DE3424241C2 - - Google Patents

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Publication number
DE3424241C2
DE3424241C2 DE3424241A DE3424241A DE3424241C2 DE 3424241 C2 DE3424241 C2 DE 3424241C2 DE 3424241 A DE3424241 A DE 3424241A DE 3424241 A DE3424241 A DE 3424241A DE 3424241 C2 DE3424241 C2 DE 3424241C2
Authority
DE
Germany
Prior art keywords
carrier
electronic component
connecting wires
breakthrough
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3424241A
Other languages
German (de)
Other versions
DE3424241A1 (en
Inventor
Jean Neuchatel Ch Schindelholz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CICOREL S.A., CRISSIER, CH
Original Assignee
Cables Cortaillod Sa Cortaillod Ch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9290556&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3424241(C2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cables Cortaillod Sa Cortaillod Ch filed Critical Cables Cortaillod Sa Cortaillod Ch
Publication of DE3424241A1 publication Critical patent/DE3424241A1/en
Application granted granted Critical
Publication of DE3424241C2 publication Critical patent/DE3424241C2/de
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
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    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/85205—Ultrasonic bonding
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

Die vorliegende Erfindung betrifft ein Herstellungs­ verfahren für eine Kreditkarte oder dergleichen, wobei auf eine Seite eines Trägers, der einen Durchbruch zur Aufnahme der elektronischen Komponente sowie deren Verbindungsdrähtchen aufweist, eine Metallschicht auf­ geklebt wird, welche dann chemisch geätzt wird, wobei leitende Bereiche und nichtleitende Streifen geschaf­ fen werden, wonach die elektronische Komponente auf dem Träger montiert wird und die Kontaktierung der Verbindungsdrähtchen vorgenommen wird, wonach ab­ schließend der Durchbruch vergossen wird.The present invention relates to a manufacturing procedure for a credit card or the like, wherein on one side of a carrier who made a breakthrough to Recording of the electronic component and its Has connecting wire, a metal layer is glued, which is then chemically etched, whereby conductive areas and non-conductive strips created be opened, after which the electronic component the carrier is mounted and the contacting of the Connection wire is made, after which finally the breakthrough is shed.

Aus der DE 30 29 667 ist ein derartiges Herstellungs­ verfahren bekannt. Hierbei weist jedoch der Grundkör­ per eine komplizierte Spinnenform auf und die Vorbe­ reitung des Grundkörpers ist aufwendig. Dieses Verfah­ ren ist daher insgesamt relativ aufwendig und teuer.Such a manufacture is known from DE 30 29 667 known procedure. Here, however, the basic body with a complicated spider shape and the past Riding the main body is complex. This procedure ren is therefore relatively complex and expensive.

In der DE 21 52 081 ist ein Verfahren zum Anbringen von Chips mit integrierter Schaltung auf Zwischenver­ bindungsträger beschrieben.DE 21 52 081 describes a method for attachment of chips with integrated circuit on intermediate bond carrier described.

Aus der DE 29 20 012 ist eine Ausweiskarte mit IC-Bau­ steinen und ein Verfahren zur Herstellung einer der­ artigen Ausweiskarte bekannt, bei der die Verbindung zwischen dem Trägerelement mit dem IC-Baustein und dem Kartenkörper so gestaltet ist, daß sie auch starken Biegewechselbelastungen standhält.DE 29 20 012 is an ID card with IC construction  stones and a method of making one of the known ID card, in which the connection between the carrier element with the IC chip and the Card body is designed so that it is also strong Withstand alternating bending loads.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, die Kontaktierung zwischen den Verbindungsdrähtchen und den Leiterbahnen dahingehend zu verbessern, daß einerseits die Steuerung der Kontaktierungsanlage vereinfacht und andererseits der Grundkörper mit den entsprechenden Aussparungen zur Aufnah­ me des integrierten Schaltkreises fertigungstechnisch billiger ist, wobei auch die Möglichkeit zu einem möglichst dünnen Aufbau gegeben sein soll.The present invention is based on the object the contact between the connecting wires and to improve the conductor tracks in such a way that on the one hand, the control of the contacting system is simplified, and on the other hand the basic body with the corresponding recesses for receiving me of the integrated circuit manufacturing technology is cheaper, with the possibility of one should be as thin as possible.

Erfindungsgemäß wird diese Aufgabe durch die im kenn­ zeichnenden Teil von Anspruch 1 genannten Merkmale ge­ löst.According to the invention, this object is achieved by the drawing part of claim 1 mentioned features ge solves.

Durch das erfindungsgemäße Herstellungsverfahren wird einerseits das Fertigungsverfahren vereinfacht, weil die Anlage zum Kontaktieren der Anschlußkontaktdrähte mit der leitenden Folie, d. h. den Leiterbahnen, ein­ facher zu programmieren bzw. zu steuern ist, und an­ dererseits ist die Vorbereitung des Halbzeugträger­ films bzw. des folienartigen Grundkörpers erheblich einfacher, da die Form der Aussparung mit den finger­ förmigen Fortsätzen wesentlich einfacher herzustellen ist.Through the manufacturing method according to the invention on the one hand simplifies the manufacturing process because the system for contacting the connecting contact wires with the conductive film, d. H. the conductor tracks is easier to program or control, and on on the other hand is the preparation of the semi-finished product carrier films or the film-like base body considerably easier because the shape of the recess with your fingers shaped extensions much easier to manufacture is.

Ein weiterer wesentlicher Vorteil des erfindungsge­ mäßen Herstellungsverfahrens liegt auch darin, daß die Kreditkarte in ihrer Gesamthöhe geringer ist, da das fertige Trägerelement im Vergleich zu Lösungen nach dem Stand der Technik dünner ist.Another major advantage of the fiction The manufacturing process also lies in the fact that the Credit card in its total amount is lower since that finished carrier element compared to solutions the prior art is thinner.

Bei einer bevorzugten Ausführungsart erfolgt das Anlö­ ten der Drähtchen mittels Ultraschallschwingungen auf die zu verlötenden Flächen.In a preferred embodiment, the triggering takes place the wires by means of ultrasonic vibrations  the areas to be soldered.

Bei einer weiteren Ausführungsart kann das Verlöten der Verbindungsdrähtchen über Thermokompression erfol­ gen.In another embodiment, soldering can be done the connecting wire via thermocompression gene.

Das Ankleben der elektrisch leitenden Folie erfolgt dadurch, daß man den Träger erhitzt und die Folie ge­ gen eine Fläche dieses Trägers drückt.The electrically conductive film is glued on by heating the carrier and ge against a surface of this support.

Nachfolgend ist anhand der Zeichnung ein Ausführungs­ beispiel der Erfindung beschrieben.Below is an execution based on the drawing example of the invention described.

Fig. 1 zeigt die Leiterplatte von oben; Fig. 1 shows the circuit board from above;

Fig. 2 vermittelt von unten eine Ansicht der Leiterplatte aus Fig. 1; Fig. 2 provides a bottom view of the circuit board of Fig. 1;

Fig. 3 gibt den diametralen Querschnitt der in der Herstellung befindlichen Leiterplatte wieder und zeigt die durch Drähtchen hergestellte Verbindung mit der elektronischen Komponente; Fig. 3 shows the diametrical cross section of the printed circuit board being manufactured and shows the connection made by wire to the electronic component;

Fig. 4 zeigt eine diametralen Querschnitt der Leiterplatte aus Fig. 3, nachdem sie vollständig fertiggestellt ist. FIG. 4 shows a diametrical cross section of the circuit board from FIG. 3 after it has been completely finished.

Bezugsnehmend auf die Figuren, besteht die Leiterplatte aus einem Träger 10, welcher mit Querperforationen 12 versehen worden ist, die z. B. rund sind, und welcher in der Mitte eine Aussparung 13 aufweist, die z. B. die Form eines Rechteckes hat. Die Querperforationen sind dazu da, daß die Verbindungsdrähtchen einer integrierten Schaltung oder einer jeglichen anderen elektronischen Komponente, die in der Aussparung 13 untergebracht wird, hindurchgeführt werden können.Referring to the figures, the circuit board consists of a carrier 10 which has been provided with transverse perforations 12 which, for. B. are round, and which has a recess 13 in the middle, the z. B. has the shape of a rectangle. The transverse perforations are there so that the connecting wires of an integrated circuit or any other electronic component which is accommodated in the recess 13 can be passed through.

Fig. 2 zeigt dieselbe Leiterplatte von unten. Sie besteht aus einer leitenden Mittelzone 14 und einem ganzen Komplex von Leiterbahnen 15, welche durch nicht leitende Streifen 16 getrennt sind und von denen jede zu einer gestrichelt dargestellten Querperforation 12 gehört. Fig. 2 shows the same circuit board from below. It consists of a conductive central zone 14 and a whole complex of conductor tracks 15 which are separated by non-conductive strips 16 and each of which belongs to a transverse perforation 12 shown in broken lines.

Wie vorher erwähnt und besonders in Fig. 3 dargestellt, wird auf der Unterseite des in einer Reihe in gleichmäßigen Abständen gestanzten Trägers 10, der zuvor mit den Querperforationen 12 und der in der Mitte befindlichen Aussparung 13 versehen worden ist, eine elektrisch leitende Folie angebracht, die einer chemischen Behandlung unterzogen wird, wodurch man die leitenden seitlichen Bereiche und/oder die Leiterbahnen 15, die leitende Mittelzone 14 und die nicht leitenden Streifen 16 erhält. Diese Kupferfolie der Stärke 70 µm kann mit Aluminium oder Gold beschichtet sein.As previously mentioned and particularly shown in FIG. 3, an electrically conductive film is applied to the underside of the carrier 10 , which is punched in a row at uniform intervals and has previously been provided with the transverse perforations 12 and the recess 13 located in the middle, which is subjected to a chemical treatment, whereby the conductive lateral areas and / or the conductor tracks 15 , the conductive central zone 14 and the non-conductive strips 16 are obtained. This copper foil with a thickness of 70 µm can be coated with aluminum or gold.

In der in der Mitte befindlichen Aussparung 13 ist eine integrierte Schaltung 17 untergebracht. In dem gezeigten Beispiel ist diese Schaltung mit Verbindungsdrähtchen 18 ausgestattet, deren Enden in die Querperforationen 12 des Trägers 10 hineingeführt werden, unter Berührung der Innenseite der elektrisch leitenden Folie, die auf der Unterseite dieses Trägers angebracht ist. Die schematisch dargestellten Werkzeuge 19 werden dazu benötigt, die Enden der Verbindungsdrähtchen 18 auf den leitenden Seitenbahnen zu befestigen. An integrated circuit 17 is accommodated in the recess 13 located in the middle. In the example shown, this circuit is equipped with connecting wires 18 , the ends of which are inserted into the transverse perforations 12 of the carrier 10 , while touching the inside of the electrically conductive film which is attached to the underside of this carrier. The schematically illustrated tools 19 are required to fasten the ends of the connecting wires 18 on the conductive side tracks.

Zum Herstellen der Drähtchenverbindungen verwendet man vorzugsweise Instrumente, die das Verlöten mit Ultraschall oder durch Thermokompression ermöglichen. Diese Technik der Drähtchenverbindungen ist unter der Bezeichnung "bonding" bekannt.It is preferred to use for making the wire connections Instruments that use ultrasound or by soldering Enable thermocompression. This technique of wire connections is known under the name "bonding".

Die integrierte Schaltung 17 kann bereits mit Drähtchen ausgestattet sein, wenn sie in der Aussparung untergebracht wird, sie kann aber auch nur mit Aluminium beschichtete Kontakte haben, auf welche man ein Ende der Drähtchenverbindung lötet.The integrated circuit 17 can already be equipped with wires if it is accommodated in the recess, but it can also have only contacts coated with aluminum, to which one end of the wire connection is soldered.

Wenn die Befestigung der Verbindungsdrähtchen 18 vollständig abgeschlossen ist, werden die integrierte Schaltung 17 und ihre Drähtchenverbindungen verkapselt, und zwar mittels einer Harzschicht 20 oder ähnlichem, wie in Fig. 4 dargestellt.When the connection wires 18 are completely attached, the integrated circuit 17 and its wire connections are encapsulated by means of a resin layer 20 or the like, as shown in FIG. 4.

Besagte gedruckte Schaltung, die sehr dünn ist, findet vorteilhafterweise als Kodeschlüssel bei einer Kreditkarte Verwendung. Zu diesem Zweck ist sie in einer der Kartenstücke entsprechenden Aussparung untergebracht. Die Karte ist z. B. aus synthetischem Material hergestellt.Said printed circuit, which is very thin, advantageously takes place as a code key when using a credit card. For this purpose it is corresponding in one of the card pieces Recess housed. The card is e.g. B. from synthetic Made of material.

Es versteht sich von selbst, daß dieses Herstellungsverfahren für gedruckte Schaltungen auch in anderen Bereichen Verwendung findet. Es kann besonders dafür verwendet werden, die komplizierte und kostspielige Herstellung von mit Metall ausgekleideten Löchern bei einem Träger zu ersetzen, der auf jeder seiner Seiten Leiterornamente hat.It goes without saying that this manufacturing process for printed circuits also in other areas Is used. It can be used especially for this the complicated and costly manufacture of using Metal lined holes to replace a beam that has ornaments on each of its sides.

Claims (4)

1. Herstellungsverfahren für eine Kreditkarte oder dergleichen, wobei auf eine Seite eines Trägers, der einen Durchbruch zur Aufnahme der elektro­ nischen Komponente sowie deren Verbindungsdrähtchen aufweist, eine Metallschicht aufgeklebt wird, wel­ che dann chemisch geätzt wird, wobei leitende Be­ reiche und nichtleitende Streifen geschaffen wer­ den, wonach die elektronische Komponente auf dem Träger montiert wird und die Kontaktierung der Ver­ bindungsdrähtchen vorgenommen wird, wonach ab­ schließend der Durchbruch vergossen wird, dadurch gekennzeichnet, daß in den Träger (10) zusätzlich zu dem Durchbruch da­ von getrennte Durchgangsbohrungen (12) eingestanzt werden, daß nach der Montage der elektronischen Komponente (17) dessen Verbindungsdrähtchen (18) mit der Innenseite der leitenden Bereiche (15) über die Durchgangsbohrungen (12) in Verbindung gelan­ gen, und daß abschließend die elektronische Kompo­ nente (17), ihre Verbindungsdrähtchen (18) und die Bereiche des Trägers (10), die sich zwischen dem Durchbruch und den Durchgangsbohrungen (12) befin­ den, vergossen werden. 1. Manufacturing method for a credit card or the like, wherein on one side of a carrier which has a breakthrough for receiving the electronic component and its connecting wires, a metal layer is glued on, which is then chemically etched, creating conductive areas and non-conductive strips who who, after which the electronic component is mounted on the carrier and the contacting of the Ver connecting wires is made, after which the breakthrough is finally shed, characterized in that in the carrier ( 10 ) in addition to the breakthrough there by separate through holes ( 12 ) are punched in that after assembly of the electronic component ( 17 ) whose connecting wire ( 18 ) with the inside of the conductive areas ( 15 ) via the through holes ( 12 ) in gene, and that finally the electronic component ( 17 ), their Connecting wire ( 18 ) and the area che of the carrier ( 10 ), which are between the opening and the through holes ( 12 ), are shed. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Verlöten der Verbindungsdrähtchen (18) durch Ultraschallschwingungen auf die zu lötenden Flächen erfolgt.2. The method according to claim 1, characterized in that the soldering of the connecting wires ( 18 ) is carried out by ultrasonic vibrations on the surfaces to be soldered. 3. Verfahren gemäß Anspruch 1, dadurch gekennzeichnet, daß das Anlöten der Verbindungsdrähtchen (18) durch Thermokompression erfolgt.3. The method according to claim 1, characterized in that the soldering of the connecting wires ( 18 ) is carried out by thermocompression. 4. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Ankleben der elektrisch leitenden Folie dadurch erfolgt, daß man den Träger erhitzt und diese Folie gegen eine Fläche des Trägers drückt.4. The method according to claim 1, characterized in that thereby sticking the electrically conductive film takes place that one heats the carrier and this film presses against a surface of the carrier.
DE19843424241 1983-07-04 1984-06-30 Automated production method for a printed circuit or printed-circuit board, and the field of applicability of the said printed circuit or printed-circuit board Granted DE3424241A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8311210A FR2548857B1 (en) 1983-07-04 1983-07-04 PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD

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DE3424241A1 DE3424241A1 (en) 1985-01-17
DE3424241C2 true DE3424241C2 (en) 1992-05-14

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CH (1) CH656285A5 (en)
DE (1) DE3424241A1 (en)
FR (1) FR2548857B1 (en)
NL (1) NL8402040A (en)

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Also Published As

Publication number Publication date
CH656285A5 (en) 1986-06-13
NL8402040A (en) 1985-02-01
FR2548857A1 (en) 1985-01-11
FR2548857B1 (en) 1987-11-27
DE3424241A1 (en) 1985-01-17

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