card - has integrated circuit chip or carrier layer sealed by top layer and coupled to batteries and antenna system
FR2769130A1 (en) * 1997-09-30 1999-04-02 Thomson Csf METHOD FOR COATING AN ELECTRONIC CHIP AND ELECTRONIC CARD COMPRISING AT LEAST ONE COATED CHIP ACCORDING TO THIS METHOD

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JPS5562591A (en) * 1978-10-30 1980-05-12 Fujitsu Ltd Memory card
DE2919649A1 (en) * 1979-05-16 1980-11-20 Bbc Brown Boveri & Cie SECURITY PAPER
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DE2926867C2 (en) * 1979-07-03 1986-01-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Circuit unit
DE3019206A1 (en) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München METHOD FOR CONTACTING GALVANIC CONTACTS OF AN ID CARD WITH EMBEDDED IC COMPONENT
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JPS57123556U (en) * 1981-01-26 1982-08-02
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DE3153768C2 (en) * 1981-04-14 1995-11-09 Gao Ges Automation Org Plastics identity card with an internal integrated circuit
JPS57209578A (en) * 1981-06-19 1982-12-22 Fujitsu Ltd Card
JPS5888892A (en) * 1981-11-20 1983-05-27 Hitachi Ltd Bubble memory cassette
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JPS58187858U (en) * 1982-06-08 1983-12-13 セイコーインスツルメンツ株式会社 IC card
JPS58221478A (en) * 1982-06-16 1983-12-23 Kyodo Printing Co Ltd Ic card
JPS5944067U (en) * 1982-09-16 1984-03-23 大日本印刷株式会社 IC card
DE3235650A1 (en) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg INFORMATION CARD AND METHOD FOR THEIR PRODUCTION
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FR2548857B1 (en) * 1983-07-04 1987-11-27 Cortaillod Cables Sa PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD
DE3338597A1 (en) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
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JPS59108581A (en) * 1983-11-17 1984-06-23 株式会社ソフイア Card type pinball game
JPS60126863U (en) * 1984-01-30 1985-08-26 共同印刷株式会社 IC card
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Also Published As

Publication number Publication date
JPS6130315B2 (en) 1986-07-12
IT1124741B (en) 1986-05-14
DE2659573A1 (en) 1977-07-14
GB1567784A (en) 1980-05-21
DE2659573C2 (en) 1986-02-27
NL190131C (en) 1993-11-01
FR2337381B1 (en) 1979-07-06
JPS5283132A (en) 1977-07-11
NL7614637A (en) 1977-07-04
CH619310A5 (en) 1980-09-15
BR7608831A (en) 1977-10-25
JPS6313840B2 (en) 1988-03-28
ES454567A1 (en) 1977-12-16
SE7614622L (en) 1977-07-02
SE415304B (en) 1980-09-22
NL190131B (en) 1993-06-01
CA1083714A (en) 1980-08-12
JPS625894A (en) 1987-01-12

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