SE0103159L - Metod och anordning för montering av oscillerande element genom chip-flip bonding - Google Patents

Metod och anordning för montering av oscillerande element genom chip-flip bonding

Info

Publication number
SE0103159L
SE0103159L SE0103159A SE0103159A SE0103159L SE 0103159 L SE0103159 L SE 0103159L SE 0103159 A SE0103159 A SE 0103159A SE 0103159 A SE0103159 A SE 0103159A SE 0103159 L SE0103159 L SE 0103159L
Authority
SE
Sweden
Prior art keywords
ceramic base
ceramic
quartz crystal
oscillating plate
top cavity
Prior art date
Application number
SE0103159A
Other languages
English (en)
Other versions
SE0103159D0 (sv
SE525158C2 (sv
Inventor
Gum-Young Youn
Hu-Nam Choi
Jong-Pil Lee
Jong-Tae Kim
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of SE0103159D0 publication Critical patent/SE0103159D0/sv
Publication of SE0103159L publication Critical patent/SE0103159L/sv
Publication of SE525158C2 publication Critical patent/SE525158C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H03H9/215—Crystal tuning forks consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13144—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
SE0103159A 2001-05-24 2001-09-24 Metod och anordning för montering av oscillerande element genom chip-flip bonding SE525158C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2001-0028646A KR100398364B1 (ko) 2001-05-24 2001-05-24 수정진동자의 제조방법 및 그로부터 제조된 수정진동자

Publications (3)

Publication Number Publication Date
SE0103159D0 SE0103159D0 (sv) 2001-09-24
SE0103159L true SE0103159L (sv) 2002-11-25
SE525158C2 SE525158C2 (sv) 2004-12-14

Family

ID=19709890

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0103159A SE525158C2 (sv) 2001-05-24 2001-09-24 Metod och anordning för montering av oscillerande element genom chip-flip bonding

Country Status (6)

Country Link
US (2) US20020189061A1 (sv)
JP (1) JP2002368564A (sv)
KR (1) KR100398364B1 (sv)
CN (1) CN1187896C (sv)
DE (1) DE10148186A1 (sv)
SE (1) SE525158C2 (sv)

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US7162418B2 (en) * 2001-11-15 2007-01-09 Microsoft Corporation Presentation-quality buffering process for real-time audio
JP2005321374A (ja) * 2004-04-07 2005-11-17 Nec Tokin Corp 音叉型圧電振動ジャイロ
JP2006101244A (ja) * 2004-09-29 2006-04-13 Kyocera Kinseki Corp 圧電振動子、及びその製造方法
JP4301200B2 (ja) * 2004-10-20 2009-07-22 セイコーエプソン株式会社 圧電振動片および圧電デバイス
US8826328B2 (en) * 2004-11-12 2014-09-02 Opentv, Inc. Communicating primary content streams and secondary content streams including targeted advertising to a remote unit
JP4658625B2 (ja) * 2005-01-25 2011-03-23 日本電波工業株式会社 角速度センサ及びその製造方法
JP5145637B2 (ja) * 2005-03-04 2013-02-20 ソニー株式会社 振動型ジャイロセンサ
JP5146578B2 (ja) * 2005-03-04 2013-02-20 ソニー株式会社 振動型ジャイロセンサ
US7694734B2 (en) * 2005-10-31 2010-04-13 Baker Hughes Incorporated Method and apparatus for insulating a resonator downhole
JP3969459B1 (ja) * 2006-04-26 2007-09-05 株式会社村田製作所 振動ジャイロ
JP2009055354A (ja) * 2007-08-27 2009-03-12 Daishinku Corp 圧電振動デバイス用パッケージ、および圧電振動デバイス
US9343651B2 (en) 2010-06-04 2016-05-17 Industrial Technology Research Institute Organic packaging carrier
TWI409919B (zh) 2010-06-04 2013-09-21 Ind Tech Res Inst 真空氣密之有機構裝載體與感測器元件構裝
CN103256927B (zh) * 2012-02-21 2015-12-09 北京自动化控制设备研究所 一种石英音叉止挡结构的制造方法
CN105322905A (zh) * 2014-05-30 2016-02-10 珠海东精大电子科技有限公司 高频率49s石英晶体谐振器的制备方法
CN104967419A (zh) * 2015-07-15 2015-10-07 廊坊中电熊猫晶体科技有限公司 Tcxo及其设计方法
CN110139479B (zh) * 2019-04-24 2021-08-27 江苏华讯电子技术有限公司 一种晶体安装方式

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574130B2 (sv) * 1973-12-27 1982-01-25
US5585687A (en) * 1994-02-23 1996-12-17 Citizen Watch Co., Ltd. Piezolelectric oscillator
KR20010066793A (ko) * 1999-05-14 2001-07-11 가네꼬 히사시 저융점 글래스, 절연 패키지 및 밀봉 부재
JP3386043B2 (ja) * 2000-08-09 2003-03-10 株式会社村田製作所 弾性表面波デバイス
US6628048B2 (en) * 2000-11-29 2003-09-30 Samsung Electro-Mechanics Co., Ltd. Crystal oscillator with improved shock resistance
JP2002319838A (ja) * 2001-02-19 2002-10-31 Seiko Epson Corp 圧電デバイス及びそのパッケージ
JP2002335128A (ja) * 2001-05-09 2002-11-22 Seiko Epson Corp 圧電デバイス
TW567664B (en) * 2001-10-09 2003-12-21 Ebauchesfabrik Eta Ag Piezoelectric resonator and assembly comprising the same enclosed in a case
KR100461721B1 (ko) * 2002-05-27 2004-12-14 삼성전기주식회사 리드 방열 세라믹 패키지

Also Published As

Publication number Publication date
KR100398364B1 (ko) 2003-09-19
JP2002368564A (ja) 2002-12-20
KR20020089767A (ko) 2002-11-30
DE10148186A1 (de) 2002-12-12
CN1388645A (zh) 2003-01-01
US20040012309A1 (en) 2004-01-22
SE0103159D0 (sv) 2001-09-24
US20020189061A1 (en) 2002-12-19
SE525158C2 (sv) 2004-12-14
CN1187896C (zh) 2005-02-02

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