KR101184096B1 - 전기 전도성 코팅을 구비한 상이한 미세구조 영역을 갖는다층체 - Google Patents

전기 전도성 코팅을 구비한 상이한 미세구조 영역을 갖는다층체 Download PDF

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Publication number
KR101184096B1
KR101184096B1 KR1020077007397A KR20077007397A KR101184096B1 KR 101184096 B1 KR101184096 B1 KR 101184096B1 KR 1020077007397 A KR1020077007397 A KR 1020077007397A KR 20077007397 A KR20077007397 A KR 20077007397A KR 101184096 B1 KR101184096 B1 KR 101184096B1
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South Korea
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relief structure
multilayer body
coating
region
relief
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Expired - Fee Related
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KR1020077007397A
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English (en)
Korean (ko)
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KR20070062535A (ko
Inventor
안드레아스 쉴링
웨인 로버트 톰킨
Original Assignee
오우브이디이 키네그램 악티엔개젤샤프트
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Publication of KR20070062535A publication Critical patent/KR20070062535A/ko
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30Identification or security features, e.g. for preventing forgery
    • B42D25/328Diffraction gratings; Holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/18Diffraction gratings
    • G02B5/1847Manufacturing methods
    • G02B5/1857Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09045Locally raised area or protrusion of insulating substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457Parallel ribs and/or grooves

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Materials For Medical Uses (AREA)
  • Prostheses (AREA)
KR1020077007397A 2004-08-30 2005-08-24 전기 전도성 코팅을 구비한 상이한 미세구조 영역을 갖는다층체 Expired - Fee Related KR101184096B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004042111A DE102004042111A1 (de) 2004-08-30 2004-08-30 Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung
DE102004042111.0 2004-08-30
PCT/EP2005/009137 WO2006024441A2 (de) 2004-08-30 2005-08-24 Mehrschichtiger körper mit unterschiedlich mikrostrukturierten bereichen mit elektrisch leitfähiger beschichtung

Publications (2)

Publication Number Publication Date
KR20070062535A KR20070062535A (ko) 2007-06-15
KR101184096B1 true KR101184096B1 (ko) 2012-09-18

Family

ID=35789315

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Application Number Title Priority Date Filing Date
KR1020077007397A Expired - Fee Related KR101184096B1 (ko) 2004-08-30 2005-08-24 전기 전도성 코팅을 구비한 상이한 미세구조 영역을 갖는다층체

Country Status (13)

Country Link
US (1) US20080095986A1 (enExample)
EP (1) EP1785016B1 (enExample)
JP (1) JP4852547B2 (enExample)
KR (1) KR101184096B1 (enExample)
CN (1) CN100576974C (enExample)
AT (1) ATE432607T1 (enExample)
DE (2) DE102004042111A1 (enExample)
ES (1) ES2327943T3 (enExample)
MX (1) MX2007002118A (enExample)
PL (1) PL1785016T3 (enExample)
RU (1) RU2379861C2 (enExample)
TW (1) TW200619434A (enExample)
WO (1) WO2006024441A2 (enExample)

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DE102006034095B4 (de) * 2006-07-20 2009-05-28 Leonhard Kurz Gmbh & Co. Kg Solarzelle auf Polymerbasis
DE102006050047A1 (de) 2006-10-24 2008-04-30 Giesecke & Devrient Gmbh Durchsichtssicherheitselement mit Mikrostrukturen
DE102007005416B4 (de) * 2007-01-30 2016-03-31 Leonhard Kurz Gmbh & Co. Kg Prägefolie und damit gebildeter Sicherheitsaufkleber
DE102007005088B4 (de) * 2007-02-01 2011-08-25 Leonhard Kurz GmbH & Co. KG, 90763 Solarzelle und Verfahren zu deren Herstellung
DE102007046679B4 (de) * 2007-09-27 2012-10-31 Polyic Gmbh & Co. Kg RFID-Transponder
DE102008017652A1 (de) * 2008-04-04 2009-10-08 Leonhard Kurz Stiftung & Co. Kg Sicherheitselement sowie Verfahren zur Herstellung eines Sicherheitselements
JP5568973B2 (ja) * 2009-12-11 2014-08-13 凸版印刷株式会社 偽造防止媒体および偽造防止ラベル並びに物品
RU2416894C1 (ru) * 2010-04-12 2011-04-20 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления рельефных печатных плат
RU2551838C1 (ru) * 2014-01-28 2015-05-27 Федеральное государственное казенное военное образовательное учреждение высшего профессионального образования "Военная академия войсковой противовоздушной обороны Вооруженных Сил Российской Федерации имени Маршала Советского Союза А.М. Василевского" Министерства Обороны Российской Федерации Многослойная печатная плата с двухслойным защитным покрытием
KR102209571B1 (ko) * 2014-12-31 2021-02-01 한국조폐공사 반투과성 편광이미지가 부가된 진위판정용 매체
FR3068563B1 (fr) * 2017-07-03 2019-10-04 Valeo Iluminacion Circuit electrique sur dispositif lumineux de vehicule
CN111103214B (zh) * 2019-04-19 2022-07-29 宁德时代新能源科技股份有限公司 涂层面密度检测装置和方法
CN111103213B (zh) * 2019-04-19 2022-07-29 宁德时代新能源科技股份有限公司 涂层面密度检测装置和方法
WO2020229016A1 (de) * 2019-05-10 2020-11-19 Leonhard Kurz Stiftung & Co. Kg Mikrofluidische anordnung, verfahren zu deren herstellung und messsystem umfassend die mikrofluidische anordnung sowie verwendung

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JP2000098132A (ja) * 1998-09-17 2000-04-07 Toppan Printing Co Ltd 電磁波シールド効果を有する偏光ビームスプリッタ
JP2000124663A (ja) * 1998-10-16 2000-04-28 Toyobo Co Ltd 電磁波シールドフィルム

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JP2000098132A (ja) * 1998-09-17 2000-04-07 Toppan Printing Co Ltd 電磁波シールド効果を有する偏光ビームスプリッタ
JP2000124663A (ja) * 1998-10-16 2000-04-28 Toyobo Co Ltd 電磁波シールドフィルム

Also Published As

Publication number Publication date
JP4852547B2 (ja) 2012-01-11
WO2006024441A3 (de) 2006-05-11
CN100576974C (zh) 2009-12-30
RU2379861C2 (ru) 2010-01-20
TW200619434A (en) 2006-06-16
PL1785016T3 (pl) 2009-10-30
ATE432607T1 (de) 2009-06-15
CN101010995A (zh) 2007-08-01
RU2007111712A (ru) 2008-10-10
DE102004042111A1 (de) 2006-03-09
US20080095986A1 (en) 2008-04-24
TWI361229B (enExample) 2012-04-01
WO2006024441A2 (de) 2006-03-09
MX2007002118A (es) 2007-10-02
EP1785016A2 (de) 2007-05-16
JP2008511846A (ja) 2008-04-17
DE502005007362D1 (de) 2009-07-09
KR20070062535A (ko) 2007-06-15
EP1785016B1 (de) 2009-05-27
ES2327943T3 (es) 2009-11-05

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