RU2499325C2 - Твердотельный датчик изображения, способ его изготовления и аппарат для съемки - Google Patents
Твердотельный датчик изображения, способ его изготовления и аппарат для съемки Download PDFInfo
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- RU2499325C2 RU2499325C2 RU2011151087/28A RU2011151087A RU2499325C2 RU 2499325 C2 RU2499325 C2 RU 2499325C2 RU 2011151087/28 A RU2011151087/28 A RU 2011151087/28A RU 2011151087 A RU2011151087 A RU 2011151087A RU 2499325 C2 RU2499325 C2 RU 2499325C2
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 230
- 239000012535 impurity Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 15
- 150000002500 ions Chemical class 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 238000005468 ion implantation Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000002513 implantation Methods 0.000 claims 1
- 238000009825 accumulation Methods 0.000 abstract description 9
- 230000035945 sensitivity Effects 0.000 abstract description 8
- 239000000126 substance Substances 0.000 abstract 1
- 238000009826 distribution Methods 0.000 description 11
- 102100040678 Programmed cell death protein 1 Human genes 0.000 description 9
- 101710089372 Programmed cell death protein 1 Proteins 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
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- 238000006243 chemical reaction Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000000737 periodic effect Effects 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
- H10F39/8027—Geometry of the photosensitive area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8033—Photosensitive area
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010279873A JP5767465B2 (ja) | 2010-12-15 | 2010-12-15 | 固体撮像装置およびその製造方法ならびにカメラ |
| JP2010-279873 | 2010-12-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2011151087A RU2011151087A (ru) | 2013-06-20 |
| RU2499325C2 true RU2499325C2 (ru) | 2013-11-20 |
Family
ID=45044456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2011151087/28A RU2499325C2 (ru) | 2010-12-15 | 2011-12-14 | Твердотельный датчик изображения, способ его изготовления и аппарат для съемки |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8896734B2 (enExample) |
| EP (1) | EP2466641B1 (enExample) |
| JP (1) | JP5767465B2 (enExample) |
| KR (1) | KR101426329B1 (enExample) |
| CN (1) | CN102544036B (enExample) |
| RU (1) | RU2499325C2 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709304B (zh) * | 2012-06-26 | 2013-06-19 | 天津大学 | 提高图像传感器满阱容量与量子效率光电二极管及方法 |
| JP6055270B2 (ja) | 2012-10-26 | 2016-12-27 | キヤノン株式会社 | 固体撮像装置、その製造方法、およびカメラ |
| US20140246561A1 (en) * | 2013-03-04 | 2014-09-04 | Omnivision Technologies, Inc. | High dynamic range pixel having a plurality of photodiodes with a single implant |
| JP2015026677A (ja) * | 2013-07-25 | 2015-02-05 | 株式会社東芝 | 固体撮像装置 |
| JP2015177034A (ja) | 2014-03-14 | 2015-10-05 | キヤノン株式会社 | 固体撮像装置、その製造方法、及びカメラ |
| JP6406911B2 (ja) * | 2014-07-24 | 2018-10-17 | キヤノン株式会社 | 撮像装置及び撮像装置の製造方法 |
| JP6799739B2 (ja) * | 2016-03-30 | 2020-12-16 | 株式会社ブルックマンテクノロジ | 光検出素子及び固体撮像装置 |
| US10157941B2 (en) * | 2016-11-17 | 2018-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Image sensor and fabrication method thereof |
| JP6552479B2 (ja) | 2016-12-28 | 2019-07-31 | キヤノン株式会社 | 固体撮像装置及び撮像システム |
| JP6840555B2 (ja) * | 2017-01-30 | 2021-03-10 | キヤノン株式会社 | 固体撮像装置及び撮像システム |
| JP6949563B2 (ja) * | 2017-06-02 | 2021-10-13 | キヤノン株式会社 | 固体撮像装置、撮像システム及び移動体 |
| JP6953263B2 (ja) | 2017-10-05 | 2021-10-27 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP7108421B2 (ja) | 2018-02-15 | 2022-07-28 | キヤノン株式会社 | 撮像装置及び撮像システム |
| JP7134781B2 (ja) | 2018-08-17 | 2022-09-12 | キヤノン株式会社 | 光電変換装置及び撮像システム |
| JP2020088293A (ja) * | 2018-11-29 | 2020-06-04 | キヤノン株式会社 | 光電変換装置、光電変換システム、移動体 |
| US11503234B2 (en) | 2019-02-27 | 2022-11-15 | Canon Kabushiki Kaisha | Photoelectric conversion device, imaging system, radioactive ray imaging system, and movable object |
| JP7576928B2 (ja) * | 2020-05-08 | 2024-11-01 | 浜松ホトニクス株式会社 | 光検出装置、及び光センサの駆動方法 |
| JP7652543B2 (ja) | 2020-07-29 | 2025-03-27 | キヤノン株式会社 | 光電変換装置 |
| JP7534902B2 (ja) | 2020-09-23 | 2024-08-15 | キヤノン株式会社 | 光電変換装置、撮像装置、半導体装置及び光電変換システム |
| JP2023023218A (ja) | 2021-08-04 | 2023-02-16 | キヤノン株式会社 | 光電変換装置 |
| JP2024004306A (ja) | 2022-06-28 | 2024-01-16 | キヤノン株式会社 | 光電変換装置 |
| JP2024017294A (ja) | 2022-07-27 | 2024-02-08 | キヤノン株式会社 | 光電変換装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0944117A1 (en) * | 1998-03-17 | 1999-09-22 | Sony Corporation | Semiconductor device comprising a divided photodiode, method of making the same, and corresponding optical pickup device |
| JP2006032681A (ja) * | 2004-07-16 | 2006-02-02 | Sony Corp | 半導体装置および物理情報取得装置並びに半導体装置の駆動方法 |
| US7334211B1 (en) * | 2004-12-30 | 2008-02-19 | Ess Technology, Inc. | Method for designing a CMOS sensor using parameters |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0812905B2 (ja) | 1986-07-11 | 1996-02-07 | キヤノン株式会社 | 光電変換装置及びその製造方法 |
| JPH0812906B2 (ja) | 1986-07-11 | 1996-02-07 | キヤノン株式会社 | 光電変換装置の製造方法 |
| DE3856165T2 (de) | 1987-01-29 | 1998-08-27 | Canon Kk | Photovoltaischer Wandler |
| US6690423B1 (en) * | 1998-03-19 | 2004-02-10 | Kabushiki Kaisha Toshiba | Solid-state image pickup apparatus |
| US6346722B1 (en) | 1998-06-26 | 2002-02-12 | Nec Corporation | Solid state imaging device and method for manufacturing the same |
| JP3460225B2 (ja) | 2000-04-06 | 2003-10-27 | 日本電気株式会社 | 電荷結合素子及びその製造法 |
| JP3647390B2 (ja) | 2000-06-08 | 2005-05-11 | キヤノン株式会社 | 電荷転送装置、固体撮像装置及び撮像システム |
| CN1225897C (zh) | 2002-08-21 | 2005-11-02 | 佳能株式会社 | 摄像装置 |
| US7078745B2 (en) * | 2003-03-05 | 2006-07-18 | Micron Technology, Inc. | CMOS imager with enhanced transfer of charge and low voltage operation |
| US6921934B2 (en) * | 2003-03-28 | 2005-07-26 | Micron Technology, Inc. | Double pinned photodiode for CMOS APS and method of formation |
| JP4194544B2 (ja) | 2003-12-05 | 2008-12-10 | キヤノン株式会社 | 固体撮像装置及び固体撮像装置の駆動方法 |
| US7250665B1 (en) * | 2004-12-30 | 2007-07-31 | Ess Technology, Inc. | Method and apparatus for removing electrons from CMOS sensor photodetectors |
| US7141836B1 (en) | 2005-05-31 | 2006-11-28 | International Business Machines Corporation | Pixel sensor having doped isolation structure sidewall |
| JP2008078302A (ja) * | 2006-09-20 | 2008-04-03 | Canon Inc | 撮像装置および撮像システム |
| US7795655B2 (en) | 2006-10-04 | 2010-09-14 | Sony Corporation | Solid-state imaging device and electronic device |
| CN100517651C (zh) | 2006-12-15 | 2009-07-22 | 中芯国际集成电路制造(上海)有限公司 | Cmos图像传感器的像素单元的形成方法 |
| JP5324056B2 (ja) | 2007-05-16 | 2013-10-23 | 株式会社デンソー | 固体撮像装置及びその駆動方法 |
| JP5151371B2 (ja) * | 2007-09-28 | 2013-02-27 | ソニー株式会社 | 固体撮像装置並びにカメラ |
| JP5365144B2 (ja) | 2008-11-06 | 2013-12-11 | ソニー株式会社 | 固体撮像装置とその製造方法、及び電子機器 |
| JP5374941B2 (ja) | 2008-07-02 | 2013-12-25 | ソニー株式会社 | 固体撮像装置及び電子機器 |
| JP2010147193A (ja) | 2008-12-17 | 2010-07-01 | Sharp Corp | 固体撮像装置およびその製造方法、並びに電子情報機器 |
| JP5558857B2 (ja) * | 2009-03-09 | 2014-07-23 | キヤノン株式会社 | 光電変換装置およびそれを用いた撮像システム |
| JP5493430B2 (ja) | 2009-03-31 | 2014-05-14 | ソニー株式会社 | 固体撮像装置とその製造方法、及び電子機器 |
| JP5489570B2 (ja) | 2009-07-27 | 2014-05-14 | キヤノン株式会社 | 光電変換装置及び撮像システム |
-
2010
- 2010-12-15 JP JP2010279873A patent/JP5767465B2/ja not_active Expired - Fee Related
-
2011
- 2011-11-30 US US13/307,361 patent/US8896734B2/en not_active Expired - Fee Related
- 2011-12-02 EP EP11191669.8A patent/EP2466641B1/en not_active Not-in-force
- 2011-12-12 CN CN201110410224.6A patent/CN102544036B/zh not_active Expired - Fee Related
- 2011-12-14 KR KR1020110134411A patent/KR101426329B1/ko not_active Expired - Fee Related
- 2011-12-14 RU RU2011151087/28A patent/RU2499325C2/ru active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0944117A1 (en) * | 1998-03-17 | 1999-09-22 | Sony Corporation | Semiconductor device comprising a divided photodiode, method of making the same, and corresponding optical pickup device |
| JP2006032681A (ja) * | 2004-07-16 | 2006-02-02 | Sony Corp | 半導体装置および物理情報取得装置並びに半導体装置の駆動方法 |
| US7334211B1 (en) * | 2004-12-30 | 2008-02-19 | Ess Technology, Inc. | Method for designing a CMOS sensor using parameters |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2466641A1 (en) | 2012-06-20 |
| KR101426329B1 (ko) | 2014-08-06 |
| JP2012129371A (ja) | 2012-07-05 |
| CN102544036B (zh) | 2016-01-13 |
| RU2011151087A (ru) | 2013-06-20 |
| KR20120067298A (ko) | 2012-06-25 |
| CN102544036A (zh) | 2012-07-04 |
| US20120154650A1 (en) | 2012-06-21 |
| JP5767465B2 (ja) | 2015-08-19 |
| EP2466641B1 (en) | 2019-03-27 |
| US8896734B2 (en) | 2014-11-25 |
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