SE445744B - Bad for stromlos utfellning av tenn pa en katalytisk yta - Google Patents

Bad for stromlos utfellning av tenn pa en katalytisk yta

Info

Publication number
SE445744B
SE445744B SE7909906A SE7909906A SE445744B SE 445744 B SE445744 B SE 445744B SE 7909906 A SE7909906 A SE 7909906A SE 7909906 A SE7909906 A SE 7909906A SE 445744 B SE445744 B SE 445744B
Authority
SE
Sweden
Prior art keywords
solution
bath
tin
mol
bath according
Prior art date
Application number
SE7909906A
Other languages
English (en)
Swedish (sv)
Other versions
SE7909906L (sv
Inventor
A Molenaar
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE7909906L publication Critical patent/SE7909906L/
Publication of SE445744B publication Critical patent/SE445744B/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
SE7909906A 1978-12-04 1979-11-30 Bad for stromlos utfellning av tenn pa en katalytisk yta SE445744B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7811816,A NL184695C (nl) 1978-12-04 1978-12-04 Bad voor het stroomloos neerslaan van tin op substraten.

Publications (2)

Publication Number Publication Date
SE7909906L SE7909906L (sv) 1980-06-05
SE445744B true SE445744B (sv) 1986-07-14

Family

ID=19831991

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7909906A SE445744B (sv) 1978-12-04 1979-11-30 Bad for stromlos utfellning av tenn pa en katalytisk yta

Country Status (12)

Country Link
US (1) US4269625A (fr)
JP (1) JPS5579864A (fr)
AT (1) AT364890B (fr)
CA (1) CA1124008A (fr)
DE (1) DE2947821A1 (fr)
ES (1) ES8104430A1 (fr)
FI (1) FI66026C (fr)
FR (1) FR2443512A1 (fr)
GB (1) GB2039534B (fr)
IT (1) IT1126457B (fr)
NL (1) NL184695C (fr)
SE (1) SE445744B (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014096543A1 (fr) 2012-12-20 2014-06-26 Outotec Oyj Dispositif d'étanchéité
US8837552B2 (en) 2008-06-06 2014-09-16 Outotec Oyj Sealing device

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508601A (en) * 1982-09-07 1985-04-02 Toyo Kohan Co., Ltd. Process for producing a thin tin and zinc plated steel sheet
NL8403033A (nl) * 1984-10-05 1986-05-01 Philips Nv Werkwijze voor het autokatalytisch vertinnen van voorwerpen van koper of een koperlegering.
IL85555A (en) * 1988-02-25 1991-11-21 Bromine Compounds Ltd Method and medium for the coating of metals with tin
FI95816C (fi) 1989-05-04 1996-03-25 Ad Tech Holdings Ltd Antimikrobinen esine ja menetelmä sen valmistamiseksi
DE644713T1 (de) * 1992-06-02 1996-01-18 Ibiden Co Ltd Mit loetmetall vorbeschichtete leiterplatte und verfahren zur herstellung.
US5562950A (en) * 1994-03-24 1996-10-08 Novamax Technologies, Inc. Tin coating composition and method
DE19653765A1 (de) * 1996-12-23 1998-06-25 Km Europa Metal Ag Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs
US6645549B1 (en) * 1999-04-22 2003-11-11 Parlex Corporation Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards
US6838114B2 (en) * 2002-05-24 2005-01-04 Micron Technology, Inc. Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces
US6821347B2 (en) 2002-07-08 2004-11-23 Micron Technology, Inc. Apparatus and method for depositing materials onto microelectronic workpieces
US6955725B2 (en) 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US6818249B2 (en) * 2003-03-03 2004-11-16 Micron Technology, Inc. Reactors, systems with reaction chambers, and methods for depositing materials onto micro-device workpieces
US7335396B2 (en) 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
JP2005022956A (ja) * 2003-07-02 2005-01-27 Rohm & Haas Electronic Materials Llc セラミックの金属化
US7235138B2 (en) 2003-08-21 2007-06-26 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
US7344755B2 (en) 2003-08-21 2008-03-18 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
US7422635B2 (en) 2003-08-28 2008-09-09 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
US7056806B2 (en) 2003-09-17 2006-06-06 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
US7282239B2 (en) * 2003-09-18 2007-10-16 Micron Technology, Inc. Systems and methods for depositing material onto microfeature workpieces in reaction chambers
US7323231B2 (en) * 2003-10-09 2008-01-29 Micron Technology, Inc. Apparatus and methods for plasma vapor deposition processes
US7581511B2 (en) 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
US7647886B2 (en) * 2003-10-15 2010-01-19 Micron Technology, Inc. Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
US7258892B2 (en) 2003-12-10 2007-08-21 Micron Technology, Inc. Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
US7906393B2 (en) * 2004-01-28 2011-03-15 Micron Technology, Inc. Methods for forming small-scale capacitor structures
US7584942B2 (en) * 2004-03-31 2009-09-08 Micron Technology, Inc. Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
US7699932B2 (en) 2004-06-02 2010-04-20 Micron Technology, Inc. Reactors, systems and methods for depositing thin films onto microfeature workpieces
US7156470B1 (en) * 2004-06-28 2007-01-02 Wright James P Wheel trim hub cover
US20060237138A1 (en) * 2005-04-26 2006-10-26 Micron Technology, Inc. Apparatuses and methods for supporting microelectronic devices during plasma-based fabrication processes
EP1793013B1 (fr) * 2005-12-05 2017-07-19 Rohm and Haas Electronic Materials LLC Métallisation de diélectriques
FI122225B (fi) 2009-08-04 2011-10-14 Outotec Oyj Tiivistyslaite
MY166049A (en) 2010-09-03 2018-05-22 Omg Electronic Chemicals Llc Electroless nickel alloy plating bath and process for depositing thereof
CN102925878B (zh) * 2012-10-25 2014-09-24 南京大地冷冻食品有限公司 一种常温化学锡镀液
EP2971267B1 (fr) 2013-03-15 2020-10-14 United Technologies Corporation Traitement de revêtement de zinc bimétallique pour une adhérence améliorée d'aluminium sur des alliages en aluminium
US20150101935A1 (en) 2013-10-14 2015-04-16 United Technologies Corporation Apparatus and method for ionic liquid electroplating

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US921943A (en) * 1907-06-27 1909-05-18 Meaker Co Process for electrically coating with tin or allied metals.
CH284092A (de) * 1950-03-16 1952-07-15 Braunschweiger Huettenwerk Ges Verfahren zum Verzinnen der Lauffläche von Lagerschalen oder Lagerbüchsen.
US2822325A (en) * 1955-02-11 1958-02-04 Metal & Thermit Corp Process of, and composition for cleaning and tinning
US3072498A (en) * 1961-02-28 1963-01-08 Texaco Inc Method of tin plating copper
US3274021A (en) * 1962-04-27 1966-09-20 M & T Chemicals Inc Stannate coating bath and method of coating aluminum with tin
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3637386A (en) * 1967-05-02 1972-01-25 Philips Corp Metallizing solution for intensifying layers of metallic, imaged nuclei
US3616291A (en) * 1969-09-16 1971-10-26 Vulcan Materials Co Stannous solutions containing hydroxy carboxylic acid ions their preparation and their use in plating tin on conductive surfaces particularly on aluminum
US3870526A (en) * 1973-09-20 1975-03-11 Us Army Electroless deposition of copper and copper-tin alloys
JPS54141341A (en) * 1978-04-26 1979-11-02 Shinko Electric Ind Co Nonelectrolytic tin plating solution

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8837552B2 (en) 2008-06-06 2014-09-16 Outotec Oyj Sealing device
WO2014096543A1 (fr) 2012-12-20 2014-06-26 Outotec Oyj Dispositif d'étanchéité

Also Published As

Publication number Publication date
GB2039534A (en) 1980-08-13
FI793761A (fi) 1980-06-05
JPS629670B2 (fr) 1987-03-02
ES486519A0 (es) 1981-04-16
ATA761579A (de) 1981-04-15
IT1126457B (it) 1986-05-21
FI66026B (fi) 1984-04-30
DE2947821C2 (fr) 1988-04-21
AT364890B (de) 1981-11-25
NL184695C (nl) 1989-10-02
CA1124008A (fr) 1982-05-25
FI66026C (fi) 1984-08-10
FR2443512A1 (fr) 1980-07-04
DE2947821A1 (de) 1980-06-19
FR2443512B1 (fr) 1983-11-25
US4269625A (en) 1981-05-26
ES8104430A1 (es) 1981-04-16
GB2039534B (en) 1983-04-13
IT7927764A0 (it) 1979-11-30
NL7811816A (nl) 1980-06-06
SE7909906L (sv) 1980-06-05
NL184695B (nl) 1989-05-01
JPS5579864A (en) 1980-06-16

Similar Documents

Publication Publication Date Title
SE445744B (sv) Bad for stromlos utfellning av tenn pa en katalytisk yta
US2369620A (en) Method of coating cupreous metal with tin
US3033703A (en) Electroless plating of copper
KR101579191B1 (ko) 비전도성 기판에 금속 코팅하는 방법
JP2001206735A (ja) めっき方法
KR20120081107A (ko) 비전도성 기판에 금속 코팅을 적용하기 위한 프로세스
US4244739A (en) Catalytic solution for the electroless deposition of metals
US3963841A (en) Catalytic surface preparation for electroless plating
TW201514339A (zh) 含有５員雜環含氮化合物之無電金屬化用催化劑
EP0180265B1 (fr) Procédé pour l'étamage autocatalytique des objets en cuivre et alliages de cuivre
US3698939A (en) Method and composition of platinum plating
US3396042A (en) Chemical gold plating composition
US3769061A (en) Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
US3130072A (en) Silver-palladium immersion plating composition and process
US3305389A (en) Process of coating lead with tin
KR850000807B1 (ko) 무전해 주석 도금액조성물
US3387987A (en) Bath and process for producing platinum metal immersion deposits
JPH0250990B2 (fr)
JPS59215473A (ja) 無電解銅メツキ膜の活性保持溶液
JPS63266076A (ja) 無電解ニツケル−銅−燐合金めつき液
JPH10265961A (ja) Ａｌ又はＡｌ合金への無電解ニッケルめっき方法
JPH08176835A (ja) ガラス又はセラミックス基板へのめっき層の形成方法
SE190972C1 (fr)
JPS63134669A (ja) 無電解銅メツキ液
JPS5937755B2 (ja) スズめつき液

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 7909906-5

Effective date: 19910704

Format of ref document f/p: F