SE415304B - SIGNAL PROCESSING SYSTEM CARDS AND PROCEDURES FOR PRODUCING THE SAME - Google Patents

SIGNAL PROCESSING SYSTEM CARDS AND PROCEDURES FOR PRODUCING THE SAME

Info

Publication number
SE415304B
SE415304B SE7614622A SE7614622A SE415304B SE 415304 B SE415304 B SE 415304B SE 7614622 A SE7614622 A SE 7614622A SE 7614622 A SE7614622 A SE 7614622A SE 415304 B SE415304 B SE 415304B
Authority
SE
Sweden
Prior art keywords
procedures
producing
same
signal processing
processing system
Prior art date
Application number
SE7614622A
Other languages
Swedish (sv)
Other versions
SE7614622L (en
Inventor
B Badet
F Guillaume
K Kurzweil
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Publication of SE7614622L publication Critical patent/SE7614622L/en
Publication of SE415304B publication Critical patent/SE415304B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Audible And Visible Signals (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
  • Handling Of Sheets (AREA)
SE7614622A 1975-12-31 1976-12-28 SIGNAL PROCESSING SYSTEM CARDS AND PROCEDURES FOR PRODUCING THE SAME SE415304B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7540361A FR2337381A1 (en) 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD

Publications (2)

Publication Number Publication Date
SE7614622L SE7614622L (en) 1977-07-02
SE415304B true SE415304B (en) 1980-09-22

Family

ID=9164418

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7614622A SE415304B (en) 1975-12-31 1976-12-28 SIGNAL PROCESSING SYSTEM CARDS AND PROCEDURES FOR PRODUCING THE SAME

Country Status (11)

Country Link
JP (2) JPS5283132A (en)
BR (1) BR7608831A (en)
CA (1) CA1083714A (en)
CH (1) CH619310A5 (en)
DE (1) DE2659573C2 (en)
ES (1) ES454567A1 (en)
FR (1) FR2337381A1 (en)
GB (1) GB1567784A (en)
IT (1) IT1124741B (en)
NL (1) NL190131C (en)
SE (1) SE415304B (en)

Families Citing this family (90)

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FR2379949A1 (en) * 1977-02-07 1978-09-01 Cii Honeywell Bull DEVICE FOR CONTROLLING A CONTACT INSERTED BETWEEN A TRANSMITTER CIRCUIT AND A RECEIVER CIRCUIT FOR THE TRANSMISSION OF ELECTRIC SIGNALS
FR2415378A1 (en) * 1978-01-24 1979-08-17 Moreno Roland METHOD AND DEVICE FOR ELECTRICALLY CONNECTING A REMOVABLE OBJECT, IN PARTICULAR A PORTABLE ELECTRONIC CARD
FR2439478A1 (en) * 1978-10-19 1980-05-16 Cii Honeywell Bull FLAT HOUSING FOR DEVICES WITH INTEGRATED CIRCUITS
JPS5562591A (en) * 1978-10-30 1980-05-12 Fujitsu Ltd Memory card
DE2919649A1 (en) * 1979-05-16 1980-11-20 Bbc Brown Boveri & Cie SECURITY PAPER
DE2920012C2 (en) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Identification card with IC component and method for producing such an identification card
DE2926867C2 (en) * 1979-07-03 1986-01-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Circuit unit
FR2477303B1 (en) * 1980-02-28 1986-09-26 Dassault Electronique ELECTRONIC CARD READING DEVICE
FR2480008A1 (en) * 1980-04-04 1981-10-09 Flonic Sa IMPROVEMENTS TO MEMORY CARDS
DE3019206A1 (en) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München METHOD FOR CONTACTING GALVANIC CONTACTS OF AN ID CARD WITH EMBEDDED IC COMPONENT
DE3019207A1 (en) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC CHIP
FR2486685B1 (en) * 1980-07-09 1985-10-31 Labo Electronique Physique ELECTRONIC PAYMENT CARD AND REALIZATION METHOD
DE3029667A1 (en) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC COMPONENT
DE3029939A1 (en) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München ID CARD WITH IC COMPONENT AND METHOD FOR THEIR PRODUCTION
DE3033881A1 (en) * 1980-09-09 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Free-standing circuit module - with modules and conductors on two sides connected to two groups of connector pins
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
DE3123198C2 (en) * 1980-12-08 1993-10-07 Gao Ges Automation Org Carrier elements for an IC chip
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DE3111516A1 (en) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Identity card with IC chip
NL191959B (en) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identification card with IC module and carrier element for an IC module.
DE3131216C3 (en) * 1981-04-14 1994-09-01 Gao Ges Automation Org ID card with IC module
JPS57209578A (en) * 1981-06-19 1982-12-22 Fujitsu Ltd Card
DE3130324A1 (en) * 1981-07-31 1983-02-17 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC COMPONENT
FR2511544A1 (en) * 1981-08-14 1983-02-18 Dassault Electronique ELECTRONIC MODULE FOR AUTOMATIC TRANSACTION CARD AND CARD COMPRISING SUCH A MODULE
JPS5888892A (en) * 1981-11-20 1983-05-27 Hitachi Ltd bubble memory cassette
JPS5892597A (en) * 1981-11-28 1983-06-01 大日本印刷株式会社 IC card manufacturing method
DE3151408C1 (en) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München ID card with an IC module
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
JPS58110474U (en) * 1982-01-22 1983-07-27 凸版印刷株式会社 card
FR2523335A1 (en) * 1982-03-10 1983-09-16 Flonic Sa METHOD FOR RAISING THE ELECTRICAL CONTACT RANGES OF A MEMORY CARD
JPS58187858U (en) * 1982-06-08 1983-12-13 セイコーインスツルメンツ株式会社 IC card
JPS58221478A (en) * 1982-06-16 1983-12-23 Kyodo Printing Co Ltd Ic card
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FR2548857B1 (en) * 1983-07-04 1987-11-27 Cortaillod Cables Sa PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD
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DE3338597A1 (en) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
FR2554275B1 (en) * 1983-10-26 1986-09-05 Radiotechnique Compelec CONNECTION DEVICE FOR A POWER SEMICONDUCTOR
JPS59108581A (en) * 1983-11-17 1984-06-23 株式会社ソフイア Card type pinball game
JPS59108580A (en) * 1983-11-17 1984-06-23 株式会社ソフイア Infarmation recording card of card type pinball machine
FR2557715B1 (en) * 1983-12-30 1987-07-17 Bull Sa METHOD AND SYSTEM FOR CONFIDENTIALLY PROCESSING INFORMATION STORED ON AN OPTICALLY READING RECORD OF A PORTABLE MEDIUM
JPS60126863U (en) * 1984-01-30 1985-08-26 共同印刷株式会社 IC card
JPS60126864U (en) * 1984-01-30 1985-08-26 共同印刷株式会社 IC card
FR2575566B1 (en) * 1984-12-28 1990-06-22 Bull Sa METHOD FOR CUSTOMIZING PORTABLE MEDIA SUCH AS CARDS
FR2581480A1 (en) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa ELECTRONIC UNIT, IN PARTICULAR FOR A MICROCIRCUIT BOARD AND CARD COMPRISING SUCH A UNIT
JPS61248184A (en) * 1985-04-26 1986-11-05 Kyodo Printing Co Ltd Ic module
JPS61188871U (en) * 1985-05-16 1986-11-25
FR2584236B1 (en) * 1985-06-26 1988-04-29 Bull Sa METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD
FR2584235B1 (en) * 1985-06-26 1988-04-22 Bull Sa METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD
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FR2590052B1 (en) * 1985-11-08 1991-03-01 Eurotechnique Sa METHOD FOR RECYCLING A CARD COMPRISING A COMPONENT, CARD PROVIDED FOR RECYCLE
FR2590051B1 (en) * 1985-11-08 1991-05-17 Eurotechnique Sa CARD COMPRISING A COMPONENT AND MICROMODULE WITH SIDING CONTACTS
US4755661A (en) * 1986-01-10 1988-07-05 Ruebsam Herrn H Connection of electronic components in a card
FR2599165A1 (en) * 1986-05-21 1987-11-27 Michot Gerard OBJECT ASSOCIATED WITH ELECTRONIC ELEMENT AND METHOD OF OBTAINING
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JPH01152098A (en) * 1988-09-08 1989-06-14 Dainippon Printing Co Ltd Card base material for ic card
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US4004133A (en) * 1974-12-30 1977-01-18 Rca Corporation Credit card containing electronic circuit
FR2299724A1 (en) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind IMPROVEMENTS TO PACKAGING MEDIA FOR INTEGRATED CIRCUIT BOARDS
FR2311406A1 (en) * 1975-05-13 1976-12-10 Honeywell Bull Soc Ind IMPROVEMENTS IN THE MANUFACTURING METHODS OF PACKAGING SUPPORTS FOR MICRO-PLATELETS OF INTEGRATED CIRCUITS
JPS591463B2 (en) * 1976-07-01 1984-01-12 鐘淵化学工業株式会社 Foaming composition

Also Published As

Publication number Publication date
JPS625894A (en) 1987-01-12
CA1083714A (en) 1980-08-12
JPS6130315B2 (en) 1986-07-12
NL7614637A (en) 1977-07-04
NL190131B (en) 1993-06-01
FR2337381B1 (en) 1979-07-06
GB1567784A (en) 1980-05-21
JPS5283132A (en) 1977-07-11
NL190131C (en) 1993-11-01
SE7614622L (en) 1977-07-02
BR7608831A (en) 1977-10-25
DE2659573A1 (en) 1977-07-14
DE2659573C2 (en) 1986-02-27
IT1124741B (en) 1986-05-14
CH619310A5 (en) 1980-09-15
JPS6313840B2 (en) 1988-03-28
ES454567A1 (en) 1977-12-16
FR2337381A1 (en) 1977-07-29

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