SE0002618L - Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel - Google Patents

Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel

Info

Publication number
SE0002618L
SE0002618L SE0002618A SE0002618A SE0002618L SE 0002618 L SE0002618 L SE 0002618L SE 0002618 A SE0002618 A SE 0002618A SE 0002618 A SE0002618 A SE 0002618A SE 0002618 L SE0002618 L SE 0002618L
Authority
SE
Sweden
Prior art keywords
application errors
correcting application
substrate
errors
providing
Prior art date
Application number
SE0002618A
Other languages
English (en)
Other versions
SE518642C2 (sv
SE0002618D0 (sv
Inventor
William Holm
Nils Jacobsson
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE0002618A priority Critical patent/SE518642C2/sv
Publication of SE0002618D0 publication Critical patent/SE0002618D0/sv
Priority to EP01945902A priority patent/EP1308072B1/en
Priority to AT01945902T priority patent/ATE488982T1/de
Priority to JP2002508878A priority patent/JP4917236B2/ja
Priority to KR1020037000314A priority patent/KR100796875B1/ko
Priority to CNB018126189A priority patent/CN1269389C/zh
Priority to DE60143485T priority patent/DE60143485D1/de
Priority to AU2001268010A priority patent/AU2001268010A1/en
Priority to PCT/SE2001/001566 priority patent/WO2002005607A1/en
Priority to US09/902,110 priority patent/US7201802B2/en
Publication of SE0002618L publication Critical patent/SE0002618L/sv
Publication of SE518642C2 publication Critical patent/SE518642C2/sv
Priority to US11/503,195 priority patent/US7931933B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Coating Apparatus (AREA)
SE0002618A 2000-07-11 2000-07-11 Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel SE518642C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE0002618A SE518642C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
PCT/SE2001/001566 WO2002005607A1 (en) 2000-07-11 2001-07-06 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors
KR1020037000314A KR100796875B1 (ko) 2000-07-11 2001-07-06 점성 매체를 기판에 제공하는 방법과 장치 및 도포 에러의수정을 위한 분사 수단의 사용 방법
AT01945902T ATE488982T1 (de) 2000-07-11 2001-07-06 Verfahren und vorrichtung zur bereitstellung eines substrats mit viskosem medium und verwendung eines jet-mittels zur korrektur von auftragfehlern
JP2002508878A JP4917236B2 (ja) 2000-07-11 2001-07-06 粘性媒体を備えた基板を用意する方法と装置及び塗布誤りの訂正のための噴射手段の使用
EP01945902A EP1308072B1 (en) 2000-07-11 2001-07-06 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors
CNB018126189A CN1269389C (zh) 2000-07-11 2001-07-06 为衬底提供粘性介质及使用喷射装置改正涂敷错误的方法和设备
DE60143485T DE60143485D1 (de) 2000-07-11 2001-07-06 Substrats mit viskosem medium und verwendung eines jet-mittels zur korrektur von auftragfehlern
AU2001268010A AU2001268010A1 (en) 2000-07-11 2001-07-06 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors
US09/902,110 US7201802B2 (en) 2000-07-11 2001-07-11 Apparatus for providing a substrate with viscous medium
US11/503,195 US7931933B2 (en) 2000-07-11 2006-08-14 Method and apparatus for providing a substrate with viscous medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0002618A SE518642C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel

Publications (3)

Publication Number Publication Date
SE0002618D0 SE0002618D0 (sv) 2000-07-11
SE0002618L true SE0002618L (sv) 2002-03-06
SE518642C2 SE518642C2 (sv) 2002-11-05

Family

ID=20280454

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0002618A SE518642C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel

Country Status (10)

Country Link
US (2) US7201802B2 (sv)
EP (1) EP1308072B1 (sv)
JP (1) JP4917236B2 (sv)
KR (1) KR100796875B1 (sv)
CN (1) CN1269389C (sv)
AT (1) ATE488982T1 (sv)
AU (1) AU2001268010A1 (sv)
DE (1) DE60143485D1 (sv)
SE (1) SE518642C2 (sv)
WO (1) WO2002005607A1 (sv)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE518640C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
US7187949B2 (en) * 2001-01-19 2007-03-06 The Directv Group, Inc. Multiple basestation communication system having adaptive antennas
NL1022515C2 (nl) * 2003-01-29 2004-08-03 Vitronics Soltec B V Inrichting en werkwijze voor correctief solderen.
GB0307105D0 (en) * 2003-03-27 2003-04-30 Pillarhouse Int Ltd Soldering method and apparatus
JP4576270B2 (ja) 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
WO2007007865A1 (en) 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
CN101356037A (zh) 2005-11-14 2009-01-28 麦德塔自动化股份有限公司 喷射设备和通过使用测量气流的流量传感器改进喷射设备的性能的方法
JP4816194B2 (ja) * 2006-03-29 2011-11-16 パナソニック株式会社 電子部品実装システムおよび電子部品搭載装置ならびに電子部品実装方法
US20100009070A1 (en) * 2006-10-17 2010-01-14 Showa Denko K.K. Method for forming solder layer on printed-wiring board and slurry discharge device
DE102006056879A1 (de) * 2006-12-01 2008-06-05 Dürr Systems GmbH Fehlerprotokollierungsverfahren für eine Beschichtungsanlage
ITUD20070195A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Procedimento di produzione e controllo di piastre per elettronica e relativo apparato
US20090306811A1 (en) * 2008-06-06 2009-12-10 Raytheon Company Ball grid array cleaning system
KR101103000B1 (ko) * 2009-04-13 2012-01-05 주식회사 에너지 오션 다단계 연소방식에 의한 고형연료 연소장치
DE102009053575B4 (de) 2009-11-06 2016-06-30 Ekra Automatisierungssysteme Gmbh Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste
JP5007750B2 (ja) * 2010-03-05 2012-08-22 オムロン株式会社 はんだ印刷状態の分析作業の支援方法およびはんだ印刷検査機
US8474377B2 (en) 2010-12-08 2013-07-02 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US8733244B2 (en) 2010-12-08 2014-05-27 Illinois Tool Works, Inc. Methods for depositing viscous material on a substrate with a combination stencil printer and dispenser
US8739699B2 (en) * 2010-12-08 2014-06-03 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US8746139B2 (en) * 2010-12-08 2014-06-10 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
EP2790473A1 (en) * 2013-04-09 2014-10-15 ASM Assembly Systems GmbH & Co. KG Optimizing parameters for printing solder paste onto a PCB
KR101508593B1 (ko) 2013-12-03 2015-04-07 주식회사 고영테크놀러지 솔더 리워크 방법, 이를 이용한 솔더 리워크 장치 및 이를 채용한 기판 검사방법
JP2015109397A (ja) * 2013-12-06 2015-06-11 パナソニックＩｐマネジメント株式会社 電子部品実装方法及び電子部品実装システム
DE102014202170A1 (de) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Bedrucken von Substraten
WO2015182877A1 (ko) * 2014-05-30 2015-12-03 주식회사 파미 디스펜서 내장형삼차원 측정 장치
US11076490B2 (en) 2014-09-09 2021-07-27 Mycronic AB Method and device for applying solder paste flux
US10576566B2 (en) * 2016-06-06 2020-03-03 International Business Machines Corporation Solder paste misprint cleaning
EP3960457A4 (en) * 2019-04-26 2022-05-04 Fuji Corporation PRINT PARAMETER ACQUISITION DEVICE AND PRINT PARAMETER ACQUISITION METHOD
JP7467176B2 (ja) * 2020-03-16 2024-04-15 日本発條株式会社 接着剤の塗布方法および塗布装置
GB2615602A (en) * 2022-02-15 2023-08-16 Asmpt Gmbh Co Kg Automated reprinting of workpieces
CN116804611B (zh) * 2023-08-22 2024-01-26 宁德时代新能源科技股份有限公司 检测设备的自动评估方法和系统

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US15780A (en) * 1856-09-23 Hoop-machiue
US3580462A (en) * 1967-12-14 1971-05-25 Louis Vanyi Soldering apparatus
GB1270926A (en) * 1968-04-05 1972-04-19 Johnson Matthey Co Ltd Improvements in and relating to a method of making metal articles
US3738760A (en) * 1971-10-13 1973-06-12 Plastic Kote Co Paint touch-up container
US3713741A (en) * 1972-01-03 1973-01-30 Western Electric Co Methods of and apparatus for locating solder faults
US3962487A (en) * 1975-02-03 1976-06-08 Texas Instruments Incorporated Method of making ceramic semiconductor elements with ohmic contact surfaces
US4239827A (en) * 1979-01-15 1980-12-16 Union Carbide Corporation Flame-sprayed thermoplastic substrate is coated with an adhesive layer which bonds particles of an adsorbent like carbon to the substrate
FR2552345B1 (fr) * 1983-09-27 1985-12-20 Sames Sa Appareillage de peinture electrostatique a pulverisateur pneumatique sur support mobile, reglable en fonctionnement
US5377098A (en) * 1988-02-26 1994-12-27 Nissan Motor Co., Ltd. Method and apparatus for compiling data relating to damage extent, panel and chassis member rectification work, painting work and costs
JPH07109935B2 (ja) 1989-01-27 1995-11-22 オムロン株式会社 半田不良の自動修正方法およびその装置
JPH02214577A (ja) * 1989-02-14 1990-08-27 Matsushita Electric Ind Co Ltd 接着剤塗布方法
SE465713B (sv) 1990-02-12 1991-10-21 Mydata Automation Ab Anordning foer att utlaegga pastor och lim
JPH03297102A (ja) * 1990-04-17 1991-12-27 Cmk Corp プリント配線板におけるカーボン抵抗体の形成方法
JPH04239797A (ja) 1991-01-23 1992-08-27 Sharp Corp スクリーン印刷装置
US5108024A (en) * 1991-06-03 1992-04-28 Motorola, Inc. Method of inspecting solder joints
US5495337A (en) * 1991-11-06 1996-02-27 Machine Vision Products, Inc. Method of visualizing minute particles
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
JP3288128B2 (ja) * 1993-05-21 2002-06-04 松下電器産業株式会社 印刷装置および印刷方法
DE69322775T2 (de) * 1993-08-12 1999-07-22 International Business Machines Corp., Armonk, N.Y. Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls
JPH07263845A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd プリント配線板の製造方法及びその製造装置
JPH07312694A (ja) * 1994-05-18 1995-11-28 Matsushita Electric Ind Co Ltd 画像蓄積転送装置
JP3241251B2 (ja) * 1994-12-16 2001-12-25 キヤノン株式会社 電子放出素子の製造方法及び電子源基板の製造方法
US6026176A (en) * 1995-07-25 2000-02-15 Cognex Corporation Machine vision methods and articles of manufacture for ball grid array inspection
US5938102A (en) * 1995-09-25 1999-08-17 Muntz; Eric Phillip High speed jet soldering system
US5839188A (en) * 1996-01-05 1998-11-24 Alliedsignal Inc. Method of manufacturing a printed circuit assembly
DE69738794D1 (de) * 1996-02-08 2008-08-14 Canon Kk Verfahren zur Herstellung einer elektronenemittierende Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes und Verfahren zur Überprüfung der Herstellung
JP3310540B2 (ja) * 1996-05-22 2002-08-05 松下電器産業株式会社 スクリーン印刷方法とその装置
US5912732A (en) * 1996-07-05 1999-06-15 Kabushiki Kaisha Topcon Surface detecting apparatus
US5988480A (en) * 1997-12-12 1999-11-23 Micron Technology, Inc. Continuous mode solder jet apparatus
JPH10282322A (ja) * 1997-04-02 1998-10-23 Toray Ind Inc 基板の部分欠陥修正方法およびその装置並びにカラーフィルターの製造方法および製造装置
US6033503A (en) * 1997-05-05 2000-03-07 Steven K. Radowicz Adhesive sensing assembly for end jointed beam
US6100787A (en) * 1997-05-28 2000-08-08 Motorola, Inc. Multilayer ceramic package with low-variance embedded resistors
JP3332854B2 (ja) * 1997-06-17 2002-10-07 キヤノン株式会社 カラーフィルタの製造方法
US5947022A (en) 1997-11-07 1999-09-07 Speedline Technologies, Inc. Apparatus for dispensing material in a printer
SE513527C2 (sv) * 1998-06-11 2000-09-25 Mydata Automation Ab Anordning och förfarande för utskjutning av små droppar
SE514859C2 (sv) 1999-01-18 2001-05-07 Mydata Automation Ab Förfarande och anordning för undersökning av objekt på ett substrat genom att ta bilder av substratet och analysera dessa
JP3403677B2 (ja) * 1999-09-06 2003-05-06 マイクロ・テック株式会社 半田ボール形成方法
US6541063B1 (en) * 1999-11-04 2003-04-01 Speedline Technologies, Inc. Calibration of a dispensing system
US6613240B2 (en) * 1999-12-06 2003-09-02 Epion Corporation Method and apparatus for smoothing thin conductive films by gas cluster ion beam
TW558736B (en) * 2000-02-26 2003-10-21 Shipley Co Llc Method of reducing defects
JP3758463B2 (ja) * 2000-05-09 2006-03-22 松下電器産業株式会社 スクリーン印刷の検査方法
SE518640C2 (sv) 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning

Also Published As

Publication number Publication date
AU2001268010A1 (en) 2002-01-21
KR100796875B1 (ko) 2008-01-22
CN1269389C (zh) 2006-08-09
ATE488982T1 (de) 2010-12-15
KR20030016389A (ko) 2003-02-26
US20060275538A1 (en) 2006-12-07
CN1442030A (zh) 2003-09-10
US7931933B2 (en) 2011-04-26
JP2004502538A (ja) 2004-01-29
DE60143485D1 (de) 2010-12-30
SE518642C2 (sv) 2002-11-05
EP1308072A1 (en) 2003-05-07
WO2002005607A1 (en) 2002-01-17
EP1308072B1 (en) 2010-11-17
JP4917236B2 (ja) 2012-04-18
SE0002618D0 (sv) 2000-07-11
US7201802B2 (en) 2007-04-10
US20020014602A1 (en) 2002-02-07

Similar Documents

Publication Publication Date Title
SE0002618L (sv) Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
EP1956431A4 (en) EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
ATE289407T1 (de) Dynamischer vergleich von artefakten
NO992124L (no) Apparat med elektroniske og/eller optoelektroniske kretser samt fremgangsmÕte til realisering av kretsene
SE0002723D0 (sv) Förfarande för att uppskatta skada på ett objekt, och förfarande och system för kontroll av användning av objektet
ATE412940T1 (de) Speichersteuerung zur erkennung eines spekulationsfehlers einer addressierten komponente
EP1047115A3 (en) Method and apparatus for aligning a cassette
DE602005011067D1 (de) Ultraviolettdetektionssensor und Verfahren zu dessen Herstellung
FI20002281A (sv) Förfarande och anordning för tidsbestämning i ett satellitlokaliseringssystem
WO2009072199A1 (ja) 基板搬送装置及び基板搬送装置の制御方法
TW200504349A (en) Automatic optical inspection system and method
SG132660A1 (en) A method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
ATE309651T1 (de) Verfahren und vorrichtung zur ausführung von fehlerkorrektur durch kombination von zwei instanzen einer nachricht
DE60322328D1 (de) Bildkorrekturvorrichtung und Bildaufnahmevorrichtung
EP1931034A3 (en) Error correction method and apparatus for predetermined error patterns
MY149740A (en) Optical detection device and method for detecting surface of components
ATE312956T1 (de) Beschichtungsvorrichtung mit transporteinrichtung
WO2006002969A3 (en) Device and method for chemically and electrolytically treating work pieces
TW200704146A (en) Plotting method, plotting device, plotting system and correction method
ATE288672T1 (de) Verfahren und vorrichtung zum kalibrieren eines verfahrwegs und/oder einer winkellage einer haltevorrichtung in einer einrichtung zur herstellung von elektrischen baugruppen sowie kalibriersubstrat
ATE548753T1 (de) Vorrichtung und verfahren zum überprüfen und umdrehen elektronischer bauelemente
DE69934181T8 (de) Verfahren und Vorrichtung zum Bonden einer Komponente
RU2010129691A (ru) Способ корректировки коэффициента усиления емкостного элемента и устройство для его осуществления
WO2006097085A3 (de) Messgerät, messverfahren, messleitung und elektrode
ATE396607T1 (de) Klebeverfahren und -vorrichtung