JPS55102288A - Printed circuit copper foil and method of manufacturing same - Google Patents

Printed circuit copper foil and method of manufacturing same

Info

Publication number
JPS55102288A
JPS55102288A JP918879A JP918879A JPS55102288A JP S55102288 A JPS55102288 A JP S55102288A JP 918879 A JP918879 A JP 918879A JP 918879 A JP918879 A JP 918879A JP S55102288 A JPS55102288 A JP S55102288A
Authority
JP
Japan
Prior art keywords
printed circuit
copper foil
manufacturing same
circuit copper
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP918879A
Other languages
Japanese (ja)
Other versions
JPS5912039B2 (en
Inventor
Kouji Nakatsugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Circuit Foil Co Ltd
Original Assignee
Furukawa Circuit Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Circuit Foil Co Ltd filed Critical Furukawa Circuit Foil Co Ltd
Priority to JP918879A priority Critical patent/JPS5912039B2/en
Publication of JPS55102288A publication Critical patent/JPS55102288A/en
Publication of JPS5912039B2 publication Critical patent/JPS5912039B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP918879A 1979-01-31 1979-01-31 Copper foil for printed circuits and its manufacturing method Expired JPS5912039B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP918879A JPS5912039B2 (en) 1979-01-31 1979-01-31 Copper foil for printed circuits and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP918879A JPS5912039B2 (en) 1979-01-31 1979-01-31 Copper foil for printed circuits and its manufacturing method

Publications (2)

Publication Number Publication Date
JPS55102288A true JPS55102288A (en) 1980-08-05
JPS5912039B2 JPS5912039B2 (en) 1984-03-19

Family

ID=11713543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP918879A Expired JPS5912039B2 (en) 1979-01-31 1979-01-31 Copper foil for printed circuits and its manufacturing method

Country Status (1)

Country Link
JP (1) JPS5912039B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4483906A (en) * 1980-04-08 1984-11-20 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
JPS6256583A (en) * 1985-09-05 1987-03-12 Matsushita Electric Works Ltd Copper foil and laminated plate using it
US5320919A (en) * 1990-06-08 1994-06-14 Sumitomo Bakelite Company Limited Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same
JPH0774464A (en) * 1993-08-31 1995-03-17 Japan Energy Corp Copper foil for printed circuit and its manufacture
CN106191903A (en) * 2016-09-23 2016-12-07 上海应用技术大学 A kind of preparation method of silver vanadate photocatalyst
CN106367772A (en) * 2016-09-23 2017-02-01 上海应用技术大学 Preparation method of 3D flower-like spherical zinc vanadium oxide hydroxide hydrate photocatalyst
CN106367773A (en) * 2016-09-23 2017-02-01 上海应用技术大学 Preparation method of vanadic acid copper
CN106400044A (en) * 2016-09-23 2017-02-15 上海应用技术大学 Preparing method of lead vanadate
JP2021123728A (en) * 2020-01-31 2021-08-30 日本製鉄株式会社 Method of producing plating solution, plating solution, method of producing plated steel sheet, and plated steel sheet

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4483906A (en) * 1980-04-08 1984-11-20 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
JPS6256583A (en) * 1985-09-05 1987-03-12 Matsushita Electric Works Ltd Copper foil and laminated plate using it
JPH047901B2 (en) * 1985-09-05 1992-02-13 Matsushita Electric Works Ltd
US5320919A (en) * 1990-06-08 1994-06-14 Sumitomo Bakelite Company Limited Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same
JPH0774464A (en) * 1993-08-31 1995-03-17 Japan Energy Corp Copper foil for printed circuit and its manufacture
CN106191903A (en) * 2016-09-23 2016-12-07 上海应用技术大学 A kind of preparation method of silver vanadate photocatalyst
CN106367772A (en) * 2016-09-23 2017-02-01 上海应用技术大学 Preparation method of 3D flower-like spherical zinc vanadium oxide hydroxide hydrate photocatalyst
CN106367773A (en) * 2016-09-23 2017-02-01 上海应用技术大学 Preparation method of vanadic acid copper
CN106400044A (en) * 2016-09-23 2017-02-15 上海应用技术大学 Preparing method of lead vanadate
CN106367773B (en) * 2016-09-23 2018-08-17 上海应用技术大学 A kind of preparation method of copper vanadate
CN106367772B (en) * 2016-09-23 2018-08-24 上海应用技术大学 A kind of preparation method of 3D flower ball-shapeds pyrovanadic acid zinc photochemical catalyst
CN106191903B (en) * 2016-09-23 2018-12-04 上海应用技术大学 A kind of preparation method of silver vanadate photochemical catalyst
JP2021123728A (en) * 2020-01-31 2021-08-30 日本製鉄株式会社 Method of producing plating solution, plating solution, method of producing plated steel sheet, and plated steel sheet

Also Published As

Publication number Publication date
JPS5912039B2 (en) 1984-03-19

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