SE444526B - Sett att i lege och plan placera en substratbricka - Google Patents
Sett att i lege och plan placera en substratbrickaInfo
- Publication number
- SE444526B SE444526B SE7900230A SE7900230A SE444526B SE 444526 B SE444526 B SE 444526B SE 7900230 A SE7900230 A SE 7900230A SE 7900230 A SE7900230 A SE 7900230A SE 444526 B SE444526 B SE 444526B
- Authority
- SE
- Sweden
- Prior art keywords
- place
- tray
- ooh
- plan
- workpiece
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
- 239000002245 particle Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 5
- 230000003137 locomotive effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- BUADUHVXMFJVLH-UHFFFAOYSA-N 7-chloro-3-imidazol-1-yl-2H-1,2,4-benzotriazin-1-ium 1-oxide Chemical compound N1[N+](=O)C2=CC(Cl)=CC=C2N=C1N1C=CN=C1 BUADUHVXMFJVLH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 241000283690 Bos taurus Species 0.000 description 1
- 101100298295 Drosophila melanogaster flfl gene Proteins 0.000 description 1
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US87147778A | 1978-01-23 | 1978-01-23 | |
US05/965,304 US4213698A (en) | 1978-12-01 | 1978-12-01 | Apparatus and method for holding and planarizing thin workpieces |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7900230L SE7900230L (sv) | 1979-07-24 |
SE444526B true SE444526B (sv) | 1986-04-21 |
Family
ID=27128208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7900230A SE444526B (sv) | 1978-01-23 | 1979-01-10 | Sett att i lege och plan placera en substratbricka |
Country Status (7)
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5754341A (ja) * | 1980-09-19 | 1982-03-31 | Hitachi Ltd | Usuitahojisochi |
US4433835A (en) * | 1981-11-30 | 1984-02-28 | Tencor Instruments | Wafer chuck with wafer cleaning feature |
JPS58153344A (ja) * | 1982-03-05 | 1983-09-12 | Hitachi Ltd | リテ−ナ式ウエハチヤツク |
JPS59106118A (ja) * | 1982-12-10 | 1984-06-19 | Hitachi Ltd | 薄板変形装置 |
JPS6099538A (ja) * | 1983-11-01 | 1985-06-03 | 横河・ヒュ−レット・パッカ−ド株式会社 | ピンチヤツク |
US4656791A (en) * | 1984-09-27 | 1987-04-14 | Libbey-Owens-Ford Company | Abrasive fluid jet cutting support |
GB2189328B (en) * | 1986-03-03 | 1990-12-19 | Canon Kk | Optical system adjustment device for camera |
US4903681A (en) * | 1987-02-24 | 1990-02-27 | Tokyo Seimitus Co., Ltd. | Method and apparatus for cutting a cylindrical material |
NL8701603A (nl) * | 1987-07-08 | 1989-02-01 | Philips & Du Pont Optical | Vacuuminrichting voor het vastzuigen van werkstukken. |
US6228438B1 (en) * | 1999-08-10 | 2001-05-08 | Unakis Balzers Aktiengesellschaft | Plasma reactor for the treatment of large size substrates |
JP2003142566A (ja) * | 2001-11-07 | 2003-05-16 | New Creation Co Ltd | 真空吸着器及びその製造方法 |
DE20206490U1 (de) * | 2002-04-24 | 2002-07-18 | J. Schmalz GmbH, 72293 Glatten | Blocksauger |
JP5810517B2 (ja) * | 2010-12-02 | 2015-11-11 | 富士電機株式会社 | 吸着装置および吸着方法 |
DE102011001879A1 (de) | 2011-04-07 | 2012-10-11 | Jenoptik Automatisierungstechnik Gmbh | Vorrichtung zum Spannen verformter Wafer |
JP6178683B2 (ja) * | 2013-09-25 | 2017-08-09 | 芝浦メカトロニクス株式会社 | 吸着ステージ、貼合装置、および貼合方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB280154A (en) * | 1926-11-02 | 1928-03-28 | Wesel Mfg Company F | Improvements in photo-engravers' printing frame |
FR1517154A (fr) * | 1967-03-02 | 1968-03-15 | Elektromat Veb | Procédé et dispositif pour le prélèvement de petits corps à surfaces adhérentes |
DE1646147A1 (de) * | 1967-05-13 | 1971-01-07 | Telefunken Patent | Vorrichtung zur Halterung einer Halbleiterscheibe bei der UEbertragung eines Musters durch Kontaktkopie oder durch Projektionsmaskierung |
US3627338A (en) * | 1969-10-09 | 1971-12-14 | Sheldon Thompson | Vacuum chuck |
US3747282A (en) * | 1971-11-29 | 1973-07-24 | E Katzke | Apparatus for polishing wafers |
-
1979
- 1979-01-10 SE SE7900230A patent/SE444526B/sv not_active IP Right Cessation
- 1979-01-18 IT IT67112/79A patent/IT1118308B/it active
- 1979-01-19 DE DE19792901968 patent/DE2901968A1/de active Granted
- 1979-01-22 FR FR7901510A patent/FR2415368A1/fr active Granted
- 1979-01-22 NL NL7900497A patent/NL7900497A/xx not_active Application Discontinuation
- 1979-01-23 GB GB7902425A patent/GB2016166B/en not_active Expired
- 1979-01-23 JP JP54005656A patent/JPS6015147B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL7900497A (nl) | 1979-07-25 |
JPS6015147B2 (ja) | 1985-04-17 |
GB2016166B (en) | 1982-06-09 |
FR2415368B1 (US06368395-20020409-C00050.png) | 1984-05-04 |
JPS54120585A (en) | 1979-09-19 |
FR2415368A1 (fr) | 1979-08-17 |
IT7967112A0 (it) | 1979-01-18 |
GB2016166A (en) | 1979-09-19 |
IT1118308B (it) | 1986-02-24 |
DE2901968C2 (US06368395-20020409-C00050.png) | 1988-08-11 |
SE7900230L (sv) | 1979-07-24 |
DE2901968A1 (de) | 1979-07-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE444526B (sv) | Sett att i lege och plan placera en substratbricka | |
US4213698A (en) | Apparatus and method for holding and planarizing thin workpieces | |
USRE31053E (en) | Apparatus and method for holding and planarizing thin workpieces | |
US20150170954A1 (en) | Substrate support apparatus having reduced substrate particle generation | |
US20230005785A1 (en) | Methods and apparatus for adjusting surface topography of a substrate support apparatus | |
CN111276428B (zh) | 晶圆承载装置 | |
US20080099451A1 (en) | Workpiece rotation apparatus for a plasma reactor system | |
US6771482B2 (en) | Perimeter seal for backside cooling of substrates | |
KR102351354B1 (ko) | 플로팅 웨이퍼 척 | |
US20220161396A1 (en) | Minimal contact gripping of thin optical devices | |
KR101688473B1 (ko) | 스핀 현상 방법 및 장치 | |
US20090003979A1 (en) | Techniques for handling substrates | |
US11056378B2 (en) | Workpiece holding method and workpiece processing method | |
US7572342B2 (en) | Method and apparatus for cleaning semiconductor photolithography tools | |
US6409463B1 (en) | Apparatuses and methods for adjusting a substrate centering system | |
US9658536B2 (en) | In-line inspection and clean for immersion lithography | |
US6573520B1 (en) | Electron beam lithography system | |
US9472444B2 (en) | Wafer support device | |
US20170194134A1 (en) | Removing particulate contaminants from the backside of a wafer or reticle | |
US10549313B2 (en) | Edge field imprint lithography | |
US11940724B2 (en) | Reticle processing system | |
KR20060134533A (ko) | 반도체 소자 제조를 위한 로봇 블레이드 | |
KR20060130970A (ko) | 러버 팁을 갖는 웨이퍼 이송용 로봇 포크 | |
TWI748560B (zh) | 自動晶圓定位總成 | |
JP2018166135A (ja) | 塗布処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAL | Patent in force |
Ref document number: 7900230-9 Format of ref document f/p: F |
|
NUG | Patent has lapsed |
Ref document number: 7900230-9 Format of ref document f/p: F |