RU2379861C2 - Многослойный элемент, имеющий области с различной микроструктурой с электропроводящим покрытием - Google Patents

Многослойный элемент, имеющий области с различной микроструктурой с электропроводящим покрытием Download PDF

Info

Publication number
RU2379861C2
RU2379861C2 RU2007111712/09A RU2007111712A RU2379861C2 RU 2379861 C2 RU2379861 C2 RU 2379861C2 RU 2007111712/09 A RU2007111712/09 A RU 2007111712/09A RU 2007111712 A RU2007111712 A RU 2007111712A RU 2379861 C2 RU2379861 C2 RU 2379861C2
Authority
RU
Russia
Prior art keywords
relief structure
multilayer element
coating
depth
layer
Prior art date
Application number
RU2007111712/09A
Other languages
English (en)
Russian (ru)
Other versions
RU2007111712A (ru
Inventor
Андреас ШИЛЛИНГ (CH)
Андреас ШИЛЛИНГ
Уэйн Роберт ТОМПКИН (CH)
Уэйн Роберт ТОМПКИН
Original Assignee
Овд Кинеграм Аг
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Овд Кинеграм Аг filed Critical Овд Кинеграм Аг
Publication of RU2007111712A publication Critical patent/RU2007111712A/ru
Application granted granted Critical
Publication of RU2379861C2 publication Critical patent/RU2379861C2/ru

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30Identification or security features, e.g. for preventing forgery
    • B42D25/328Diffraction gratings; Holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/18Diffraction gratings
    • G02B5/1847Manufacturing methods
    • G02B5/1857Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09045Locally raised area or protrusion of insulating substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457Parallel ribs and/or grooves

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Materials For Medical Uses (AREA)
  • Prostheses (AREA)
RU2007111712/09A 2004-08-30 2005-08-24 Многослойный элемент, имеющий области с различной микроструктурой с электропроводящим покрытием RU2379861C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004042111.0 2004-08-30
DE102004042111A DE102004042111A1 (de) 2004-08-30 2004-08-30 Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung

Publications (2)

Publication Number Publication Date
RU2007111712A RU2007111712A (ru) 2008-10-10
RU2379861C2 true RU2379861C2 (ru) 2010-01-20

Family

ID=35789315

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2007111712/09A RU2379861C2 (ru) 2004-08-30 2005-08-24 Многослойный элемент, имеющий области с различной микроструктурой с электропроводящим покрытием

Country Status (13)

Country Link
US (1) US20080095986A1 (enExample)
EP (1) EP1785016B1 (enExample)
JP (1) JP4852547B2 (enExample)
KR (1) KR101184096B1 (enExample)
CN (1) CN100576974C (enExample)
AT (1) ATE432607T1 (enExample)
DE (2) DE102004042111A1 (enExample)
ES (1) ES2327943T3 (enExample)
MX (1) MX2007002118A (enExample)
PL (1) PL1785016T3 (enExample)
RU (1) RU2379861C2 (enExample)
TW (1) TW200619434A (enExample)
WO (1) WO2006024441A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006034095B4 (de) * 2006-07-20 2009-05-28 Leonhard Kurz Gmbh & Co. Kg Solarzelle auf Polymerbasis
DE102006050047A1 (de) 2006-10-24 2008-04-30 Giesecke & Devrient Gmbh Durchsichtssicherheitselement mit Mikrostrukturen
DE102007005416B4 (de) * 2007-01-30 2016-03-31 Leonhard Kurz Gmbh & Co. Kg Prägefolie und damit gebildeter Sicherheitsaufkleber
DE102007005088B4 (de) * 2007-02-01 2011-08-25 Leonhard Kurz GmbH & Co. KG, 90763 Solarzelle und Verfahren zu deren Herstellung
DE102007046679B4 (de) * 2007-09-27 2012-10-31 Polyic Gmbh & Co. Kg RFID-Transponder
DE102008017652A1 (de) * 2008-04-04 2009-10-08 Leonhard Kurz Stiftung & Co. Kg Sicherheitselement sowie Verfahren zur Herstellung eines Sicherheitselements
JP5568973B2 (ja) * 2009-12-11 2014-08-13 凸版印刷株式会社 偽造防止媒体および偽造防止ラベル並びに物品
RU2416894C1 (ru) * 2010-04-12 2011-04-20 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления рельефных печатных плат
RU2551838C1 (ru) * 2014-01-28 2015-05-27 Федеральное государственное казенное военное образовательное учреждение высшего профессионального образования "Военная академия войсковой противовоздушной обороны Вооруженных Сил Российской Федерации имени Маршала Советского Союза А.М. Василевского" Министерства Обороны Российской Федерации Многослойная печатная плата с двухслойным защитным покрытием
KR102209571B1 (ko) * 2014-12-31 2021-02-01 한국조폐공사 반투과성 편광이미지가 부가된 진위판정용 매체
FR3068563B1 (fr) * 2017-07-03 2019-10-04 Valeo Iluminacion Circuit electrique sur dispositif lumineux de vehicule
CN111103213B (zh) * 2019-04-19 2022-07-29 宁德时代新能源科技股份有限公司 涂层面密度检测装置和方法
CN111103214B (zh) * 2019-04-19 2022-07-29 宁德时代新能源科技股份有限公司 涂层面密度检测装置和方法
EP3965930A1 (de) 2019-05-10 2022-03-16 LEONHARD KURZ Stiftung & Co. KG Mikrofluidische anordnung, verfahren zu deren herstellung und messsystem umfassend die mikrofluidische anordnung sowie verwendung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2161382C2 (ru) * 1996-07-18 2000-12-27 НАГРА АйДи С.А. Способ изготовления печатных схем и печатная схема, изготовленная этим способом
US6284072B1 (en) * 1996-11-09 2001-09-04 Epigem Limited Multifunctional microstructures and preparation thereof
RU2214075C2 (ru) * 1998-05-16 2003-10-10 Бласберг Оберфлехентехник Гмбх Способ нанесения металлического покрытия на подложки

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1013410A (fr) * 1950-03-02 1952-07-29 Cercle pour la fabrication du fromage
EP0201323B1 (en) * 1985-05-07 1994-08-17 Dai Nippon Insatsu Kabushiki Kaisha Article incorporating a transparent hologramm
JPH0614579B2 (ja) * 1985-08-27 1994-02-23 三菱電線工業株式会社 金属芯基板及びその製造方法
JPS62134295A (ja) * 1985-12-06 1987-06-17 松下電器産業株式会社 Icカ−ド
JP3159558B2 (ja) * 1993-02-25 2001-04-23 関西ペイント株式会社 電波反射防止体及び電波反射防止方法
FR2716748B1 (fr) * 1994-02-25 1996-06-07 France Telecom Procédé de tapissage ou de remplissage par dépôt en phase gazeuse d'une structure en relief et application de ce procédé pour la fabrication d'éléments semi-conducteurs.
JPH07312322A (ja) * 1994-03-24 1995-11-28 Meidensha Corp 静止誘導電器の巻線成形方法
CH690067A5 (de) * 1995-08-10 2000-04-14 Ovd Kinegram Ag Verfahren zur Herstellung teilmetallisierter Gitterstrukturen.
JPH11186773A (ja) * 1997-12-25 1999-07-09 Sharp Corp 電磁波シールドキャビネット及びその製造方法並びに金型装置
JP2000098132A (ja) * 1998-09-17 2000-04-07 Toppan Printing Co Ltd 電磁波シールド効果を有する偏光ビームスプリッタ
JP2000113151A (ja) * 1998-10-01 2000-04-21 Tomoegawa Paper Co Ltd ラベル状icカード
JP2000124663A (ja) * 1998-10-16 2000-04-28 Toyobo Co Ltd 電磁波シールドフィルム
JP2001256457A (ja) * 2000-03-13 2001-09-21 Toshiba Corp 半導体装置及びその製造方法、icカード通信システム
DE10013410B4 (de) * 2000-03-17 2011-05-05 Ovd Kinegram Ag Laminat, insbesondere in Form von Karten, und Verfahren zu dessen Herstellung
US20020041009A1 (en) * 2000-07-05 2002-04-11 Matsushita Electric Industrial Co., Ltd Transmission line assembly chip and a manufacturing method thereof in a multi-chip module
JP2002356542A (ja) * 2001-05-31 2002-12-13 Canon Inc ポリヒドロキシアルカノエートを含むカード
AU2003224248B2 (en) * 2002-04-03 2006-01-19 De La Rue International Limited Optically variable security device
JP4019770B2 (ja) * 2002-04-05 2007-12-12 ソニー株式会社 衛星放送受信チューナーユニット、衛星放送受信フロントエンドユニット及び衛星放送受信装置
PL215626B1 (pl) * 2002-07-18 2014-01-31 Giesecke & Devrient Gmbh Papier zabezpieczony do wytwarzania dokumentów wartosciowych oraz dokument wartosciowy zawierajacy papier zabezpieczony
JP2004077954A (ja) * 2002-08-21 2004-03-11 Dainippon Printing Co Ltd 真正性確認用媒体および真正性確認方法
US7001658B2 (en) * 2003-04-28 2006-02-21 Eastman Kodak Company Heat selective electrically conductive polymer sheet
DE10333255B3 (de) * 2003-07-21 2005-01-13 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Erzeugung eines Flächenmusters hoher Auflösung
KR20060130543A (ko) * 2003-08-06 2006-12-19 유니버시티 오브 피츠버그 오브 더 커먼웰쓰 시스템 오브 하이어 에듀케이션 표면 플라즈몬-강화 나노-광 소자 및 그의 제조 방법
JP4747627B2 (ja) * 2004-07-23 2011-08-17 日立化成工業株式会社 回折型集光フィルム及びそれを用いた面光源装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2161382C2 (ru) * 1996-07-18 2000-12-27 НАГРА АйДи С.А. Способ изготовления печатных схем и печатная схема, изготовленная этим способом
US6284072B1 (en) * 1996-11-09 2001-09-04 Epigem Limited Multifunctional microstructures and preparation thereof
RU2214075C2 (ru) * 1998-05-16 2003-10-10 Бласберг Оберфлехентехник Гмбх Способ нанесения металлического покрытия на подложки

Also Published As

Publication number Publication date
PL1785016T3 (pl) 2009-10-30
EP1785016B1 (de) 2009-05-27
WO2006024441A2 (de) 2006-03-09
JP4852547B2 (ja) 2012-01-11
ATE432607T1 (de) 2009-06-15
KR101184096B1 (ko) 2012-09-18
TWI361229B (enExample) 2012-04-01
US20080095986A1 (en) 2008-04-24
TW200619434A (en) 2006-06-16
JP2008511846A (ja) 2008-04-17
DE102004042111A1 (de) 2006-03-09
MX2007002118A (es) 2007-10-02
DE502005007362D1 (de) 2009-07-09
EP1785016A2 (de) 2007-05-16
CN100576974C (zh) 2009-12-30
KR20070062535A (ko) 2007-06-15
CN101010995A (zh) 2007-08-01
WO2006024441A3 (de) 2006-05-11
RU2007111712A (ru) 2008-10-10
ES2327943T3 (es) 2009-11-05

Similar Documents

Publication Publication Date Title
RU2379861C2 (ru) Многослойный элемент, имеющий области с различной микроструктурой с электропроводящим покрытием
KR101306403B1 (ko) 다층체 및 그 제조 방법
KR102635312B1 (ko) 광학 효과층을 제조하는 방법
KR101196591B1 (ko) 유기 반도체 막
RU2384417C2 (ru) Оптически изменяемый элемент с электрически активным слоем
RU2377134C2 (ru) Защищенный от подделок защитный признак с эффектом переменного окрашивания
AU2004259256B2 (en) Method for producing a high-resolution surface pattern
AU2004259444B2 (en) Security element for radio frequency identification
RU2517506C2 (ru) Электронный и/или оптический блок устройства и способ его формирования
RU2566928C2 (ru) Структура микрорельефа
CN114475043B (zh) 光学防伪元件及其制作方法、防伪产品
RU2310241C2 (ru) Способ изготовления голографических этикеток
HK40007929B (en) Method for manufacturing personalised chip-free radiofrequency identification (rfid) devices

Legal Events

Date Code Title Description
MM4A The patent is invalid due to non-payment of fees

Effective date: 20200825