LU80681A1 - Plaque de circuit imprime comportant des couches de cuivre et de nickel pouvant etre soumises mutuellement a une morsure - Google Patents

Plaque de circuit imprime comportant des couches de cuivre et de nickel pouvant etre soumises mutuellement a une morsure

Info

Publication number
LU80681A1
LU80681A1 LU80681A LU80681A LU80681A1 LU 80681 A1 LU80681 A1 LU 80681A1 LU 80681 A LU80681 A LU 80681A LU 80681 A LU80681 A LU 80681A LU 80681 A1 LU80681 A1 LU 80681A1
Authority
LU
Luxembourg
Prior art keywords
bite
mutually
subject
printed circuit
circuit plate
Prior art date
Application number
LU80681A
Other languages
English (en)
French (fr)
Inventor
B Luce
B Berdan
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of LU80681A1 publication Critical patent/LU80681A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2063—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10 mixed adhesion layer containing metallic/inorganic and polymeric materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/1266—O, S, or organic compound in metal component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Electroplating Methods And Accessories (AREA)
LU80681A 1977-12-22 1978-12-20 Plaque de circuit imprime comportant des couches de cuivre et de nickel pouvant etre soumises mutuellement a une morsure LU80681A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/863,109 US4190474A (en) 1977-12-22 1977-12-22 Method of making a printed circuit board having mutually etchable copper and nickel layers

Publications (1)

Publication Number Publication Date
LU80681A1 true LU80681A1 (fr) 1979-04-13

Family

ID=25340277

Family Applications (1)

Application Number Title Priority Date Filing Date
LU80681A LU80681A1 (fr) 1977-12-22 1978-12-20 Plaque de circuit imprime comportant des couches de cuivre et de nickel pouvant etre soumises mutuellement a une morsure

Country Status (10)

Country Link
US (1) US4190474A (xx)
JP (1) JPS5491766A (xx)
CA (1) CA1126410A (xx)
DE (1) DE2854588C2 (xx)
FR (1) FR2412406A1 (xx)
GB (1) GB2010910B (xx)
IT (1) IT1111381B (xx)
LU (1) LU80681A1 (xx)
NL (1) NL185972C (xx)
SE (1) SE439230B (xx)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS56155593A (en) * 1980-04-08 1981-12-01 Furukawa Circuit Foil Steel foil for printed circuit and method of manufacturing same
US4472762A (en) * 1980-09-25 1984-09-18 Texas Instruments Incorporated Electronic circuit interconnection system
US4385202A (en) * 1980-09-25 1983-05-24 Texas Instruments Incorporated Electronic circuit interconnection system
US4546406A (en) * 1980-09-25 1985-10-08 Texas Instruments Incorporated Electronic circuit interconnection system
US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
US4503112A (en) * 1981-06-12 1985-03-05 Oak Industries Inc. Printed circuit material
JPS5933894A (ja) * 1982-08-19 1984-02-23 電気化学工業株式会社 混成集積用回路基板の製造法
JPS60140897A (ja) * 1983-12-28 1985-07-25 日本電気株式会社 樹脂絶縁多層基板
JPS6113688A (ja) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
US4717439A (en) * 1985-10-24 1988-01-05 Enthone, Incorporated Process for the treatment of copper oxide in the preparation of printed circuit boards
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
EP0330210A3 (en) * 1988-02-26 1990-11-07 Gould Electronics Inc. Resistive metal layers and method for making same
US4810332A (en) * 1988-07-21 1989-03-07 Microelectronics And Computer Technology Corporation Method of making an electrical multilayer copper interconnect
US5182420A (en) * 1989-04-25 1993-01-26 Cray Research, Inc. Method of fabricating metallized chip carriers from wafer-shaped substrates
US5071518A (en) * 1989-10-24 1991-12-10 Microelectronics And Computer Technology Corporation Method of making an electrical multilayer interconnect
US5011580A (en) * 1989-10-24 1991-04-30 Microelectronics And Computer Technology Corporation Method of reworking an electrical multilayer interconnect
US5127986A (en) * 1989-12-01 1992-07-07 Cray Research, Inc. High power, high density interconnect method and apparatus for integrated circuits
US5185502A (en) * 1989-12-01 1993-02-09 Cray Research, Inc. High power, high density interconnect apparatus for integrated circuits
TW208110B (xx) * 1990-06-08 1993-06-21 Furukawa Circuit Foil Kk
US5286304A (en) * 1991-10-24 1994-02-15 Enerdyne Corporation Thermoelectric device and method of manufacturing
TW317575B (xx) * 1994-01-21 1997-10-11 Olin Corp
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US6106907A (en) * 1996-06-25 2000-08-22 Canon Kabushiki Kaisha Electrode plate, liquid crystal device and production thereof
JP3223829B2 (ja) * 1997-01-29 2001-10-29 新光電気工業株式会社 電気ニッケルめっき浴又は電気ニッケル合金めっき浴及びそれを用いためっき方法
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
TW512467B (en) * 1999-10-12 2002-12-01 North Kk Wiring circuit substrate and manufacturing method therefor
DE60211808T2 (de) 2001-07-31 2006-10-19 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe Plattierte Kupferlegierung und Verfahren zu ihre Herstellung
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2233546A (en) * 1939-05-24 1941-03-04 Meulendyke Charles Edmund Method for etching nickel
US2326999A (en) * 1940-03-11 1943-08-17 Harshaw Chem Corp Nickel plating
FR1152563A (fr) * 1954-12-31 1958-02-20 Gen Am Transport Circuits électriques imprimés et leur procédé de fabrication
US2984595A (en) * 1956-06-21 1961-05-16 Sel Rex Precious Metals Inc Printed circuit manufacture
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3293109A (en) * 1961-09-18 1966-12-20 Clevite Corp Conducting element having improved bonding characteristics and method
US3183067A (en) * 1961-12-06 1965-05-11 Harshaw Chemcial Company Metal having two coats of sulfurcontaining nickel and method of making same
US3454376A (en) * 1966-06-06 1969-07-08 Clevite Corp Metal composite and method of making same
US3591350A (en) * 1968-06-17 1971-07-06 M & T Chemicals Inc Novel plating process
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same
US3857681A (en) * 1971-08-03 1974-12-31 Yates Industries Copper foil treatment and products produced therefrom
JPS534498B2 (xx) * 1973-06-23 1978-02-17
US4061837A (en) * 1976-06-17 1977-12-06 Hutkin Irving J Plastic-metal composite and method of making the same

Also Published As

Publication number Publication date
FR2412406A1 (fr) 1979-07-20
GB2010910A (en) 1979-07-04
GB2010910B (en) 1982-06-16
JPS616559B2 (xx) 1986-02-27
NL185972B (nl) 1990-03-16
US4190474A (en) 1980-02-26
IT1111381B (it) 1986-01-13
DE2854588A1 (de) 1979-07-05
IT7852379A0 (it) 1978-12-20
DE2854588C2 (de) 1986-07-03
FR2412406B1 (xx) 1983-12-16
SE439230B (sv) 1985-06-03
CA1126410A (en) 1982-06-22
JPS5491766A (en) 1979-07-20
NL185972C (nl) 1990-08-16
NL7812452A (nl) 1979-06-26
SE7813171L (sv) 1979-06-23

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