DE69934181T8 - Verfahren und Vorrichtung zum Bonden einer Komponente - Google Patents

Verfahren und Vorrichtung zum Bonden einer Komponente Download PDF

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Publication number
DE69934181T8
DE69934181T8 DE69934181T DE69934181T DE69934181T8 DE 69934181 T8 DE69934181 T8 DE 69934181T8 DE 69934181 T DE69934181 T DE 69934181T DE 69934181 T DE69934181 T DE 69934181T DE 69934181 T8 DE69934181 T8 DE 69934181T8
Authority
DE
Germany
Prior art keywords
component
bonding
board
holding unit
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE69934181T
Other languages
English (en)
Other versions
DE69934181D1 (de
DE69934181T2 (de
Inventor
Kiyofumi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of DE69934181D1 publication Critical patent/DE69934181D1/de
Application granted granted Critical
Publication of DE69934181T2 publication Critical patent/DE69934181T2/de
Publication of DE69934181T8 publication Critical patent/DE69934181T8/de
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Led Device Packages (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69934181T 1998-09-25 1999-09-23 Verfahren und Vorrichtung zum Bonden einer Komponente Active DE69934181T8 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP27131898 1998-09-25
JP27131898 1998-09-25
JP11050901A JP2000164626A (ja) 1998-09-25 1999-02-26 部品のボンディング方法および装置
JP5090199 1999-02-26

Publications (3)

Publication Number Publication Date
DE69934181D1 DE69934181D1 (de) 2007-01-11
DE69934181T2 DE69934181T2 (de) 2007-03-08
DE69934181T8 true DE69934181T8 (de) 2007-09-27

Family

ID=26391387

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934181T Active DE69934181T8 (de) 1998-09-25 1999-09-23 Verfahren und Vorrichtung zum Bonden einer Komponente

Country Status (5)

Country Link
US (1) US6266891B1 (de)
EP (1) EP0989601B1 (de)
JP (1) JP2000164626A (de)
AT (1) ATE347175T1 (de)
DE (1) DE69934181T8 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3416091B2 (ja) * 2000-01-21 2003-06-16 株式会社新川 ボンディング装置およびボンディング方法
US7222431B1 (en) * 2006-02-03 2007-05-29 Gilson, Inc. Alignment correction system and methods of use thereof
AT513747B1 (de) 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
EP3179523B1 (de) 2014-08-04 2020-09-23 FUJI Corporation Montagevorrichtung
KR102238649B1 (ko) * 2014-09-16 2021-04-09 삼성전자주식회사 반도체 칩 본딩 장치
DE102015200393A1 (de) * 2015-01-14 2016-07-14 Automotive Lighting Reutlingen Gmbh Verfahren zum Anordnen eines SMD-Halbleiterlichtquellenbauteils einer Beleuchtungseinrichtung eines Kraftfahrzeugs
CN107611051A (zh) * 2017-10-23 2018-01-19 惠州市齐力光电科技有限公司 一种应用于对led检测的检测机构
CN113808976B (zh) * 2021-11-22 2022-03-01 武汉琢越光电有限公司 半导体芯片自动共晶机

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376338A (en) * 1980-01-28 1983-03-15 Magnetic Peripherals Inc. Apparatus for aligning and press-fitting connector terminals into a substrate
FR2491614A1 (fr) * 1980-10-08 1982-04-09 Couturier Alain Procede pour le positionnement de points de reference sur un gabarit ajustable
JPS61123868A (ja) * 1984-11-21 1986-06-11 キヤノン株式会社 パネル基板の位置合せ保証方法
US4808892A (en) * 1985-12-13 1989-02-28 Kulick And Soffa Ind. Inc. Bi-directional drive motor system
JP3087305B2 (ja) * 1990-03-05 2000-09-11 株式会社ニコン ステージ装置
US5077905A (en) * 1990-06-04 1992-01-07 Murray Jr Malcolm G Laser alignment mount assembly and method
US5737441A (en) * 1991-12-12 1998-04-07 Nikon Corporation Aligning method and apparatus
JP2844409B2 (ja) 1993-05-20 1999-01-06 澁谷工業株式会社 半導体位置決め方法
JP2541489B2 (ja) * 1993-12-06 1996-10-09 日本電気株式会社 ワイヤボンディング装置
US5456018A (en) * 1994-02-28 1995-10-10 The Whitaker Corporation Alignment system for planar electronic devices arranged in parallel fashion
JP2930093B2 (ja) * 1995-08-18 1999-08-03 澁谷工業株式会社 ボンディング方法
US6040903A (en) * 1997-01-22 2000-03-21 Pruftechnik Dieter Busch Ag Electro-optical measuring device for determining the relative position of two bodies, or of two surface areas of bodies, in relation to each other

Also Published As

Publication number Publication date
EP0989601A3 (de) 2003-11-19
EP0989601A2 (de) 2000-03-29
ATE347175T1 (de) 2006-12-15
US6266891B1 (en) 2001-07-31
DE69934181D1 (de) 2007-01-11
EP0989601B1 (de) 2006-11-29
JP2000164626A (ja) 2000-06-16
DE69934181T2 (de) 2007-03-08

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: YAMAMOTO, KIYOFUMI, KANAGAWA, JP

8327 Change in the person/name/address of the patent owner

Owner name: FUJIFILM CORP., TOKIO/TOKYO, JP

8364 No opposition during term of opposition