FR2584236B1 - METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD - Google Patents

METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD

Info

Publication number
FR2584236B1
FR2584236B1 FR8509733A FR8509733A FR2584236B1 FR 2584236 B1 FR2584236 B1 FR 2584236B1 FR 8509733 A FR8509733 A FR 8509733A FR 8509733 A FR8509733 A FR 8509733A FR 2584236 B1 FR2584236 B1 FR 2584236B1
Authority
FR
France
Prior art keywords
mounting
support
application
integrated circuit
resulting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8509733A
Other languages
French (fr)
Other versions
FR2584236A1 (en
Inventor
Gerard Dehaine
Alain Peytavy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SAS
Original Assignee
Bull SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull SAS filed Critical Bull SAS
Priority to FR8509733A priority Critical patent/FR2584236B1/en
Priority to EP86401402A priority patent/EP0207852B1/en
Priority to JP61150612A priority patent/JPS6230096A/en
Priority to CA000512598A priority patent/CA1283227C/en
Priority to DE8686401402T priority patent/DE3666900D1/en
Publication of FR2584236A1 publication Critical patent/FR2584236A1/en
Application granted granted Critical
Publication of FR2584236B1 publication Critical patent/FR2584236B1/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
FR8509733A 1985-06-26 1985-06-26 METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD Expired FR2584236B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8509733A FR2584236B1 (en) 1985-06-26 1985-06-26 METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD
EP86401402A EP0207852B1 (en) 1985-06-26 1986-06-26 Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card
JP61150612A JPS6230096A (en) 1985-06-26 1986-06-26 Method of mounting integrated circuti to supporter, device assembled through said method and card with micro-electroniccircuit device
CA000512598A CA1283227C (en) 1985-06-26 1986-06-26 Method for mounting an integrated circuit on a support, device using said method and its application to an electronic microcircuit card
DE8686401402T DE3666900D1 (en) 1985-06-26 1986-06-26 Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8509733A FR2584236B1 (en) 1985-06-26 1985-06-26 METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD

Publications (2)

Publication Number Publication Date
FR2584236A1 FR2584236A1 (en) 1987-01-02
FR2584236B1 true FR2584236B1 (en) 1988-04-29

Family

ID=9320696

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8509733A Expired FR2584236B1 (en) 1985-06-26 1985-06-26 METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD

Country Status (5)

Country Link
EP (1) EP0207852B1 (en)
JP (1) JPS6230096A (en)
CA (1) CA1283227C (en)
DE (1) DE3666900D1 (en)
FR (1) FR2584236B1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1002529A6 (en) * 1988-09-27 1991-03-12 Bell Telephone Mfg Method for an electronic component assembly and memory card in which it is applied.
JPH0643107B2 (en) * 1989-01-06 1994-06-08 オーツタイヤ株式会社 Material supply and sticking device for tire molding machine
US5182698A (en) * 1989-12-15 1993-01-26 Kabushiki Kaisha Toshiba Function expanding apparatus for compact electronic device
US5292267A (en) * 1989-12-15 1994-03-08 Kabushiki Kaisha Toshiba Connector unit with movable connector
JPH03269608A (en) * 1990-03-20 1991-12-02 Toshiba Corp Extension unit for portable computer
US5057969A (en) * 1990-09-07 1991-10-15 International Business Machines Corporation Thin film electronic device
FR2671417B1 (en) * 1991-01-04 1995-03-24 Solaic Sa PROCESS FOR THE MANUFACTURE OF A MEMORY CARD AND MEMORY CARD THUS OBTAINED.
CA2071381C (en) * 1991-07-19 1998-12-15 Youji Satou Electronic apparatus, card-type electronic component used with the electronic apparatus, and electronic system with expanding apparatus for expanding function of electronic apparatus
US5544007A (en) * 1991-07-19 1996-08-06 Kabushiiki Kaisha Toshiba Card-shaped electronic device used with an electronic apparatus and having shield plate with conductive portion on a lateral side
US5404271A (en) 1991-07-30 1995-04-04 Kabushiki Kaisha Toshiba Electronic apparatus having a card storing section formed within a body between a support frame and an upper case of the body and having functional elements mounted between the support frame and a lower case of the body
US5504648A (en) * 1991-09-06 1996-04-02 Kabushiki Kaisha Toshiba Electronic apparatus and electronic system with expanding apparatus having interlock, ejector, grounding, and lock mechanisms, for expanding function of electronic apparatus
EP0530829A2 (en) * 1991-09-06 1993-03-10 Kabushiki Kaisha Toshiba Electronic apparatus system having an electronic apparatus unit and an expansion unit for expanding the function of the electronic apparatus unit
DE4424396C2 (en) * 1994-07-11 1996-12-12 Ibm Carrier element for installation in chip cards or other data carrier cards
DE19632113C1 (en) * 1996-08-08 1998-02-19 Siemens Ag Chip card, method for producing a chip card and semiconductor chip for use in a chip card
DE19708617C2 (en) 1997-03-03 1999-02-04 Siemens Ag Chip card module and method for its production as well as this comprehensive chip card
DE19800646C2 (en) * 1998-01-09 2000-05-04 Siemens Ag Carrier element for a semiconductor chip
FR2805083A1 (en) * 2000-02-10 2001-08-17 Bull Sa METHOD FOR MOUNTING AND MANUFACTURING INTEGRATED CIRCUITS ON A SUPPORT AND SUPPORT THEREFOR
DE10202727A1 (en) * 2002-01-24 2003-08-21 Infineon Technologies Ag Carrier substrate for a chip module, chip module and chip card
GB0213094D0 (en) * 2002-06-07 2002-07-17 Power Innovations Ltd Lead frame
FR2859045B1 (en) * 2003-08-21 2005-10-21 Commissariat Energie Atomique DEVICE FOR ELECTRICALLY CONNECTING BETWEEN TWO PLATES AND METHOD FOR PRODUCING A MICROELECTRONIC COMPONENT COMPRISING SUCH A DEVICE
DE102005038132B4 (en) 2005-08-11 2008-04-03 Infineon Technologies Ag Chip module and chip card

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437474B1 (en) * 1968-06-10 1979-11-15
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
FR2337381A1 (en) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD
FR2439438A1 (en) * 1978-10-19 1980-05-16 Cii Honeywell Bull RIBBON CARRYING ELECTRIC SIGNAL PROCESSING DEVICES, MANUFACTURING METHOD THEREOF AND APPLICATION THEREOF TO A SIGNAL PROCESSING ELEMENT
FR2547440B1 (en) * 1983-06-09 1986-02-07 Flonic Sa METHOD FOR MANUFACTURING MEMORY CARDS AND CARDS OBTAINED ACCORDING TO THIS PROCESS

Also Published As

Publication number Publication date
FR2584236A1 (en) 1987-01-02
EP0207852A1 (en) 1987-01-07
DE3666900D1 (en) 1989-12-14
EP0207852B1 (en) 1989-11-08
JPH054914B2 (en) 1993-01-21
JPS6230096A (en) 1987-02-09
CA1283227C (en) 1991-04-16

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