JPS549793A - Copper base thick film conductive paste* conductive element and method of making same - Google Patents
Copper base thick film conductive paste* conductive element and method of making sameInfo
- Publication number
- JPS549793A JPS549793A JP7489977A JP7489977A JPS549793A JP S549793 A JPS549793 A JP S549793A JP 7489977 A JP7489977 A JP 7489977A JP 7489977 A JP7489977 A JP 7489977A JP S549793 A JPS549793 A JP S549793A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- making same
- copper base
- conductive paste
- base thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7489977A JPS549793A (en) | 1977-06-23 | 1977-06-23 | Copper base thick film conductive paste* conductive element and method of making same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7489977A JPS549793A (en) | 1977-06-23 | 1977-06-23 | Copper base thick film conductive paste* conductive element and method of making same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS549793A true JPS549793A (en) | 1979-01-24 |
Family
ID=13560687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7489977A Pending JPS549793A (en) | 1977-06-23 | 1977-06-23 | Copper base thick film conductive paste* conductive element and method of making same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS549793A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002248038A (en) * | 2001-02-26 | 2002-09-03 | Yoshio Sugino | Framed ornamental article |
JP2022119790A (en) * | 2017-03-16 | 2022-08-17 | 旭化成株式会社 | Dispersion, method for producing conductive pattern-equipped structure by using dispersion, and conductive pattern-equipped structure |
US11760895B2 (en) | 2017-07-27 | 2023-09-19 | Asahi Kasei Kabushiki Kaisha | Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern |
-
1977
- 1977-06-23 JP JP7489977A patent/JPS549793A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002248038A (en) * | 2001-02-26 | 2002-09-03 | Yoshio Sugino | Framed ornamental article |
JP2022119790A (en) * | 2017-03-16 | 2022-08-17 | 旭化成株式会社 | Dispersion, method for producing conductive pattern-equipped structure by using dispersion, and conductive pattern-equipped structure |
US11760895B2 (en) | 2017-07-27 | 2023-09-19 | Asahi Kasei Kabushiki Kaisha | Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern |
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