SE439230B - Lett etsbara kort for tryckta kretsar och sett att framstella dylika kort - Google Patents
Lett etsbara kort for tryckta kretsar och sett att framstella dylika kortInfo
- Publication number
- SE439230B SE439230B SE7813171A SE7813171A SE439230B SE 439230 B SE439230 B SE 439230B SE 7813171 A SE7813171 A SE 7813171A SE 7813171 A SE7813171 A SE 7813171A SE 439230 B SE439230 B SE 439230B
- Authority
- SE
- Sweden
- Prior art keywords
- nickel
- layer
- copper foil
- sulfur
- barrier layer
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 97
- 229910052759 nickel Inorganic materials 0.000 claims description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 230000004888 barrier function Effects 0.000 claims description 36
- 239000011889 copper foil Substances 0.000 claims description 31
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 23
- 239000011593 sulfur Substances 0.000 claims description 23
- 229910052717 sulfur Inorganic materials 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000654 additive Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 150000003871 sulfonates Chemical class 0.000 claims description 3
- 229940124530 sulfonamide Drugs 0.000 claims description 2
- 150000003456 sulfonamides Chemical class 0.000 claims description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims 1
- 229910001453 nickel ion Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 11
- 229910000990 Ni alloy Inorganic materials 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000004160 Ammonium persulphate Substances 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- 235000019395 ammonium persulphate Nutrition 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 3
- 229940081974 saccharin Drugs 0.000 description 3
- 235000019204 saccharin Nutrition 0.000 description 3
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 3
- 238000010186 staining Methods 0.000 description 3
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 3
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 2
- 229910000796 S alloy Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical group C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000004133 Sodium thiosulphate Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 239000001166 ammonium sulphate Substances 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- MHWVMMHIJHHXQP-UHFFFAOYSA-N benzene-1,2,3-trisulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC(S(O)(=O)=O)=C1S(O)(=O)=O MHWVMMHIJHHXQP-UHFFFAOYSA-N 0.000 description 1
- 150000008331 benzenesulfonamides Chemical class 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 1
- 238000010960 commercial process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- LWJROJCJINYWOX-UHFFFAOYSA-L mercury dichloride Chemical compound Cl[Hg]Cl LWJROJCJINYWOX-UHFFFAOYSA-L 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- GPUMPJNVOBTUFM-UHFFFAOYSA-N naphthalene-1,2,3-trisulfonic acid Chemical compound C1=CC=C2C(S(O)(=O)=O)=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC2=C1 GPUMPJNVOBTUFM-UHFFFAOYSA-N 0.000 description 1
- YZMHQCWXYHARLS-UHFFFAOYSA-N naphthalene-1,2-disulfonic acid Chemical compound C1=CC=CC2=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC=C21 YZMHQCWXYHARLS-UHFFFAOYSA-N 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 1
- 229940116357 potassium thiocyanate Drugs 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 150000003567 thiocyanates Chemical class 0.000 description 1
- 150000004764 thiosulfuric acid derivatives Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2063—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10 mixed adhesion layer containing metallic/inorganic and polymeric materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/1266—O, S, or organic compound in metal component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/863,109 US4190474A (en) | 1977-12-22 | 1977-12-22 | Method of making a printed circuit board having mutually etchable copper and nickel layers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7813171L SE7813171L (sv) | 1979-06-23 |
| SE439230B true SE439230B (sv) | 1985-06-03 |
Family
ID=25340277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7813171A SE439230B (sv) | 1977-12-22 | 1978-12-21 | Lett etsbara kort for tryckta kretsar och sett att framstella dylika kort |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US4190474A (nl) |
| JP (1) | JPS5491766A (nl) |
| CA (1) | CA1126410A (nl) |
| DE (1) | DE2854588C2 (nl) |
| FR (1) | FR2412406A1 (nl) |
| GB (1) | GB2010910B (nl) |
| IT (1) | IT1111381B (nl) |
| LU (1) | LU80681A1 (nl) |
| NL (1) | NL185972C (nl) |
| SE (1) | SE439230B (nl) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56155592A (en) * | 1980-04-03 | 1981-12-01 | Furukawa Circuit Foil | Copper foil for printed circuit and method of manufacturing same |
| JPS56155593A (en) * | 1980-04-08 | 1981-12-01 | Furukawa Circuit Foil | Steel foil for printed circuit and method of manufacturing same |
| US4472762A (en) * | 1980-09-25 | 1984-09-18 | Texas Instruments Incorporated | Electronic circuit interconnection system |
| US4385202A (en) * | 1980-09-25 | 1983-05-24 | Texas Instruments Incorporated | Electronic circuit interconnection system |
| US4546406A (en) * | 1980-09-25 | 1985-10-08 | Texas Instruments Incorporated | Electronic circuit interconnection system |
| US4413766A (en) * | 1981-04-03 | 1983-11-08 | General Electric Company | Method of forming a conductor pattern including fine conductor runs on a ceramic substrate |
| US4503112A (en) * | 1981-06-12 | 1985-03-05 | Oak Industries Inc. | Printed circuit material |
| JPS5933894A (ja) * | 1982-08-19 | 1984-02-23 | 電気化学工業株式会社 | 混成集積用回路基板の製造法 |
| JPS60140897A (ja) * | 1983-12-28 | 1985-07-25 | 日本電気株式会社 | 樹脂絶縁多層基板 |
| JPS6113688A (ja) * | 1984-06-28 | 1986-01-21 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその製造方法 |
| US4717439A (en) * | 1985-10-24 | 1988-01-05 | Enthone, Incorporated | Process for the treatment of copper oxide in the preparation of printed circuit boards |
| US5243320A (en) * | 1988-02-26 | 1993-09-07 | Gould Inc. | Resistive metal layers and method for making same |
| EP0330210A3 (en) * | 1988-02-26 | 1990-11-07 | Gould Electronics Inc. | Resistive metal layers and method for making same |
| US4810332A (en) * | 1988-07-21 | 1989-03-07 | Microelectronics And Computer Technology Corporation | Method of making an electrical multilayer copper interconnect |
| US5182420A (en) * | 1989-04-25 | 1993-01-26 | Cray Research, Inc. | Method of fabricating metallized chip carriers from wafer-shaped substrates |
| US5071518A (en) * | 1989-10-24 | 1991-12-10 | Microelectronics And Computer Technology Corporation | Method of making an electrical multilayer interconnect |
| US5011580A (en) * | 1989-10-24 | 1991-04-30 | Microelectronics And Computer Technology Corporation | Method of reworking an electrical multilayer interconnect |
| US5127986A (en) * | 1989-12-01 | 1992-07-07 | Cray Research, Inc. | High power, high density interconnect method and apparatus for integrated circuits |
| US5185502A (en) * | 1989-12-01 | 1993-02-09 | Cray Research, Inc. | High power, high density interconnect apparatus for integrated circuits |
| TW208110B (nl) * | 1990-06-08 | 1993-06-21 | Furukawa Circuit Foil Kk | |
| US5286304A (en) * | 1991-10-24 | 1994-02-15 | Enerdyne Corporation | Thermoelectric device and method of manufacturing |
| TW317575B (nl) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
| US5780172A (en) * | 1995-12-18 | 1998-07-14 | Olin Corporation | Tin coated electrical connector |
| US5916695A (en) * | 1995-12-18 | 1999-06-29 | Olin Corporation | Tin coated electrical connector |
| US6106907A (en) * | 1996-06-25 | 2000-08-22 | Canon Kabushiki Kaisha | Electrode plate, liquid crystal device and production thereof |
| JP3223829B2 (ja) * | 1997-01-29 | 2001-10-29 | 新光電気工業株式会社 | 電気ニッケルめっき浴又は電気ニッケル合金めっき浴及びそれを用いためっき方法 |
| US6083633A (en) * | 1997-06-16 | 2000-07-04 | Olin Corporation | Multi-layer diffusion barrier for a tin coated electrical connector |
| TW512467B (en) * | 1999-10-12 | 2002-12-01 | North Kk | Wiring circuit substrate and manufacturing method therefor |
| DE60211808T2 (de) | 2001-07-31 | 2006-10-19 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe | Plattierte Kupferlegierung und Verfahren zu ihre Herstellung |
| US9365947B2 (en) | 2013-10-04 | 2016-06-14 | Invensas Corporation | Method for preparing low cost substrates |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2233546A (en) * | 1939-05-24 | 1941-03-04 | Meulendyke Charles Edmund | Method for etching nickel |
| US2326999A (en) * | 1940-03-11 | 1943-08-17 | Harshaw Chem Corp | Nickel plating |
| FR1152563A (fr) * | 1954-12-31 | 1958-02-20 | Gen Am Transport | Circuits électriques imprimés et leur procédé de fabrication |
| US2984595A (en) * | 1956-06-21 | 1961-05-16 | Sel Rex Precious Metals Inc | Printed circuit manufacture |
| US3220897A (en) * | 1961-02-13 | 1965-11-30 | Esther S Conley | Conducting element and method |
| US3293109A (en) * | 1961-09-18 | 1966-12-20 | Clevite Corp | Conducting element having improved bonding characteristics and method |
| US3183067A (en) * | 1961-12-06 | 1965-05-11 | Harshaw Chemcial Company | Metal having two coats of sulfurcontaining nickel and method of making same |
| US3454376A (en) * | 1966-06-06 | 1969-07-08 | Clevite Corp | Metal composite and method of making same |
| US3591350A (en) * | 1968-06-17 | 1971-07-06 | M & T Chemicals Inc | Novel plating process |
| US3585010A (en) * | 1968-10-03 | 1971-06-15 | Clevite Corp | Printed circuit board and method of making same |
| US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
| JPS534498B2 (nl) * | 1973-06-23 | 1978-02-17 | ||
| US4061837A (en) * | 1976-06-17 | 1977-12-06 | Hutkin Irving J | Plastic-metal composite and method of making the same |
-
1977
- 1977-12-22 US US05/863,109 patent/US4190474A/en not_active Expired - Lifetime
-
1978
- 1978-12-14 CA CA318,000A patent/CA1126410A/en not_active Expired
- 1978-12-18 GB GB7848911A patent/GB2010910B/en not_active Expired
- 1978-12-18 DE DE2854588A patent/DE2854588C2/de not_active Expired
- 1978-12-20 LU LU80681A patent/LU80681A1/xx unknown
- 1978-12-20 IT IT52379/78A patent/IT1111381B/it active
- 1978-12-21 NL NLAANVRAGE7812452,A patent/NL185972C/nl not_active IP Right Cessation
- 1978-12-21 SE SE7813171A patent/SE439230B/sv not_active IP Right Cessation
- 1978-12-21 FR FR7835946A patent/FR2412406A1/fr active Granted
- 1978-12-22 JP JP15773778A patent/JPS5491766A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2412406A1 (fr) | 1979-07-20 |
| GB2010910A (en) | 1979-07-04 |
| GB2010910B (en) | 1982-06-16 |
| JPS616559B2 (nl) | 1986-02-27 |
| NL185972B (nl) | 1990-03-16 |
| US4190474A (en) | 1980-02-26 |
| IT1111381B (it) | 1986-01-13 |
| DE2854588A1 (de) | 1979-07-05 |
| IT7852379A0 (it) | 1978-12-20 |
| DE2854588C2 (de) | 1986-07-03 |
| FR2412406B1 (nl) | 1983-12-16 |
| LU80681A1 (fr) | 1979-04-13 |
| CA1126410A (en) | 1982-06-22 |
| JPS5491766A (en) | 1979-07-20 |
| NL185972C (nl) | 1990-08-16 |
| NL7812452A (nl) | 1979-06-26 |
| SE7813171L (sv) | 1979-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE439230B (sv) | Lett etsbara kort for tryckta kretsar och sett att framstella dylika kort | |
| CN101014460B (zh) | 具有底漆树脂层的带载体箔的电解铜箔及其制造方法 | |
| JP5598700B2 (ja) | 電解銅箔及びその製造方法 | |
| US4483906A (en) | Copper foil for a printed circuit and a method for the production thereof | |
| CN102215635A (zh) | 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板 | |
| EP0227820A1 (en) | TREATMENT OF COPPER BLADES. | |
| JPS6113688A (ja) | 印刷回路用銅箔およびその製造方法 | |
| US6117300A (en) | Method for forming conductive traces and printed circuits made thereby | |
| CN102215632A (zh) | 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板 | |
| KR101421701B1 (ko) | 연성회로 동장 적층판과 이를 이용한 인쇄회로 기판 및 그 제조 방법 | |
| JP2002292788A (ja) | 複合銅箔及び該複合銅箔の製造方法 | |
| CN106337194A (zh) | 一种提高铜箔耐腐蚀性的表面处理复合添加剂 | |
| WO2009084839A2 (en) | Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same | |
| Chan et al. | Effects of additives and convection on Cu foil fabrication with a low surface roughness | |
| JP2014139347A (ja) | プリント回路用銅箔の表面処理方法及びそれによって製造された銅箔、並びにそのメッキ装置 | |
| US4311768A (en) | Printed circuit board having mutually etchable copper and nickel layers | |
| JP2009206514A (ja) | プリント回路用銅箔及びその表面処理方法、並びにメッキ装置 | |
| KR20230129209A (ko) | 표면처리 전해동박, 이의 제조방법, 및 이의 용도 | |
| KR20120115310A (ko) | 전자 회로 및 그 형성 방법 그리고 전자 회로 형성용 동장 적층판 | |
| US4260449A (en) | Method of forming a printed circuit | |
| CN102233699B (zh) | 以超低棱线铜箔为载体的极薄铜箔及其制造方法 | |
| CN102548202B (zh) | 经粗化处理的铜箔及其制造方法 | |
| EP2590487A1 (en) | Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards | |
| JP7017369B2 (ja) | 表面処理銅箔、銅張積層板及びプリント配線板 | |
| JPH07278867A (ja) | 電解銅箔の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NAL | Patent in force |
Ref document number: 7813171-1 Format of ref document f/p: F |
|
| NUG | Patent has lapsed |
Ref document number: 7813171-1 Format of ref document f/p: F |