CN100576974C - 多层体及其制造方法，一种电路、线性偏振器、安全元件和安全文件 - Google Patents

多层体及其制造方法，一种电路、线性偏振器、安全元件和安全文件 Download PDF

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Publication number
CN100576974C
CN100576974C CN200580028846A CN200580028846A CN100576974C CN 100576974 C CN100576974 C CN 100576974C CN 200580028846 A CN200580028846 A CN 200580028846A CN 200580028846 A CN200580028846 A CN 200580028846A CN 100576974 C CN100576974 C CN 100576974C
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swelling structure
polylayer forest
swelling
depth
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Expired - Fee Related
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CN200580028846A
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Chinese (zh)
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CN101010995A (zh
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A·希林
W·R·汤普金
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OVD Kinegram AG
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OVD Kinegram AG
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/328—Diffraction gratings; Holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1847—Manufacturing methods
    • G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Materials For Medical Uses (AREA)
  • Prostheses (AREA)
CN200580028846A 2004-08-30 2005-08-24 多层体及其制造方法，一种电路、线性偏振器、安全元件和安全文件 Expired - Fee Related CN100576974C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004042111.0 2004-08-30
DE102004042111A DE102004042111A1 (de) 2004-08-30 2004-08-30 Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung

Publications (2)

Publication Number Publication Date
CN101010995A CN101010995A (zh) 2007-08-01
CN100576974C true CN100576974C (zh) 2009-12-30

Family

ID=35789315

Family Applications (1)

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CN200580028846A Expired - Fee Related CN100576974C (zh) 2004-08-30 2005-08-24 多层体及其制造方法，一种电路、线性偏振器、安全元件和安全文件

Country Status (13)

Country Link
US (1) US20080095986A1 (enExample)
EP (1) EP1785016B1 (enExample)
JP (1) JP4852547B2 (enExample)
KR (1) KR101184096B1 (enExample)
CN (1) CN100576974C (enExample)
AT (1) ATE432607T1 (enExample)
DE (2) DE102004042111A1 (enExample)
ES (1) ES2327943T3 (enExample)
MX (1) MX2007002118A (enExample)
PL (1) PL1785016T3 (enExample)
RU (1) RU2379861C2 (enExample)
TW (1) TW200619434A (enExample)
WO (1) WO2006024441A2 (enExample)

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DE102006034095B4 (de) * 2006-07-20 2009-05-28 Leonhard Kurz Gmbh & Co. Kg Solarzelle auf Polymerbasis
DE102006050047A1 (de) 2006-10-24 2008-04-30 Giesecke & Devrient Gmbh Durchsichtssicherheitselement mit Mikrostrukturen
DE102007005416B4 (de) * 2007-01-30 2016-03-31 Leonhard Kurz Gmbh & Co. Kg Prägefolie und damit gebildeter Sicherheitsaufkleber
DE102007005088B4 (de) * 2007-02-01 2011-08-25 Leonhard Kurz GmbH & Co. KG, 90763 Solarzelle und Verfahren zu deren Herstellung
DE102007046679B4 (de) 2007-09-27 2012-10-31 Polyic Gmbh & Co. Kg RFID-Transponder
DE102008017652A1 (de) * 2008-04-04 2009-10-08 Leonhard Kurz Stiftung & Co. Kg Sicherheitselement sowie Verfahren zur Herstellung eines Sicherheitselements
JP5568973B2 (ja) * 2009-12-11 2014-08-13 凸版印刷株式会社 偽造防止媒体および偽造防止ラベル並びに物品
RU2416894C1 (ru) * 2010-04-12 2011-04-20 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления рельефных печатных плат
RU2551838C1 (ru) * 2014-01-28 2015-05-27 Федеральное государственное казенное военное образовательное учреждение высшего профессионального образования "Военная академия войсковой противовоздушной обороны Вооруженных Сил Российской Федерации имени Маршала Советского Союза А.М. Василевского" Министерства Обороны Российской Федерации Многослойная печатная плата с двухслойным защитным покрытием
KR102209571B1 (ko) * 2014-12-31 2021-02-01 한국조폐공사 반투과성 편광이미지가 부가된 진위판정용 매체
FR3068563B1 (fr) * 2017-07-03 2019-10-04 Valeo Iluminacion Circuit electrique sur dispositif lumineux de vehicule
CN111103213B (zh) * 2019-04-19 2022-07-29 宁德时代新能源科技股份有限公司 涂层面密度检测装置和方法
CN111103214B (zh) * 2019-04-19 2022-07-29 宁德时代新能源科技股份有限公司 涂层面密度检测装置和方法
EP3965930A1 (de) * 2019-05-10 2022-03-16 LEONHARD KURZ Stiftung & Co. KG Mikrofluidische anordnung, verfahren zu deren herstellung und messsystem umfassend die mikrofluidische anordnung sowie verwendung

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US6284072B1 (en) * 1996-11-09 2001-09-04 Epigem Limited Multifunctional microstructures and preparation thereof
JP2001256457A (ja) * 2000-03-13 2001-09-21 Toshiba Corp 半導体装置及びその製造方法、ｉｃカード通信システム
US20020041009A1 (en) * 2000-07-05 2002-04-11 Matsushita Electric Industrial Co., Ltd Transmission line assembly chip and a manufacturing method thereof in a multi-chip module
CN1418151A (zh) * 2000-03-17 2003-05-14 Ovd基尼格拉姆股份公司 层状物特别是卡式层状物及其制造方法

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JPH0614579B2 (ja) * 1985-08-27 1994-02-23 三菱電線工業株式会社 金属芯基板及びその製造方法
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FR2716748B1 (fr) * 1994-02-25 1996-06-07 France Telecom Procédé de tapissage ou de remplissage par dépôt en phase gazeuse d'une structure en relief et application de ce procédé pour la fabrication d'éléments semi-conducteurs.
JPH07312322A (ja) * 1994-03-24 1995-11-28 Meidensha Corp 静止誘導電器の巻線成形方法
CH690067A5 (de) * 1995-08-10 2000-04-14 Ovd Kinegram Ag Verfahren zur Herstellung teilmetallisierter Gitterstrukturen.
RU2161382C2 (ru) * 1996-07-18 2000-12-27 НАГРА АйДи С.А. Способ изготовления печатных схем и печатная схема, изготовленная этим способом
JPH11186773A (ja) * 1997-12-25 1999-07-09 Sharp Corp 電磁波シールドキャビネット及びその製造方法並びに金型装置
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Publication number Priority date Publication date Assignee Title
US6284072B1 (en) * 1996-11-09 2001-09-04 Epigem Limited Multifunctional microstructures and preparation thereof
JP2001256457A (ja) * 2000-03-13 2001-09-21 Toshiba Corp 半導体装置及びその製造方法、ｉｃカード通信システム
CN1418151A (zh) * 2000-03-17 2003-05-14 Ovd基尼格拉姆股份公司 层状物特别是卡式层状物及其制造方法
US20020041009A1 (en) * 2000-07-05 2002-04-11 Matsushita Electric Industrial Co., Ltd Transmission line assembly chip and a manufacturing method thereof in a multi-chip module

Also Published As

Publication number Publication date
EP1785016A2 (de) 2007-05-16
KR20070062535A (ko) 2007-06-15
WO2006024441A3 (de) 2006-05-11
DE102004042111A1 (de) 2006-03-09
PL1785016T3 (pl) 2009-10-30
ATE432607T1 (de) 2009-06-15
KR101184096B1 (ko) 2012-09-18
RU2007111712A (ru) 2008-10-10
MX2007002118A (es) 2007-10-02
RU2379861C2 (ru) 2010-01-20
TWI361229B (enExample) 2012-04-01
WO2006024441A2 (de) 2006-03-09
EP1785016B1 (de) 2009-05-27
ES2327943T3 (es) 2009-11-05
DE502005007362D1 (de) 2009-07-09
US20080095986A1 (en) 2008-04-24
CN101010995A (zh) 2007-08-01
TW200619434A (en) 2006-06-16
JP4852547B2 (ja) 2012-01-11
JP2008511846A (ja) 2008-04-17

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