FR2548857B1 - PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD - Google Patents
PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARDInfo
- Publication number
- FR2548857B1 FR2548857B1 FR8311210A FR8311210A FR2548857B1 FR 2548857 B1 FR2548857 B1 FR 2548857B1 FR 8311210 A FR8311210 A FR 8311210A FR 8311210 A FR8311210 A FR 8311210A FR 2548857 B1 FR2548857 B1 FR 2548857B1
- Authority
- FR
- France
- Prior art keywords
- continuous manufacture
- printed card
- printed
- card
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8311210A FR2548857B1 (en) | 1983-07-04 | 1983-07-04 | PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD |
CH2911/84A CH656285A5 (en) | 1983-07-04 | 1984-06-16 | PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CIRCUIT AND USE OF THIS CIRCUIT. |
NL8402040A NL8402040A (en) | 1983-07-04 | 1984-06-28 | PROCESS FOR CONTINUOUS MANUFACTURE OF A PRINTED CIRCUIT AND USE OF THIS CIRCUIT. |
DE19843424241 DE3424241A1 (en) | 1983-07-04 | 1984-06-30 | Automated production method for a printed circuit or printed-circuit board, and the field of applicability of the said printed circuit or printed-circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8311210A FR2548857B1 (en) | 1983-07-04 | 1983-07-04 | PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2548857A1 FR2548857A1 (en) | 1985-01-11 |
FR2548857B1 true FR2548857B1 (en) | 1987-11-27 |
Family
ID=9290556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8311210A Expired FR2548857B1 (en) | 1983-07-04 | 1983-07-04 | PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH656285A5 (en) |
DE (1) | DE3424241A1 (en) |
FR (1) | FR2548857B1 (en) |
NL (1) | NL8402040A (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2579798B1 (en) * | 1985-04-02 | 1990-09-28 | Ebauchesfabrik Eta Ag | METHOD FOR MANUFACTURING ELECTRONIC MODULES FOR MICROCIRCUIT CARDS AND MODULES OBTAINED ACCORDING TO THIS METHOD |
FR2580416B1 (en) * | 1985-04-12 | 1987-06-05 | Radiotechnique Compelec | METHOD AND DEVICE FOR MANUFACTURING AN ELECTRONIC IDENTIFICATION CARD |
FR2615325A1 (en) * | 1987-05-15 | 1988-11-18 | Neiman Sa | Method for producing power components intended for the automobile industry |
US5304513A (en) * | 1987-07-16 | 1994-04-19 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame |
DE3723547C2 (en) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Carrier element for installation in ID cards |
FR2620586A1 (en) * | 1987-09-14 | 1989-03-17 | Em Microelectronic Marin Sa | METHOD FOR MANUFACTURING ELECTRONIC MODULES, IN PARTICULAR FOR MICROCIRCUIT CARDS |
US4996629A (en) * | 1988-11-14 | 1991-02-26 | International Business Machines Corporation | Circuit board with self-supporting connection between sides |
EP0472766A1 (en) * | 1990-08-30 | 1992-03-04 | Siemens Aktiengesellschaft | Process for encapsulating a contacted semiconductor chip |
FR2671418B1 (en) * | 1991-01-04 | 1995-03-24 | Solais | PROCESS FOR THE MANUFACTURE OF A MEMORY CARD AND MEMORY CARD THUS OBTAINED. |
DE4326816A1 (en) * | 1993-08-10 | 1995-02-16 | Giesecke & Devrient Gmbh | Electronic module for cards and manufacture of such a module |
DE69512137T2 (en) * | 1994-06-15 | 2000-05-25 | Rue Cartes Et Systemes Paris D | Manufacturing process and assembly for IC card. |
DE19532223C1 (en) * | 1995-09-01 | 1996-11-21 | Orga Kartensysteme Gmbh | Chip card contg. chip module embedded in card having at least two metallisation areas |
FR2736740A1 (en) * | 1995-07-11 | 1997-01-17 | Trt Telecom Radio Electr | PROCESS FOR PRODUCING AND ASSEMBLING INTEGRATED CIRCUIT BOARD AND CARD THUS OBTAINED |
JP2001521649A (en) * | 1995-12-22 | 2001-11-06 | センパック ソシエテ アノニム | Manufacturing method of chip card using non-contact technology |
ATE207243T1 (en) | 1996-05-17 | 2001-11-15 | Infineon Technologies Ag | CARRIER ELEMENT FOR A SEMICONDUCTOR CHIP |
US6077022A (en) * | 1997-02-18 | 2000-06-20 | Zevatech Trading Ag | Placement machine and a method to control a placement machine |
US6157870A (en) * | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
ATE361549T1 (en) | 1997-12-07 | 2007-05-15 | Oerlikon Assembly Equipment Ag | SEMICONDUCTOR ASSEMBLY DEVICE HAVING A RECITAL CHIP GRIPPER |
US6031242A (en) * | 1998-01-23 | 2000-02-29 | Zevatech, Inc. | Semiconductor die in-flight registration and orientation method and apparatus |
SG71189A1 (en) * | 1998-01-26 | 2000-03-21 | Esec Sa | Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder |
DE10318688A1 (en) * | 2003-04-24 | 2004-11-25 | W. C. Heraeus Gmbh & Co. Kg | Method for separating the electrical connection nodes in IC frames and method for producing an electronic component and frames therefor |
EP3726415A1 (en) * | 2019-04-18 | 2020-10-21 | Thales Dis France SA | Security element on module |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3315133A (en) * | 1965-09-29 | 1967-04-18 | Motorola Inc | Integrated circuit interconnect and method |
US3448516A (en) * | 1966-02-14 | 1969-06-10 | Norman R Buck | Method of preparing printed wiring |
DE2151765C2 (en) * | 1970-11-05 | 1983-06-16 | Honeywell Information Systems Italia S.p.A., Caluso, Torino | Method for contacting integrated circuits with beam lead connections |
FR2210882A1 (en) * | 1972-12-15 | 1974-07-12 | Fortin Laminating Corp | Metal faced laminate - for making printed circuits |
DE2214163A1 (en) * | 1972-03-23 | 1973-10-11 | Bosch Gmbh Robert | ELECTRICAL CIRCUIT ARRANGEMENT |
FR2337381A1 (en) * | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD |
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
DE2854271A1 (en) * | 1977-12-14 | 1979-06-28 | Fontainemelon Horlogerie | METHOD OF MANUFACTURING AN ELECTRONIC MODULE FOR WATCHES |
DE2920012B1 (en) * | 1979-05-17 | 1980-11-20 | Gao Ges Automation Org | ID card with IC module and method for producing such an ID card |
FR2487152A1 (en) * | 1980-07-17 | 1982-01-22 | Ebauchesfabrik Eta Ag | Printed circuit substrate and component support mfr. - uses mask applied over substrate over which conductive layer is deposited and from which unwanted parts of layer are removed |
DE3051195C2 (en) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Package for integrated circuit incorporated in identity cards |
-
1983
- 1983-07-04 FR FR8311210A patent/FR2548857B1/en not_active Expired
-
1984
- 1984-06-16 CH CH2911/84A patent/CH656285A5/en not_active IP Right Cessation
- 1984-06-28 NL NL8402040A patent/NL8402040A/en not_active Application Discontinuation
- 1984-06-30 DE DE19843424241 patent/DE3424241A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
CH656285A5 (en) | 1986-06-13 |
DE3424241C2 (en) | 1992-05-14 |
DE3424241A1 (en) | 1985-01-17 |
FR2548857A1 (en) | 1985-01-11 |
NL8402040A (en) | 1985-02-01 |
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