JP4852547B2 - 電気伝導性の膜を有する各種のミクロ構造領域を備えた多層体 - Google Patents

電気伝導性の膜を有する各種のミクロ構造領域を備えた多層体 Download PDF

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Publication number
JP4852547B2
JP4852547B2 JP2007528740A JP2007528740A JP4852547B2 JP 4852547 B2 JP4852547 B2 JP 4852547B2 JP 2007528740 A JP2007528740 A JP 2007528740A JP 2007528740 A JP2007528740 A JP 2007528740A JP 4852547 B2 JP4852547 B2 JP 4852547B2
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Japan
Prior art keywords
relief structure
multilayer body
region
film
lacquer layer
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Expired - Fee Related
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JP2007528740A
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Japanese (ja)
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JP2008511846A5 (enExample
JP2008511846A (ja
Inventor
アンドレーアス シリング
ヴァイネ ローベルト トンプキン
Original Assignee
オーファウデー キネグラム アーゲー
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Publication of JP2008511846A5 publication Critical patent/JP2008511846A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/328—Diffraction gratings; Holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1847—Manufacturing methods
    • G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Materials For Medical Uses (AREA)
  • Prostheses (AREA)
JP2007528740A 2004-08-30 2005-08-24 電気伝導性の膜を有する各種のミクロ構造領域を備えた多層体 Expired - Fee Related JP4852547B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004042111.0 2004-08-30
DE102004042111A DE102004042111A1 (de) 2004-08-30 2004-08-30 Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung
PCT/EP2005/009137 WO2006024441A2 (de) 2004-08-30 2005-08-24 Mehrschichtiger körper mit unterschiedlich mikrostrukturierten bereichen mit elektrisch leitfähiger beschichtung

Publications (3)

Publication Number Publication Date
JP2008511846A JP2008511846A (ja) 2008-04-17
JP2008511846A5 JP2008511846A5 (enExample) 2008-10-02
JP4852547B2 true JP4852547B2 (ja) 2012-01-11

Family

ID=35789315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007528740A Expired - Fee Related JP4852547B2 (ja) 2004-08-30 2005-08-24 電気伝導性の膜を有する各種のミクロ構造領域を備えた多層体

Country Status (13)

Country Link
US (1) US20080095986A1 (enExample)
EP (1) EP1785016B1 (enExample)
JP (1) JP4852547B2 (enExample)
KR (1) KR101184096B1 (enExample)
CN (1) CN100576974C (enExample)
AT (1) ATE432607T1 (enExample)
DE (2) DE102004042111A1 (enExample)
ES (1) ES2327943T3 (enExample)
MX (1) MX2007002118A (enExample)
PL (1) PL1785016T3 (enExample)
RU (1) RU2379861C2 (enExample)
TW (1) TW200619434A (enExample)
WO (1) WO2006024441A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006034095B4 (de) * 2006-07-20 2009-05-28 Leonhard Kurz Gmbh & Co. Kg Solarzelle auf Polymerbasis
DE102006050047A1 (de) 2006-10-24 2008-04-30 Giesecke & Devrient Gmbh Durchsichtssicherheitselement mit Mikrostrukturen
DE102007005416B4 (de) * 2007-01-30 2016-03-31 Leonhard Kurz Gmbh & Co. Kg Prägefolie und damit gebildeter Sicherheitsaufkleber
DE102007005088B4 (de) * 2007-02-01 2011-08-25 Leonhard Kurz GmbH & Co. KG, 90763 Solarzelle und Verfahren zu deren Herstellung
DE102007046679B4 (de) * 2007-09-27 2012-10-31 Polyic Gmbh & Co. Kg RFID-Transponder
DE102008017652A1 (de) * 2008-04-04 2009-10-08 Leonhard Kurz Stiftung & Co. Kg Sicherheitselement sowie Verfahren zur Herstellung eines Sicherheitselements
JP5568973B2 (ja) * 2009-12-11 2014-08-13 凸版印刷株式会社 偽造防止媒体および偽造防止ラベル並びに物品
RU2416894C1 (ru) * 2010-04-12 2011-04-20 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления рельефных печатных плат
RU2551838C1 (ru) * 2014-01-28 2015-05-27 Федеральное государственное казенное военное образовательное учреждение высшего профессионального образования "Военная академия войсковой противовоздушной обороны Вооруженных Сил Российской Федерации имени Маршала Советского Союза А.М. Василевского" Министерства Обороны Российской Федерации Многослойная печатная плата с двухслойным защитным покрытием
KR102209571B1 (ko) * 2014-12-31 2021-02-01 한국조폐공사 반투과성 편광이미지가 부가된 진위판정용 매체
FR3068563B1 (fr) * 2017-07-03 2019-10-04 Valeo Iluminacion Circuit electrique sur dispositif lumineux de vehicule
CN111103213B (zh) * 2019-04-19 2022-07-29 宁德时代新能源科技股份有限公司 涂层面密度检测装置和方法
CN111103214B (zh) * 2019-04-19 2022-07-29 宁德时代新能源科技股份有限公司 涂层面密度检测装置和方法
EP3965930A1 (de) 2019-05-10 2022-03-16 LEONHARD KURZ Stiftung & Co. KG Mikrofluidische anordnung, verfahren zu deren herstellung und messsystem umfassend die mikrofluidische anordnung sowie verwendung

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6248088A (ja) * 1985-08-27 1987-03-02 三菱電線工業株式会社 金属芯基板及びその製造方法
JPS62134295A (ja) * 1985-12-06 1987-06-17 松下電器産業株式会社 Ｉｃカ−ド
JPH06252582A (ja) * 1993-02-25 1994-09-09 Kansai Paint Co Ltd 電波反射防止体及び電波反射防止方法
JPH07312322A (ja) * 1994-03-24 1995-11-28 Meidensha Corp 静止誘導電器の巻線成形方法
JPH11186773A (ja) * 1997-12-25 1999-07-09 Sharp Corp 電磁波シールドキャビネット及びその製造方法並びに金型装置
JP2000098132A (ja) * 1998-09-17 2000-04-07 Toppan Printing Co Ltd 電磁波シールド効果を有する偏光ビームスプリッタ
JP2000113151A (ja) * 1998-10-01 2000-04-21 Tomoegawa Paper Co Ltd ラベル状ｉｃカード
JP2000124663A (ja) * 1998-10-16 2000-04-28 Toyobo Co Ltd 電磁波シールドフィルム
JP2002356542A (ja) * 2001-05-31 2002-12-13 Canon Inc ポリヒドロキシアルカノエートを含むカード
JP2003298437A (ja) * 2002-04-05 2003-10-17 Sony Corp 衛星放送受信チューナーユニット、衛星放送受信フロントエンドユニット及び衛星放送受信装置
JP2004077954A (ja) * 2002-08-21 2004-03-11 Dainippon Printing Co Ltd 真正性確認用媒体および真正性確認方法
JP2005521894A (ja) * 2002-04-03 2005-07-21 ドゥ ラ リュ インターナショナル リミティド 光学的に可変のセキュリティ・デバイス及び方法
JP2005532937A (ja) * 2002-07-18 2005-11-04 ギーゼッケ　ウント　デフリエント　ゲーエムベーハー 有価証券
JP2006058844A (ja) * 2004-07-23 2006-03-02 Hitachi Chem Co Ltd 回折型集光フィルム及びそれを用いた面光源装置
JP2006524900A (ja) * 2003-04-28 2006-11-02 イーストマン コダック カンパニー 熱選択的導電性ポリマーシート

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1013410A (fr) * 1950-03-02 1952-07-29 Cercle pour la fabrication du fromage
EP0201323B1 (en) * 1985-05-07 1994-08-17 Dai Nippon Insatsu Kabushiki Kaisha Article incorporating a transparent hologramm
FR2716748B1 (fr) * 1994-02-25 1996-06-07 France Telecom Procédé de tapissage ou de remplissage par dépôt en phase gazeuse d'une structure en relief et application de ce procédé pour la fabrication d'éléments semi-conducteurs.
CH690067A5 (de) * 1995-08-10 2000-04-14 Ovd Kinegram Ag Verfahren zur Herstellung teilmetallisierter Gitterstrukturen.
RU2161382C2 (ru) * 1996-07-18 2000-12-27 НАГРА АйДи С.А. Способ изготовления печатных схем и печатная схема, изготовленная этим способом
GB9623185D0 (en) * 1996-11-09 1997-01-08 Epigem Limited Improved micro relief element and preparation thereof
DE19822075C2 (de) * 1998-05-16 2002-03-21 Enthone Gmbh Verfahren zur metallischen Beschichtung von Substraten
JP2001256457A (ja) * 2000-03-13 2001-09-21 Toshiba Corp 半導体装置及びその製造方法、ｉｃカード通信システム
DE10013410B4 (de) * 2000-03-17 2011-05-05 Ovd Kinegram Ag Laminat, insbesondere in Form von Karten, und Verfahren zu dessen Herstellung
US20020041009A1 (en) * 2000-07-05 2002-04-11 Matsushita Electric Industrial Co., Ltd Transmission line assembly chip and a manufacturing method thereof in a multi-chip module
DE10333255B3 (de) * 2003-07-21 2005-01-13 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Erzeugung eines Flächenmusters hoher Auflösung
KR20060130543A (ko) * 2003-08-06 2006-12-19 유니버시티 오브 피츠버그 오브 더 커먼웰쓰 시스템 오브 하이어 에듀케이션 표면 플라즈몬-강화 나노-광 소자 및 그의 제조 방법

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6248088A (ja) * 1985-08-27 1987-03-02 三菱電線工業株式会社 金属芯基板及びその製造方法
JPS62134295A (ja) * 1985-12-06 1987-06-17 松下電器産業株式会社 Ｉｃカ−ド
JPH06252582A (ja) * 1993-02-25 1994-09-09 Kansai Paint Co Ltd 電波反射防止体及び電波反射防止方法
JPH07312322A (ja) * 1994-03-24 1995-11-28 Meidensha Corp 静止誘導電器の巻線成形方法
JPH11186773A (ja) * 1997-12-25 1999-07-09 Sharp Corp 電磁波シールドキャビネット及びその製造方法並びに金型装置
JP2000098132A (ja) * 1998-09-17 2000-04-07 Toppan Printing Co Ltd 電磁波シールド効果を有する偏光ビームスプリッタ
JP2000113151A (ja) * 1998-10-01 2000-04-21 Tomoegawa Paper Co Ltd ラベル状ｉｃカード
JP2000124663A (ja) * 1998-10-16 2000-04-28 Toyobo Co Ltd 電磁波シールドフィルム
JP2002356542A (ja) * 2001-05-31 2002-12-13 Canon Inc ポリヒドロキシアルカノエートを含むカード
JP2005521894A (ja) * 2002-04-03 2005-07-21 ドゥ ラ リュ インターナショナル リミティド 光学的に可変のセキュリティ・デバイス及び方法
JP2003298437A (ja) * 2002-04-05 2003-10-17 Sony Corp 衛星放送受信チューナーユニット、衛星放送受信フロントエンドユニット及び衛星放送受信装置
JP2005532937A (ja) * 2002-07-18 2005-11-04 ギーゼッケ　ウント　デフリエント　ゲーエムベーハー 有価証券
JP2004077954A (ja) * 2002-08-21 2004-03-11 Dainippon Printing Co Ltd 真正性確認用媒体および真正性確認方法
JP2006524900A (ja) * 2003-04-28 2006-11-02 イーストマン コダック カンパニー 熱選択的導電性ポリマーシート
JP2006058844A (ja) * 2004-07-23 2006-03-02 Hitachi Chem Co Ltd 回折型集光フィルム及びそれを用いた面光源装置

Also Published As

Publication number Publication date
PL1785016T3 (pl) 2009-10-30
EP1785016B1 (de) 2009-05-27
WO2006024441A2 (de) 2006-03-09
ATE432607T1 (de) 2009-06-15
RU2379861C2 (ru) 2010-01-20
KR101184096B1 (ko) 2012-09-18
TWI361229B (enExample) 2012-04-01
US20080095986A1 (en) 2008-04-24
TW200619434A (en) 2006-06-16
JP2008511846A (ja) 2008-04-17
DE102004042111A1 (de) 2006-03-09
MX2007002118A (es) 2007-10-02
DE502005007362D1 (de) 2009-07-09
EP1785016A2 (de) 2007-05-16
CN100576974C (zh) 2009-12-30
KR20070062535A (ko) 2007-06-15
CN101010995A (zh) 2007-08-01
WO2006024441A3 (de) 2006-05-11
RU2007111712A (ru) 2008-10-10
ES2327943T3 (es) 2009-11-05

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