CH656285A5 - PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CIRCUIT AND USE OF THIS CIRCUIT. - Google Patents

PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CIRCUIT AND USE OF THIS CIRCUIT. Download PDF

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Publication number
CH656285A5
CH656285A5 CH2911/84A CH291184A CH656285A5 CH 656285 A5 CH656285 A5 CH 656285A5 CH 2911/84 A CH2911/84 A CH 2911/84A CH 291184 A CH291184 A CH 291184A CH 656285 A5 CH656285 A5 CH 656285A5
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CH
Switzerland
Prior art keywords
substrate
electrically conductive
connection
conductive sheet
printed circuit
Prior art date
Application number
CH2911/84A
Other languages
French (fr)
Inventor
Jean Schindelholz
Original Assignee
Cortaillod Cables Sa
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Application filed by Cortaillod Cables Sa filed Critical Cortaillod Cables Sa
Publication of CH656285A5 publication Critical patent/CH656285A5/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/852—Applying energy for connecting
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/85205—Ultrasonic bonding
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    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
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    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

La présente invention concerne un procédé de fabrication en continu d'un circuit imprimé comportant un substrat, un ensemble de pistes conductrices disposées sur une des faces de ce substrat, au moins un composant électronique disposé sur l'autre face du substrat et des microfils en or ou en aluminium pour raccorder les plages de connexion dudit composant auxdites pistes conductrices, dans lequel on réalise dans le substrat un ensemble de perforations transversales dont les positions correspondent aux positions finales des extrémités libres desdits microfils, lorsque le composant est monté sur le circuit, on rapporte une feuille électriquement conductrice contre l'une des faces du substrat, on met en place le composant électronique sur l'autre face du substrat de manière à amener les extrémités libres de ces microfils dans les perforations transversales du substrat, en contact avec la surface intérieure de la feuille électriquement conductrice pour réaliser lesdites pistes conductrices de l'une des faces du substrat, et on procède à un encapsulage dudit composant électronique et de ses microfils de raccordement. The present invention relates to a continuous manufacturing process of a printed circuit comprising a substrate, a set of conductive tracks arranged on one side of this substrate, at least one electronic component disposed on the other side of the substrate and microfibers in gold or aluminum to connect the connection pads of said component to said conductive tracks, in which a set of transverse perforations is made in the substrate, the positions of which correspond to the final positions of the free ends of said microfilaments, when the component is mounted on the circuit, an electrically conductive sheet is attached against one of the faces of the substrate, the electronic component is placed on the other face of the substrate so as to bring the free ends of these microfilaments into the transverse perforations of the substrate, in contact with the inner surface of the electrically conductive sheet for making said conductive tracks of one of the faces of the substrate, and one proceeds to an encapsulation of said electronic component and of its connecting microfils.

On connaît déjà de nombreux procédés de réalisation de circuits imprimés comportant un substrat servant de support à une ou plusieurs pistes conductrices sur chacune de leurs faces. Les circuits comportant des plages conductrices sur l'une de leurs faces et des composants électroniques sur la face opposée sont généralement pourvus de trous métallisés qui permettent de raccorder les bornes desdits composants auxdites plages conductrices. La réalisation des trous métallisés constitue une opération coûteuse dans la fabrication automatique de ces circuits selon des procédés continus. Or, on constate que ce type de circuits imprimés trouve une application très importante dans la fabrication des cartes de crédit qui constituent déjà et de plus en plus un mode de paiement fort utilisé dans certains pays. Ces cartes constituées par un support plan, par exemple en matière synthétique, comportent une zone dans laquelle est encastré un circuit imprimé raccordé à au moins un circuit intégré et comportant un ensemble de plages conductrices destinées à connecter le circuit intégré à un appareil de décodage pouvant être disposé dans une banque, une surface de vente, etc., et qui est en liaison avec un fichier informatique central sur lequel sont enregistrées notamment les informations bancaires concernant le titulaire de la carte. Un des systèmes envisagés consiste à remettre à jour mensuellement la carte de crédit, c'est-à-dire à la coder de telle manière qu'elle porte l'information relative au montant mensuel pouvant être dépensé à l'aide de la carte de crédit, cette carte permettant de faire tous les paiements pendant un mois jusqu'à épuisement du montant mémorisé. Numerous methods are already known for producing printed circuits comprising a substrate serving as a support for one or more conductive tracks on each of their faces. The circuits comprising conductive pads on one of their faces and electronic components on the opposite face are generally provided with metallized holes which make it possible to connect the terminals of said components to said conductive pads. The production of metallized holes is an expensive operation in the automatic manufacture of these circuits according to continuous processes. However, it is noted that this type of printed circuits finds a very important application in the manufacture of credit cards which already constitute and increasingly a strong method of payment used in certain countries. These cards constituted by a flat support, for example made of synthetic material, include an area in which is embedded a printed circuit connected to at least one integrated circuit and comprising a set of conductive pads intended to connect the integrated circuit to a decoding device capable of be arranged in a bank, a sales area, etc., and which is linked to a central computer file on which the bank information concerning the card holder is recorded in particular. One of the systems envisaged consists in updating the credit card monthly, that is to say in coding it in such a way that it carries the information relating to the monthly amount that can be spent using the credit card. credit, this card making it possible to make all payments for one month until the stored amount is used up.

Une telle utilisation, destinée à un public très large, nécessite un grand nombre de circuits imprimés qui doivent pouvoir être fabriqués à des prix de revient extrêmement bas. Such use, intended for a very wide audience, requires a large number of printed circuits which must be able to be manufactured at extremely low cost prices.

La présente invention a pour objet de résoudre ce problème en proposant un procédé de fabrication en continu, entièrement automatique, qui permet de réaliser un produit fiable pour un coût relativement modeste. The object of the present invention is to solve this problem by proposing a continuous, fully automatic manufacturing process which makes it possible to produce a reliable product at a relatively modest cost.

Dans ce but, le procédé selon l'invention est caractérisé en ce que l'on fixe les extrémités libres des microfils de raccordement contre la surface intérieure de la feuille électriquement conductrice par soudure. For this purpose, the method according to the invention is characterized in that the free ends of the connection microfilms are fixed against the inner surface of the electrically conductive sheet by welding.

La présente invention concerne également une carte de crédit munie d'un circuit imprimé réalisé selon ce procédé constituant une clé de codage. The present invention also relates to a credit card provided with a printed circuit produced according to this method constituting a coding key.

La présente invention sera mieux comprise en référence à la description d'un exemple de réalisation préférée et du dessin annexé dans lequel: The present invention will be better understood with reference to the description of a preferred embodiment and of the accompanying drawing in which:

La fig. 1 représente une vue de dessous du circuit imprimé selon l'invention, Fig. 1 represents a bottom view of the printed circuit according to the invention,

la fig. 2 représente une vue de dessus du circuit imprimé selon la fig-1, fig. 2 represents a top view of the printed circuit according to FIG. 1,

la fig. 3 représente une vue en coupe diamétrale du circuit imprimé selon l'invention avec liaison par microfils avec le composant électronique, en cours de fabrication, et la fig. 4 représente une vue en coupe diamétrale du circuit imprimé de la fig. 3 entièrement terminé. fig. 3 shows a diametrical sectional view of the printed circuit according to the invention with connection by microfils with the electronic component, during manufacture, and FIG. 4 shows a diametrical sectional view of the printed circuit of FIG. 3 fully finished.

En référence aux figures, le circuit imprimé comporte un substrat 10 dans lequel ont été réalisées des perforations transversales 12, par exemple circulaires et un évidement central 13, ayant par exemple une forme rectangulaire. Les perforations transversales 12 sont destinées à permettre le passage des microfils de raccordement d'un circuit intégré ou de tout autre composant électronique prévu pour être logé dans l'évidement 13. With reference to the figures, the printed circuit comprises a substrate 10 in which transverse perforations 12, for example circular perforations, have been made and a central recess 13, for example having a rectangular shape. The transverse perforations 12 are intended to allow the passage of the connection microfibers of an integrated circuit or of any other electronic component intended to be housed in the recess 13.

La fig. 2 représente ce même circuit imprimé vu de dessus comportant une plage conductrice centrale 14 et un ensemble de pistes conductrices latérales 15 séparées par des zones non conductrices 16, et correspondant chacune à une perforation transversale 12 représentée en traits interrompus. Fig. 2 shows this same printed circuit seen from above comprising a central conductive pad 14 and a set of lateral conductive tracks 15 separated by non-conductive zones 16, and each corresponding to a transverse perforation 12 shown in broken lines.

Comme mentionné précédemment et illustré plus particulièrement par la fig. 3, le substrat 10 découpé dans une bande défilant en continu, préalablement usiné de manière à réaliser les perforations transversales 12 et l'évidement central 13, est revêtu sur sa face inférieure d'une feuille électriquement conductrice qui est soumise à un usinage chimique permettant de réaliser les plages et/ou pistes conductrices latérales 15, la plage conductrice centrale 14 et les zones isolantes 16. Cette feuille de cuivre ayant une épaisseur de l'ordre de 70 |im peut comporter un revêtement en aluminium ou un revêtement en or. As mentioned previously and illustrated more particularly by FIG. 3, the substrate 10 cut from a continuously moving strip, previously machined so as to produce the transverse perforations 12 and the central recess 13, is coated on its underside with an electrically conductive sheet which is subjected to chemical machining allowing to produce the lateral conductive pads and / or tracks 15, the central conductive pad 14 and the insulating zones 16. This copper sheet having a thickness of the order of 70 μm may include an aluminum coating or a gold coating.

Un circuit intégré 17 est logé dans l'évidement central 13. Dans l'exemple illustré, ce circuit est pourvu de microfils de raccordement 18 dont les extrémités sont amenées dans les perforations transversales 12 du substrat 10 en contact avec la surface intérieure de la feuille électriquement conductrice plaquée contre la surface inférieure de ce substrat. Des moyens de liaison, représentés schématiquement par An integrated circuit 17 is housed in the central recess 13. In the example illustrated, this circuit is provided with connection microfibers 18, the ends of which are brought into the transverse perforations 12 of the substrate 10 in contact with the inner surface of the sheet. electrically conductive pressed against the lower surface of this substrate. Connection means, represented schematically by

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20 ; 20;

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656285 656285

les outils 19, sont utilisés pour fixer les extrémités des microfils de raccordement 18 aux plages conductrices 15. the tools 19 are used to fix the ends of the connection microfils 18 to the conductive pads 15.

Les moyens de liaison sont avantageusement constitués par des sonotrodes, permettant d'effectuer une soudure par ultrasons, ou des organes de soudure par thermocompression. Cette technique de liaison de microfils est connue sous la dénomination «bonding». The connection means are advantageously constituted by sonotrodes, making it possible to perform ultrasonic welding, or welding members by thermocompression. This microfilm bonding technique is known under the name "bonding".

Le circuit intégré 17 peut être équipé de microfils au moment de sa mise en place dans la cavité, mais peut également ne comporter que des bornes de raccordement revêtues d'une couche d'aluminium, auxquelles on soude une extrémité des microfils de liaison. The integrated circuit 17 can be equipped with microfibers when it is placed in the cavity, but can also include only connection terminals coated with an aluminum layer, to which one end of the bonding microfibers is welded.

Lorsque la fixation des microfils de liaison 18 est entièrement terminée, le circuit intégré 17 ainsi que ses fils de raccordement sont encapsulés au moyen d'une couche de résine 20 ou similaire, illustrée par la fig. 4. When the attachment of the bonding microfibers 18 is completely finished, the integrated circuit 17 as well as its connection wires are encapsulated by means of a layer of resin 20 or the like, illustrated in FIG. 4.

Ce circuit imprimé de faible épaisseur est avantageusement utilisé comme clé de codage d'une carte de crédit. A cet effet, il est 5 encastré dans un évidement approprié ménagé dans l'épaisseur d'une telle carte réalisée par exemple en matière synthétique. • This thin printed circuit is advantageously used as a coding key for a credit card. For this purpose, it is embedded in a suitable recess made in the thickness of such a card made for example of synthetic material. •

Il est bien entendu que ce procédé de fabrication de circuits imprimés trouve également d'autres utilisations. En particulier, il peut io être utilisé de manière systématique pour remplacer la réalisation complexe et coûteuse de trous métallisés à travers un substrat portant des circuits imprimés sur chacune de ses faces. It is understood that this method of manufacturing printed circuits also finds other uses. In particular, it can be used systematically to replace the complex and costly production of metallized holes through a substrate carrying printed circuits on each of its faces.

2 feuilles dessins 2 sheets of drawings

Claims (5)

656285656285 1. Procédé de fabrication en continu d'un circuit imprimé comportant un substrat, un ensemble de pistes conductrices disposées sur une des faces de ce substrat, au moins un composant électronique disposé sur l'autre face du substrat et des microfils en or ou en aluminium pour raccorder les plages de connexion dudit composant auxdites pistes conductrices, dans lequel on réalise dans le substrat un ensemble de perforations transversales dont les positions correspondent aux positions finales des extrémités libres desdits microfils, lorsque le composant est monté sur le circuit, on rapporte une feuille électriquement conductrice contre l'une des faces du substrat, on met en place le composant électronique sur l'autre face du substrat de manière à amener les extrémités libres de ces microfils dans les perforations transversales du substrat, en contact avec la surface intérieure de la feuille électriquement conductrice, on procède à un usinage chimique de la feuille électriquement conductrice pour réaliser lesdites pistes conductrices de l'une des faces du substrat, et on procède à un encapsulage dudit composant électronique et de ses microfils de raccordement, caractérisé en ce que l'on fixe les extrémités libres des microfils de raccordement contre la surface intérieure de la feuille électriquement conductrice par soudure. 1. A method of continuously manufacturing a printed circuit comprising a substrate, a set of conductive tracks arranged on one side of this substrate, at least one electronic component disposed on the other side of the substrate and gold or aluminum to connect the connection pads of said component to said conductive tracks, in which a set of transverse perforations is made in the substrate, the positions of which correspond to the final positions of the free ends of said microfilaments, when the component is mounted on the circuit, an electrically conductive sheet against one of the faces of the substrate, the electronic component is placed on the other face of the substrate so as to bring the free ends of these microfilaments into the transverse perforations of the substrate, in contact with the inner surface of the electrically conductive sheet, a chemical machining of the electrically conductive sheet is carried out e to produce said conductive tracks on one of the faces of the substrate, and an encapsulation of said electronic component and of its connection micro-wires is carried out, characterized in that the free ends of the connection micro-wires are fixed against the internal surface of the electrically conductive sheet by soldering. 2. Procédé selon la revendication 1, caractérisé en ce que la soudure des microfils de raccordement est effectuée par application de vibrations ultrasoniques sur les surfaces à souder. 2. Method according to claim 1, characterized in that the welding of the connection microwires is carried out by application of ultrasonic vibrations on the surfaces to be welded. 2 2 REVENDICATIONS 3. Procédé selon la revendication 1, caractérisé en ce que la soudure des microfils de raccordement est effectuée par thermocompression. 3. Method according to claim 1, characterized in that the welding of the connection microfils is carried out by thermocompression. 4. Procédé selon la revendication 1, caractérisé en ce que le collage de la feuille électriquement conductrice s'obtient par chauffage du substrat et application sous pression de cette feuille contre une surface du substrat. 4. Method according to claim 1, characterized in that the bonding of the electrically conductive sheet is obtained by heating the substrate and application under pressure of this sheet against a surface of the substrate. 5. Carte de crédit munie d'un circuit imprimé réalisé par le procédé selon l'une quelconque des revendications précédentes, constituant une clé de codage. 5. Credit card provided with a printed circuit produced by the method according to any one of the preceding claims, constituting a coding key.
CH2911/84A 1983-07-04 1984-06-16 PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CIRCUIT AND USE OF THIS CIRCUIT. CH656285A5 (en)

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NL8402040A (en) 1985-02-01
FR2548857A1 (en) 1985-01-11
DE3424241C2 (en) 1992-05-14
FR2548857B1 (en) 1987-11-27
DE3424241A1 (en) 1985-01-17

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