US4190474A - Method of making a printed circuit board having mutually etchable copper and nickel layers - Google Patents

Method of making a printed circuit board having mutually etchable copper and nickel layers Download PDF

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Publication number
US4190474A
US4190474A US05/863,109 US86310977A US4190474A US 4190474 A US4190474 A US 4190474A US 86310977 A US86310977 A US 86310977A US 4190474 A US4190474 A US 4190474A
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US
United States
Prior art keywords
nickel
copper foil
layer
etchable
sulfur
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US05/863,109
Other languages
English (en)
Inventor
Betty L. Berdan
Betty M. Luce
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Priority to US05/863,109 priority Critical patent/US4190474A/en
Priority to CA318,000A priority patent/CA1126410A/en
Priority to GB7848911A priority patent/GB2010910B/en
Priority to DE2854588A priority patent/DE2854588C2/de
Priority to LU80681A priority patent/LU80681A1/xx
Priority to IT52379/78A priority patent/IT1111381B/it
Priority to NLAANVRAGE7812452,A priority patent/NL185972C/nl
Priority to FR7835946A priority patent/FR2412406A1/fr
Priority to SE7813171A priority patent/SE439230B/sv
Priority to JP15773778A priority patent/JPS5491766A/ja
Priority to US06/077,051 priority patent/US4311768A/en
Priority to US06/077,465 priority patent/US4260449A/en
Application granted granted Critical
Publication of US4190474A publication Critical patent/US4190474A/en
Assigned to GOULD ELECTRONICS INC. reassignment GOULD ELECTRONICS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GOULD INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2063—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10 mixed adhesion layer containing metallic/inorganic and polymeric materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/1266—O, S, or organic compound in metal component

Definitions

  • the present invention relates to nickel coated copper foils which are readily etched. More particularly, it concerns a printed circuit board or blank which comprises a resinous substrate having bonded thereto, via a barrier layer of nickel, a layer of copper foil with the layer of nickel being characterized by its unique etchability.
  • Printed circuits are widely used in a variety of electronic applications, such as radios, televisions, computers, etc.
  • multi-layer laminates which have been developed to meet the demand for miniature electronic articles and the growing need for printed circuit boards having a high density of interconnections.
  • These laminates of synthetic plastics or resins and copper foil are made in such a way that circuits are possible not only on the surface but also spaced throughout the thickness of the laminates.
  • the resistivity of the plastic layer and the peel strength of the copper foil among other things, must be maintained as high as possible.
  • strict production quality control measures are followed, and special requirements on raw materials, such as the copper foil and the adhesive, are imposed.
  • the two types of copper foil as taught by the two above-mentioned patents are excellent when it comes to adhesion, whether in one layer or multi-layer laminates.
  • One source of difficulty has been the frequent appearance of stains and spottings throughout the resinous layer of the finished printed circuit boards. These stains of which brown spotting is a particularly troublesome type tend to adversely affect the dielectric properties of the resin and consequently the over-all performance of the printed circuit. Likewise, the physical appearance of the final product is undesirable.
  • the present invention concerns the provision of a nickel barrier layer which is readily etched by most copper etchants and the method of producing the same.
  • a composite metal structure including a sheet of copper foil having deposited on one surface thereof a layer of nickel which contains an effective amount of sulfur to render the copper foil and the nickel barrier layer mutally etchable, i.e., etchable by the same etchant.
  • the preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent.
  • a readily etchable printed circuit board comprising a resinous substrate having bonded to at least one surface thereof a composite metal structure including a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate, with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant.
  • the preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent.
  • the present invention concerns a method of producing a readily etchable printed circuit board including a resinous substrate and a sheet of copper foil having a nickel barrier layer deposited on one surface thereof with the opposite surface of said nickel layer being bonded to said resinous substrate which comprises providing a sheet of copper foil, depositing a layer of nickel on a surface of said sheet of copper foil which contains an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant, and bonding the exposed surface of said nickel barrier layer to said resinous substrate.
  • the preferred amount of sulfur ranges from about 0.05 to about 10 weight percent.
  • any form of copper foil can be used in the practice of the invention.
  • both rolled and electrolytically deposited copper foil can be utilized.
  • copper foil which has been produced electrolytically Copper foil which has been subjected to any one of the various well known techniques for rendering it more bondable to a resinous substrate can also be used in the practice of the instant invention. Since the manner of producing the copper foil is well known in the art, it will not be discussed herein.
  • the specific type of electrolysis bath utilized to deposit the nickel layer is not critical, so long as the bath contains a sufficient amount of a sulfur containing addition agent to cause the deposited nickel layer to contain an adequate amount of sulfur.
  • the nickel layer should contain an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant.
  • the preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent sulfur, with the most preferred amount ranging from about 0.1 to about 5.0 weight percent.
  • various bath compositions for electroplating nickel are well known, for the sake of brevity, they will not be discussed herein in detail.
  • Addition agents which are ideal for use in connection with the present invention are organic sulfonates, sulfonamides and sulfonimides.
  • the preferred addition agents are the so-called class I brighteners used in conventional bright nickel plating which result in sulfur-containing nickel deposits.
  • Typical examples include benzene disulfonic acid, benzene trisulfonic acid, naphthalene disulfonic acid, naphthalene trisulfonic acid, benzene sulfonamides and sulfonimides.
  • saccharin When it is desired to produce a low sulfur nickel alloy, saccharin preferably is used. However, if a high sulfur containing alloy is desired the thiocyanates and thiosulfates are preferably employed.
  • the exact amount of addition agent is determined emperically. That is, the addition agent is utilized in an amount sufficient to cause the nickel layer to contain an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant, preferably, at the same relative speed.
  • the preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent.
  • Example I represents the conventional practice (prior art) with the nickel barrier layer being sulfur free while Examples II-VI depict the practice of the invention.
  • a nickel barrier layer was plated on nodularized one-ounce copper foil from the following solution:
  • NiCl 2 .6H 2 O 45 grams per liter
  • NiSO 4 .6H 2 O 240 grams per liter
  • nickel sulfamate 300 grams per liter
  • NiCl 2 .6H 2 O 50 grams per liter
  • the current density employed was 150 amperes per square foot, plating time 15 seconds.
  • the thickness of the barrier layer, which contained 0.13 percent sulfur, was about 28-30 millionths of an inch. Laminated samples etched in the ammonium persulfate solution showed a clean etch of both copper and the nickel alloy barrier.
  • Example VI The increase in peel strength provided by Example VI is attributed to the fact that this barrier does not merely cover the existing structure but actually increases the roughness by nodular growth during the barrier treatment. This data has been supported by scanning electron micrographs of the surfaces before and after barriers are applied.
  • the desired electrical circuit is formed on the copper foil in the conventional manner. As such techniques are well known in the art, they will not be discussed in detail herein.
  • etchants In the manufacture of printed circuits, a variety of etchants are utilized with the specific one employed being a function of the etching processor's facilities and requirements. However, the general class of etches in commercial use today are ferric chloride, ammonium persulfate, cupric chloride, and a chromic-sulfuric acid combination, respectively. All of these work well with material produced according to the present invention. Ideal results were obtained when the foregoing etchants were used to mutually etch copper having a nickel barrier layer which contained as little as 0.05 weight percent sulfur.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Electroplating Methods And Accessories (AREA)
US05/863,109 1977-12-22 1977-12-22 Method of making a printed circuit board having mutually etchable copper and nickel layers Expired - Lifetime US4190474A (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
US05/863,109 US4190474A (en) 1977-12-22 1977-12-22 Method of making a printed circuit board having mutually etchable copper and nickel layers
CA318,000A CA1126410A (en) 1977-12-22 1978-12-14 Printed circuit board having mutually etchable copper and nickel layers
GB7848911A GB2010910B (en) 1977-12-22 1978-12-18 Printed circuit board having etchable copper and nickel layers
DE2854588A DE2854588C2 (de) 1977-12-22 1978-12-18 Verbundmaterial zur Herstellung gedruckter Schaltungen, dessen Herstellung und Verwendung
IT52379/78A IT1111381B (it) 1977-12-22 1978-12-20 Pannello per circuito stampato e struttura metallica nonche' procedimento per produrlo
LU80681A LU80681A1 (fr) 1977-12-22 1978-12-20 Plaque de circuit imprime comportant des couches de cuivre et de nickel pouvant etre soumises mutuellement a une morsure
NLAANVRAGE7812452,A NL185972C (nl) 1977-12-22 1978-12-21 Plaat voor gedrukte bedrading en werkwijze voor het vervaardigen van een dergelijke plaat.
FR7835946A FR2412406A1 (fr) 1977-12-22 1978-12-21 Plaque de circuit imprime facilement decapable et son procede de fabrication
SE7813171A SE439230B (sv) 1977-12-22 1978-12-21 Lett etsbara kort for tryckta kretsar och sett att framstella dylika kort
JP15773778A JPS5491766A (en) 1977-12-22 1978-12-22 Printed circuit board easy to errode and method of producing same
US06/077,051 US4311768A (en) 1977-12-22 1979-09-19 Printed circuit board having mutually etchable copper and nickel layers
US06/077,465 US4260449A (en) 1977-12-22 1979-09-19 Method of forming a printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/863,109 US4190474A (en) 1977-12-22 1977-12-22 Method of making a printed circuit board having mutually etchable copper and nickel layers

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US06/077,051 Division US4311768A (en) 1977-12-22 1979-09-19 Printed circuit board having mutually etchable copper and nickel layers
US06/077,465 Division US4260449A (en) 1977-12-22 1979-09-19 Method of forming a printed circuit

Publications (1)

Publication Number Publication Date
US4190474A true US4190474A (en) 1980-02-26

Family

ID=25340277

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/863,109 Expired - Lifetime US4190474A (en) 1977-12-22 1977-12-22 Method of making a printed circuit board having mutually etchable copper and nickel layers

Country Status (10)

Country Link
US (1) US4190474A (nl)
JP (1) JPS5491766A (nl)
CA (1) CA1126410A (nl)
DE (1) DE2854588C2 (nl)
FR (1) FR2412406A1 (nl)
GB (1) GB2010910B (nl)
IT (1) IT1111381B (nl)
LU (1) LU80681A1 (nl)
NL (1) NL185972C (nl)
SE (1) SE439230B (nl)

Cited By (27)

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US4385202A (en) * 1980-09-25 1983-05-24 Texas Instruments Incorporated Electronic circuit interconnection system
US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
US4472762A (en) * 1980-09-25 1984-09-18 Texas Instruments Incorporated Electronic circuit interconnection system
US4503112A (en) * 1981-06-12 1985-03-05 Oak Industries Inc. Printed circuit material
US4521476A (en) * 1982-08-19 1985-06-04 Denki Kagaku Kogyo Kabushiki Kaisha Hybrid integrated circuit and preparation thereof
US4546406A (en) * 1980-09-25 1985-10-08 Texas Instruments Incorporated Electronic circuit interconnection system
US4578304A (en) * 1983-12-28 1986-03-25 Nec Corporation Multilayer wiring substrate
US4619871A (en) * 1984-06-28 1986-10-28 Fukuda Metal Foil & Powder Co., Ltd. Copper foil for printed circuit board
WO1987002856A1 (en) * 1985-10-24 1987-05-07 Enthone, Incorporated Copper oxide treatment in printed circuit board
US4810332A (en) * 1988-07-21 1989-03-07 Microelectronics And Computer Technology Corporation Method of making an electrical multilayer copper interconnect
US5011580A (en) * 1989-10-24 1991-04-30 Microelectronics And Computer Technology Corporation Method of reworking an electrical multilayer interconnect
US5071518A (en) * 1989-10-24 1991-12-10 Microelectronics And Computer Technology Corporation Method of making an electrical multilayer interconnect
US5127986A (en) * 1989-12-01 1992-07-07 Cray Research, Inc. High power, high density interconnect method and apparatus for integrated circuits
US5185502A (en) * 1989-12-01 1993-02-09 Cray Research, Inc. High power, high density interconnect apparatus for integrated circuits
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
US5286304A (en) * 1991-10-24 1994-02-15 Enerdyne Corporation Thermoelectric device and method of manufacturing
US5320919A (en) * 1990-06-08 1994-06-14 Sumitomo Bakelite Company Limited Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same
US5358826A (en) * 1989-04-25 1994-10-25 Cray Research, Inc. Method of fabricating metallized chip carries from wafer-shaped substrates
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
GB2321647A (en) * 1997-01-29 1998-08-05 Shinko Electric Ind Co Electroplating baths for nickel or nickel alloy
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US6106907A (en) * 1996-06-25 2000-08-22 Canon Kabushiki Kaisha Electrode plate, liquid crystal device and production thereof
US20030143833A1 (en) * 1999-10-12 2003-07-31 North Corporation Wiring circuit substrate and manufacturing method therefor
US6759142B2 (en) 2001-07-31 2004-07-06 Kobe Steel Ltd. Plated copper alloy material and process for production thereof
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS56155593A (en) * 1980-04-08 1981-12-01 Furukawa Circuit Foil Steel foil for printed circuit and method of manufacturing same
EP0330210A3 (en) * 1988-02-26 1990-11-07 Gould Electronics Inc. Resistive metal layers and method for making same

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US2233546A (en) * 1939-05-24 1941-03-04 Meulendyke Charles Edmund Method for etching nickel
US2326999A (en) * 1940-03-11 1943-08-17 Harshaw Chem Corp Nickel plating
US2984595A (en) * 1956-06-21 1961-05-16 Sel Rex Precious Metals Inc Printed circuit manufacture
US3183067A (en) * 1961-12-06 1965-05-11 Harshaw Chemcial Company Metal having two coats of sulfurcontaining nickel and method of making same
US3454376A (en) * 1966-06-06 1969-07-08 Clevite Corp Metal composite and method of making same
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same
US3591350A (en) * 1968-06-17 1971-07-06 M & T Chemicals Inc Novel plating process
US4010005A (en) * 1973-06-23 1977-03-01 Mitsui-Anaconda Electro Copper Sheet Co., Ltd. Copper foil having bond strength
US4061837A (en) * 1976-06-17 1977-12-06 Hutkin Irving J Plastic-metal composite and method of making the same

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US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3293109A (en) * 1961-09-18 1966-12-20 Clevite Corp Conducting element having improved bonding characteristics and method
US3857681A (en) * 1971-08-03 1974-12-31 Yates Industries Copper foil treatment and products produced therefrom

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US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
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US4521476A (en) * 1982-08-19 1985-06-04 Denki Kagaku Kogyo Kabushiki Kaisha Hybrid integrated circuit and preparation thereof
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US7721422B2 (en) 1999-10-12 2010-05-25 Tessera Interconnect Materials, Inc. Methods of making microelectronic assemblies
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US7546681B2 (en) 1999-10-12 2009-06-16 Tessera Interconnect Materials, Inc. Manufacturing method for wiring circuit substrate
US7096578B2 (en) 1999-10-12 2006-08-29 Tessera Interconnect Materials, Inc. Manufacturing method for wiring circuit substrate
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Also Published As

Publication number Publication date
FR2412406A1 (fr) 1979-07-20
GB2010910A (en) 1979-07-04
GB2010910B (en) 1982-06-16
JPS616559B2 (nl) 1986-02-27
NL185972B (nl) 1990-03-16
IT1111381B (it) 1986-01-13
DE2854588A1 (de) 1979-07-05
IT7852379A0 (it) 1978-12-20
DE2854588C2 (de) 1986-07-03
FR2412406B1 (nl) 1983-12-16
LU80681A1 (fr) 1979-04-13
SE439230B (sv) 1985-06-03
CA1126410A (en) 1982-06-22
JPS5491766A (en) 1979-07-20
NL185972C (nl) 1990-08-16
NL7812452A (nl) 1979-06-26
SE7813171L (sv) 1979-06-23

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