FR2548857A1 - Automatic production of printed circuit cards - Google Patents

Automatic production of printed circuit cards Download PDF

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Publication number
FR2548857A1
FR2548857A1 FR8311210A FR8311210A FR2548857A1 FR 2548857 A1 FR2548857 A1 FR 2548857A1 FR 8311210 A FR8311210 A FR 8311210A FR 8311210 A FR8311210 A FR 8311210A FR 2548857 A1 FR2548857 A1 FR 2548857A1
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FR
France
Prior art keywords
substrate
electrically conductive
electronic component
conductive sheet
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8311210A
Other languages
French (fr)
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FR2548857B1 (en
Inventor
Jean Schindelholz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cortaillod Cables SA
Original Assignee
Cortaillod Cables SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Cortaillod Cables SA filed Critical Cortaillod Cables SA
Priority to FR8311210A priority Critical patent/FR2548857B1/en
Priority to CH2911/84A priority patent/CH656285A5/en
Priority to NL8402040A priority patent/NL8402040A/en
Priority to DE19843424241 priority patent/DE3424241A1/en
Publication of FR2548857A1 publication Critical patent/FR2548857A1/en
Application granted granted Critical
Publication of FR2548857B1 publication Critical patent/FR2548857B1/en
Expired legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The automatic production of printed circuit cards uses a card with a carrier board (10) of insulating material that has apertures (12,13) for connection (18) and component (17) access. A thin foil (14) of conducting material is bonded to the carrier and is produced with isolating gaps (16). Typically the foil is produced from copper and is 70 microns thick. The integrated circuit elements are secured to the foil and the connecting wires (18) are bonded to the conductor tracks using insert tools (19). The bonding process may be performed using either ultrasonic or thermo compression techniques. The integrated circuit chip and connections are then covered by a layer of hard resin.

Description

PRCCEDE DE FA3RICATION EN CONTINU D'UNE CARTE IMPRIMEZ
La présente invention concerne un procédé de fabrication en continu d'une carte imprimée comportant un substrat, un ensemble de plages conductrices disposées sur une des faces de ce substrat, au moins un composant életronique disposé sur l'autre face et des moyens pour raccorder les bornes dudit composant auxdites plages conductrices correspondantes.CONTINUOUS MANUFACTURING PROCESS OF A PRINT CARD
The present invention relates to a continuous manufacturing process of a printed circuit board comprising a substrate, a set of conductive pads arranged on one of the faces of this substrate, at least one electronic component disposed on the other face and means for connecting the terminals of said component at said corresponding conductive pads.

On connaît dé39 de nombreux procédés de réalisation de cartes imprimées comportant un substrat servant de support & un ou plusieurs circuits imprimés sur chacune de leurs faces. Les cartes comportant des plages conductrices sur lune de leurs faces et des composants électroniques sur la face opposée sont généralc-ment pourvues de trous métallisés qui permettent de raccorder les bornes desdl-to composants auxdites plages conductrices La rhalisation des trous métallisés constitue une opération conteuse qui empêche la fabrication automatique de ces cartes selon des procédés continus.Or, on constate que ce type de cartes imprimées trouve une application très importante dans la fabrication des cartes de crédit qui constitueront très probablement un mode de paiement fort utilisé dans le proche avenir. Ces cartes constituées par un support plan, par exemple en matière synthé- tique, comportent une zone dans laquelle est encastrée une carte imprimée portant au moins un circuit intégré et un circuit imprimé comportant un ensemble de plages conductrices destinées & connecter le circuit intégré à un appareil de décodage pouvant être disposé dans une banque, une surface de vente etc..., et qui est en liaison avec un fichier informatique central sur lequel sont enregistrées notamment les informations bancaires concernant le titulaire de la carte.Un des systèmes envisagés consiste à remettre à Jour mensuellement la carte de crédit, c'est-à-dire à la coder de telle manière qu'elle porte l'information relative au montant mensuel pouvant être dépensé à l'aide de la carte de crédit, cette carte permettant de faire tous les paiements pendant un mois Jusqu'S épuisement du montant mémorisé.Numerous methods are known for producing printed boards comprising a substrate serving as a support & one or more printed circuits on each of their faces. The cards comprising conductive pads on one of their faces and electronic components on the opposite face are generally provided with metallized holes which make it possible to connect the terminals desdl-to components to said conductive pads The rhalisation of the metallized holes constitutes a storytelling operation which prevents the automatic production of these cards by continuous processes. However, we see that this type of printed cards finds a very important application in the manufacture of credit cards which will most likely constitute a strong method of payment used in the near future. These cards constituted by a flat support, for example made of synthetic material, comprise an area in which is embedded a printed card carrying at least one integrated circuit and a printed circuit comprising a set of conductive pads intended to connect the integrated circuit to a decoding device which can be placed in a bank, a sales area, etc., and which is linked to a central computer file on which the bank information concerning the card holder is recorded. One of the systems envisaged consists in update the credit card monthly, i.e. code it in such a way that it carries information relating to the monthly amount that can be spent using the credit card, this card making it possible to make all payments for one month Until the stored amount is used up.

Une telle utilisation destinée à un public très large nécessite un grand nombre de cartes imprimées qui doivent pouvoir être fabriquées à des prix de revient extrêmement bas.Such use intended for a very wide public requires a large number of printed cards which must be able to be produced at extremely low cost prices.

La présente invention a pour obJet de résoudre ce problème en proposant un procédé de fabrication en continu, entièrement automatique, qui permet de réaliser un produit fiable pour un coat relativement modeste.The object of the present invention is to solve this problem by proposing a continuous, fully automatic manufacturing process which makes it possible to produce a reliable product for a relatively modest coat.

Dans ce but, le procédé selon l'invention est caractérisé en ce que l'on réalise dans le substrat un ensemble de perforations tranversales dont les positions correspondent aux positions finales des extrémités libresdesbornes du composant électronique, lorsqu'il est monté sur la carte, en ce que l'on rapporte une feuille électriquement conductrice contre l'une des faces du substrat, en ce que l'on met en place le composant électronique sur l'autre face du substrat de manière à amener les extrémités libres de ces fils dans les perforations transversales du substrat, en contact avec la surface intérieure de la feuille électriquement conductrice, en ce que l'on fixe ces extrémités contre cette feuille de manière à assurer un bon contact électrique entre ces deux éléments, en ce que l'on procède à un usinage chimique de la feuille électriquement conductrice pour réaliser lesdites plages conductrices de l'une des faces du substratetence que l'on procède à un encapsulage dudit composant électronique et de ses fils de raccordement.To this end, the method according to the invention is characterized in that a set of transverse perforations is produced in the substrate, the positions of which correspond to the final positions of the free ends of the terminals of the electronic component, when it is mounted on the card, in that an electrically conductive sheet is attached against one of the faces of the substrate, in that the electronic component is placed on the other face of the substrate so as to bring the free ends of these wires into the transverse perforations of the substrate, in contact with the inner surface of the electrically conductive sheet, in that these ends are fixed against this sheet so as to ensure good electrical contact between these two elements, in that one proceeds chemical machining of the electrically conductive sheet in order to produce said conductive areas on one of the faces of the substrate, so that said electrical component is encapsulated ronique and its connecting wires.

Selon une forme de réalisation avantageuse, on réalise dans le substrat au moins un évidement agencé pour loger ledit composant électronique. Les perforations transversales et/ou ledit évidement sont réalisés par estampage, le substrat étant découpé dans une bande défilant en continu.According to an advantageous embodiment, at least one recess is arranged in the substrate arranged to house said electronic component. The transverse perforations and / or said recess are produced by stamping, the substrate being cut from a continuously moving strip.

La feuille électriquement conductrice rapportée, de préférence en cuivre ou en un de ses alliages est fixée par collage soit au moyen d'une substance adhésive étalée sur la surface du substrat, soit par chauffage de ce substrat et application de la feuille par pression.The added electrically conductive sheet, preferably made of copper or one of its alloys, is fixed by bonding either by means of an adhesive substance spread on the surface of the substrate, or by heating this substrate and applying the sheet by pressure.

Les extrémités libres des fils du composant électronique peuvent être fixées par une soudure aux ultra-sons. Toutefois, lorsque le composant électronique est un circuit intégré et lorsque ses bornes de contact sont constituées par des pattes de raccordement découpées selon un procédé de transport automatique sur bande (appelé couramment TAB) et soudées au circuit intégré, ces pattes peuvent être soudées à l'étain ou à l'aide de tout autre matériau de soudure connu en soi, à la surface intérieure de la feuille électrique conductrice qui constitue le fond desdites perforations transversales du substrat.The free ends of the wires of the electronic component can be fixed by ultrasonic welding. However, when the electronic component is an integrated circuit and when its contact terminals are constituted by connection tabs cut according to an automatic tape transport method (commonly called TAB) and welded to the integrated circuit, these tabs can be welded to the tin or using any other solder material known per se, to the inner surface of the electrically conductive sheet which constitutes the bottom of said transverse perforations of the substrate.

La présente invention concerne également une carte imprimée réalisée selon ce procédé et une utilisation d'une telle carte comme clé de codage d'une carte de crédit.The present invention also relates to a printed card produced according to this method and to the use of such a card as a coding key for a credit card.

La présente invention sera mieux comprise en référence à la description d'un exemple de réalisation préférée et du dessin annexé dans lequel:
La figure 1 représente une vue de dessous de la carte imprimée selon l'invention,
La figure 2 représente une vue de dessus de la carte imprimée selon la fig. 7. The present invention will be better understood with reference to the description of a preferred embodiment and of the accompanying drawing in which:
FIG. 1 represents a bottom view of the printed card according to the invention,
FIG. 2 represents a top view of the card printed according to FIG. 7.

La figure 3 représente une vue en coupe diamètrale de la carte imprimée selon l'invention avec liaison par fils avec le composant électronique ,en cours de fabrication,
La figure 4 représente une vue en coupe diamétrale de la carte imprimée selon l'invention, avec organes de liaison du composant électroni- que réalisés selon le procédé de transport automatique sur bande, en cours de fabrication, et
La figure 5 représente une vue en coupe diamétrale de la carte imprimée de la fig. 3 entièrement terminée.FIG. 3 represents a view in diametrical section of the printed card according to the invention with connection by wires with the electronic component, during manufacture,
FIG. 4 represents a view in diametral section of the printed card according to the invention, with connecting members of the electronic component produced according to the automatic transport method on tape, during manufacture, and
FIG. 5 represents a diametrical section view of the printed card of FIG. 3 fully completed.

En référence aux figures, la carte imprimée comporte un substrat 10 dans lequel ont été réalisé un ensemble de perforations transversales 12, par exemple circulaires et un évidement central 13, ayant par exemple une forme rectangulaire. Les perforations transversales 12 sont destinées à permettre le passage des fils de raccordement d'un circuit intégré ou de tout autre composant électronique prévu pour être logé dans l'évidement 13.With reference to the figures, the printed card comprises a substrate 10 in which a set of transverse perforations 12, for example circular, and a central recess 13, having for example a rectangular shape, have been produced. The transverse perforations 12 are intended to allow the passage of the connection wires of an integrated circuit or any other electronic component intended to be housed in the recess 13.

La figure 2 représente cette même carte imprimée vue de dessus comportant une plage conductrice centrale 14 et un ensemble de plages conductrices latérales 15 séparées par des pistes non conductrices 16, et correspondant chacune à une perforation transverale 12 représentée en traits interrompus.FIG. 2 represents this same printed card seen from above comprising a central conductive pad 14 and a set of lateral conductive pads 15 separated by non-conductive tracks 16, and each corresponding to a transverse perforation 12 shown in broken lines.

Comme mentionné précédemment et illustré plus particulièrement par la fig. 3, le substrat 10 préalablement usiné de manière à réaliser les perforations transversales 12 et l'évidement central 13, est revêtu sur sa face inférieure d'une feuille électriquement conductrice qui est soumise à un usinage chimique permettant de réaliser les plages conductrices latérales 15, la plage conductrice centrale 14 et les pistes isolantes 16. Cette feuille de cuivre ayant une épaisseur de l'ordre de 70 ym peut comporter un revêtement de nickel de l'ordre de 3 à 7 pm et un revêtement d'or des'ordre de 1 à 2 pm.As mentioned previously and illustrated more particularly by FIG. 3, the substrate 10 previously machined so as to produce the transverse perforations 12 and the central recess 13, is coated on its underside with an electrically conductive sheet which is subjected to chemical machining enabling the lateral conductive pads 15 to be produced, the central conductive pad 14 and the insulating tracks 16. This copper sheet having a thickness of the order of 70 μm may comprise a nickel coating of the order of 3 to 7 μm and a gold coating of the order of 1 to 2 pm.

Un circuit intégré 17 est loge dans l'évidement central 13. Dans l'exemple illustré, ce circuit est pourvu de fils de raccordement 18 dont les extrémités sont amenées dans les perforations transversales 12 du substrat 10 en contact avec la surface intérieure de la feuille électriquement conductrice plaquée contre la surface inférieure de ce substrat. Des moyens de liaison représentés schématiquement par les outils 19 sont utilisés pour fixer les extrémités des fils de raccordement 18 sur les plages conductrices 15.An integrated circuit 17 is housed in the central recess 13. In the example illustrated, this circuit is provided with connection wires 18, the ends of which are brought into the transverse perforations 12 of the substrate 10 in contact with the inner surface of the sheet. electrically conductive pressed against the lower surface of this substrate. Connection means represented schematically by the tools 19 are used to fix the ends of the connection wires 18 on the conductive pads 15.

Comme illustré par la fig. 4, les circuits intégrés peuvent être équi-- pés de pattes de raccordement ou poutres 21 réalisées d'une manière connue en soi selon un procédé de transfert automatique sur bande et préalablement soudées à ces circuits intégrés. Dans ce cas, les extrémités libres de ces pattes de raccordement 21 sont soudées directement en 22 par une soudure tendre à la surface intérieure des plages conductrices 15.  As illustrated in fig. 4, the integrated circuits can be equipped with connection lugs or beams 21 produced in a manner known per se according to an automatic transfer process on tape and previously soldered to these integrated circuits. In this case, the free ends of these connecting lugs 21 are welded directly at 22 by a soft weld to the inner surface of the conductive pads 15.

Lorsque la fixation des pattes de raccordement ou des fils de raccordement 18 est entibrement terminée, le circuit intégré 17 ainsi que ses fils de raccordement sont encapsulés au moyen d'une couche de résine 20 ou similaire, illustre par la fig. 5.When the fixing of the connection lugs or connection wires 18 is completely finished, the integrated circuit 17 as well as its connection wires are encapsulated by means of a layer of resin 20 or the like, illustrated in FIG. 5.

Cette carte imprimée de faible paiâseur est avantageusement utilisée comme clé de codage d'une carte de crédit, g cet effet, elle est encastrée dans un évidement approprié ménagé dans l'Xpaisseur d'une telle carte réalisée par exemple en matière synthétique.This printed card of low paying is advantageously used as coding key of a credit card, g for this purpose, it is embedded in an appropriate recess formed in the thickness of such a card made for example of synthetic material.

il est bien entendu que ce procédé de fabrication de cartes imprimées trouve également d'autres utilisations. En particulier, il peut être utilisé de manibre systématique pour remplacer la réalisation complexe et couveuse de trous métallisés à travers un substrat portant des circuits impri,T#s sur chacun de ses faces. it is understood that this method of manufacturing printed cards also finds other uses. In particular, it can be used systematically to replace the complex and brooding production of metallized holes through a substrate carrying printed circuits, T # s on each of its faces.

La présente invention n'est pas limitée aux formes de réalisation décrites mais peut subir de nombreuses modifications et se présenter sous diverses variantes évidentes pour l'homme de l'art. The present invention is not limited to the embodiments described but can undergo many modifications and come in various variants obvious to those skilled in the art.

Claims (10)

RevendicationsClaims 1. Procédé de fabrication en continu d'une carte imprimée comportant un substrat, un ensemble de plages conductrices disposées sur une des faces de ce substrat, au moins un composant électronique disposé sur l'autre face du substrat et des moyens pour raccorder les bornes dudit composant auxdites plages conductrice;;, caractérisé en ce que l'on réalise dans le substrat un ensemble de perforations transversales dont les positions correspondent aux positions finales des extrémités libres des bornes du composant électronique, lorsqu'il est monté sur la carte, en ce que l'on rapporte une feuille électriquement conductrice contre l'une des faces du substrat, en ce que l'on met en place le composant électronique sur l'autre face du substrat de manière à amener les extrémités libres de ces fils dans les perforations transversales du substrat, en contact avec la surface intérieure de la feuille électriquement conductrice, en ce que l'on fixe ces extrémités contre cette feuille de manière à assurer un bon contact électrique entre ces deux éléments, en ce que l'on procède à un usinage chimique de la feuille électriquement conductrice pour réaliser lesdites plages conductrices de l'une des faces du substrat, et en ce que l'on procède à un encapsulage dudit composant électronique et de ses fils de raccordement.1. A method of continuously manufacturing a printed circuit board comprising a substrate, a set of conductive pads arranged on one side of this substrate, at least one electronic component disposed on the other side of the substrate and means for connecting the terminals of said component to said conductive pads ;;, characterized in that a set of transverse perforations is made in the substrate, the positions of which correspond to the final positions of the free ends of the terminals of the electronic component, when it is mounted on the card, in an electrically conductive sheet is reported against one of the faces of the substrate, in that the electronic component is placed on the other face of the substrate so as to bring the free ends of these wires into the transverse perforations of the substrate, in contact with the inner surface of the electrically conductive sheet, in that these ends are fixed against this sheet so as to ass urer a good electrical contact between these two elements, in that one proceeds to a chemical machining of the electrically conductive sheet to achieve said conductive pads of one of the faces of the substrate, and in that one proceeds to a encapsulation of said electronic component and its connection wires. 2. Procédé selon la revendication 1, caractérisé en ce que l'on réalise dans le substrat, au moins un évidement agencé pour loger ledit composant électronique.2. Method according to claim 1, characterized in that one realizes in the substrate, at least one recess arranged to house said electronic component. 3. Procédé selon les revendications 1 et 2, caractérisé en ce que les perforations transversales et/ou ledit évidement sont réalisés par estampage.3. Method according to claims 1 and 2, characterized in that the transverse perforations and / or said recess are produced by stamping. 4. Procédé selon la revendication 1, caractérisa en ce que la feuille électriquement conductrice rapportée est fixée par collage.4. Method according to claim 1, characterized in that the added electrically conductive sheet is fixed by gluing. 5. Procédé selon la revendication 4, caractérisé en ce que le collage de la feuille électriquement conductrice est effectué au moyen d'une substance adhésive étalée sur une surface du substrat. 5. Method according to claim 4, characterized in that the bonding of the electrically conductive sheet is carried out by means of an adhesive substance spread on a surface of the substrate. 6. Procédé selon la revendication 4, caractérisé en ce que le collage de la feuille électriquement conductrice s'obtient par chauffage du substrat et application sous pression de cette feuille contre une surface du substrat.6. Method according to claim 4, characterized in that the bonding of the electrically conductive sheet is obtained by heating the substrate and application under pressure of this sheet against a surface of the substrate. 7. Procédé selon la revendication 1, caractérisé en ce que l'on fixe par soudure les extrémités libres des fils du composant électronique à la surface intérieure de la feuille électriquement conductrice.7. Method according to claim 1, characterized in that the free ends of the wires of the electronic component are fixed by welding to the inner surface of the electrically conductive sheet. 6. Procédé selon la revendication 7, caractérisé en ce que la soudure est effectuée par application de vibrations ultrasoniques sur les surfaces à souder. 6. Method according to claim 7, characterized in that the welding is carried out by application of ultrasonic vibrations on the surfaces to be welded. 9. Procédé selon la revendication 7, caractérisé en ce que le composant électronique est un circuit intégré, et en ce que les bornes de contact sont constituées par des pattes de raccordement découpées selon un procédé de transfert automatique sur bande et soudées au circuit intégré et en ce que ces pattes sont soudées à la surface intérieure de la feuille électriquement conductrice qui constitue le fond desdites perforations transversales du substrat.9. Method according to claim 7, characterized in that the electronic component is an integrated circuit, and in that the contact terminals are constituted by connecting lugs cut out according to an automatic transfer process on strip and welded to the integrated circuit and in that these tabs are welded to the inner surface of the electrically conductive sheet which constitutes the bottom of said transverse perforations of the substrate. 10. Carte imprimée réalisée selon le procédé de l'une quelconque des revendications 1 à 9.10. Printed card produced according to the method of any one of claims 1 to 9. 11. Utilisation d'une carte imprimée selon la revendication 10 comme clé de codage d'une carte de crédit. 11. Use of a printed card according to claim 10 as a coding key for a credit card.
FR8311210A 1983-07-04 1983-07-04 PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD Expired FR2548857B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR8311210A FR2548857B1 (en) 1983-07-04 1983-07-04 PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD
CH2911/84A CH656285A5 (en) 1983-07-04 1984-06-16 PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CIRCUIT AND USE OF THIS CIRCUIT.
NL8402040A NL8402040A (en) 1983-07-04 1984-06-28 PROCESS FOR CONTINUOUS MANUFACTURE OF A PRINTED CIRCUIT AND USE OF THIS CIRCUIT.
DE19843424241 DE3424241A1 (en) 1983-07-04 1984-06-30 Automated production method for a printed circuit or printed-circuit board, and the field of applicability of the said printed circuit or printed-circuit board

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FR8311210A FR2548857B1 (en) 1983-07-04 1983-07-04 PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD

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EP0299530A1 (en) * 1987-07-16 1989-01-18 GAO Gesellschaft für Automation und Organisation mbH Support for inclusion into identity cards
FR2620586A1 (en) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa METHOD FOR MANUFACTURING ELECTRONIC MODULES, IN PARTICULAR FOR MICROCIRCUIT CARDS
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EP0369919A1 (en) * 1988-11-14 1990-05-23 International Business Machines Corporation Circuit board with self-supporting connection between sides
EP0472766A1 (en) * 1990-08-30 1992-03-04 Siemens Aktiengesellschaft Process for encapsulating a contacted semiconductor chip
FR2671418A1 (en) * 1991-01-04 1992-07-10 Solais Process for manufacturing a memory card and memory card thus obtained
EP0688051A1 (en) 1994-06-15 1995-12-20 Philips Cartes Et Systemes Fabrication process and assembly of an integrated circuit card and such obtained card
US5647122A (en) * 1994-06-15 1997-07-15 U.S. Philips Corporation Manufacturing method for an integrated circuit card
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WO1997023843A1 (en) * 1995-12-22 1997-07-03 Sempac Sa Process for producing a chip card for contactless operation
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US6185815B1 (en) 1997-12-07 2001-02-13 Esec Sa Semiconductor mounting apparatus with a chip gripper travelling back and forth
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
US6135339A (en) * 1998-01-26 2000-10-24 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder
EP3726415A1 (en) * 2019-04-18 2020-10-21 Thales Dis France SA Security element on module
WO2020212219A1 (en) * 2019-04-18 2020-10-22 Thales Dis France Sa Security element on module

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DE3424241C2 (en) 1992-05-14
CH656285A5 (en) 1986-06-13
FR2548857B1 (en) 1987-11-27
NL8402040A (en) 1985-02-01
DE3424241A1 (en) 1985-01-17

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