RU2005119004A - Сверхпроводник и способ его изготовления - Google Patents
Сверхпроводник и способ его изготовления Download PDFInfo
- Publication number
- RU2005119004A RU2005119004A RU2005119004/09A RU2005119004A RU2005119004A RU 2005119004 A RU2005119004 A RU 2005119004A RU 2005119004/09 A RU2005119004/09 A RU 2005119004/09A RU 2005119004 A RU2005119004 A RU 2005119004A RU 2005119004 A RU2005119004 A RU 2005119004A
- Authority
- RU
- Russia
- Prior art keywords
- superconductor
- superconducting
- thickness
- film deposition
- base layer
- Prior art date
Links
- 239000002887 superconductor Substances 0.000 title claims 4
- 238000004519 manufacturing process Methods 0.000 title claims 3
- 238000000034 method Methods 0.000 title 1
- 230000008021 deposition Effects 0.000 claims 5
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Physical Vapour Deposition (AREA)
Claims (3)
1. Способ изготовления сверхпроводника, включающий в себя этап формирования сверхпроводящего слоя на слое основы путем выполнения пленочного осаждении, по меньшей мере, три раза, причем толщина сверхпроводящей пленки, наносимой при каждом пленочном осаждении, составляет 0,3 мкм или менее, и при этом на слое основы формируют сверхпроводящую пленку с толщиной от 0,75 до 3 мкм.
2. Способ изготовления сверхпроводника по п.1, в котором скорость подачи слоя основы при каждом пленочном осаждении составляет по меньшей мере 0,04 м2/ч.
3. Сверхпроводник, содержащий сверхпроводящий слой, сформированный путем выполнения пленочного осаждения на слой основы, по меньшей мере, три раза, при этом сверхпроводящий слой имеет толщину в диапазоне от 0,75 до 3,0 мкм, причем толщина сверхпроводящей пленки, нанесенной при каждом пленочном осаждении, составляет 0,3 мкм или менее.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003324167A JP4626134B2 (ja) | 2003-09-17 | 2003-09-17 | 超電導体およびその製造方法 |
| JP2003-324167 | 2003-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2005119004A true RU2005119004A (ru) | 2006-01-27 |
| RU2332738C2 RU2332738C2 (ru) | 2008-08-27 |
Family
ID=34372740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2005119004/09A RU2332738C2 (ru) | 2003-09-17 | 2004-08-06 | Сверхпроводник и способ его изготовления |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7371586B2 (ru) |
| EP (1) | EP1667174B1 (ru) |
| JP (1) | JP4626134B2 (ru) |
| KR (1) | KR101056227B1 (ru) |
| CN (1) | CN100472670C (ru) |
| AU (1) | AU2004275128B8 (ru) |
| CA (1) | CA2510635A1 (ru) |
| HK (1) | HK1085304A1 (ru) |
| NZ (1) | NZ540721A (ru) |
| RU (1) | RU2332738C2 (ru) |
| WO (1) | WO2005029512A1 (ru) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2642015A1 (en) * | 2006-02-16 | 2007-08-23 | Sumitomo Electric Industries, Ltd. | Process for producing superconducting thin-film material, superconducting equipment and superconducting thin-film material |
| JP2007220467A (ja) * | 2006-02-16 | 2007-08-30 | Sumitomo Electric Ind Ltd | 超電導薄膜材料の製造方法、超電導機器、および超電導薄膜材料 |
| JP2007311194A (ja) * | 2006-05-18 | 2007-11-29 | Sumitomo Electric Ind Ltd | 超電導薄膜材料および超電導薄膜材料の製造方法 |
| JP4690246B2 (ja) * | 2006-05-19 | 2011-06-01 | 住友電気工業株式会社 | 超電導薄膜材料およびその製造方法 |
| CN104081472B (zh) * | 2012-02-01 | 2017-04-12 | 古河电气工业株式会社 | 超导线材的制造方法和超导线材 |
| EP2960954A1 (de) | 2014-06-24 | 2015-12-30 | Basf Se | Verfahren zur Herstellung eines Komposits umfassend eine Hochtemperatursupraleiter(HTS)-Schicht |
| JP6374365B2 (ja) * | 2015-09-16 | 2018-08-15 | 株式会社東芝 | 酸化物超電導体、およびその製造方法 |
| RU2757450C1 (ru) * | 2020-09-09 | 2021-10-15 | Автономная некоммерческая образовательная организация высшего образования "Сколковский институт науки и технологий" | Высокотемпературный сверхпроводящий гидрид и способ его получения |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62157641A (ja) * | 1985-12-27 | 1987-07-13 | Nec Kansai Ltd | カラ−陰極線管の蛍光面形成方法 |
| JPS643908A (en) * | 1987-06-26 | 1989-01-09 | Hitachi Ltd | Composite conductor |
| US5183800A (en) * | 1987-07-15 | 1993-02-02 | Sharp Kabushiki Kaisha | Interconnection method for semiconductor device comprising a high-temperature superconductive material |
| JPH01186657A (ja) * | 1988-01-14 | 1989-07-26 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPH02120231A (ja) * | 1988-10-27 | 1990-05-08 | Nec Corp | 酸化物超伝導薄膜の製造方法 |
| JP2853161B2 (ja) * | 1989-05-19 | 1999-02-03 | 住友電気工業株式会社 | 酸化物超電導膜の製造方法 |
| JPH0353413A (ja) * | 1989-07-21 | 1991-03-07 | Nippon Telegr & Teleph Corp <Ntt> | 超伝導配線 |
| JP2804102B2 (ja) * | 1989-08-11 | 1998-09-24 | 株式会社日立製作所 | 酸化物超格子材料 |
| JPH075437B2 (ja) * | 1989-09-29 | 1995-01-25 | 神奈川県 | 酸化物超伝導薄膜の製造方法 |
| JPH0672714A (ja) * | 1992-07-06 | 1994-03-15 | Toray Ind Inc | 超電導体およびその製造方法 |
| US5432151A (en) * | 1993-07-12 | 1995-07-11 | Regents Of The University Of California | Process for ion-assisted laser deposition of biaxially textured layer on substrate |
| JPH07206437A (ja) * | 1994-01-13 | 1995-08-08 | Toray Ind Inc | 超電導体およびその製造方法 |
| US6451450B1 (en) * | 1995-04-10 | 2002-09-17 | Ut-Battelle, Llc | Method of depositing a protective layer over a biaxially textured alloy substrate and composition therefrom |
| JPH10218698A (ja) * | 1997-02-06 | 1998-08-18 | Idotai Tsushin Sentan Gijutsu Kenkyusho:Kk | 超伝導薄膜の成膜方法 |
| US6312819B1 (en) * | 1999-05-26 | 2001-11-06 | The Regents Of The University Of California | Oriented conductive oxide electrodes on SiO2/Si and glass |
| EP1271666A3 (en) * | 2001-06-22 | 2006-01-25 | Fujikura Ltd. | Oxide superconductor layer and its production method |
| KR100900417B1 (ko) * | 2002-05-24 | 2009-06-01 | 스미토모덴키고교가부시키가이샤 | 산화물 초전도 와이어의 제조방법 |
-
2003
- 2003-09-17 JP JP2003324167A patent/JP4626134B2/ja not_active Expired - Fee Related
-
2004
- 2004-08-06 US US10/536,694 patent/US7371586B2/en not_active Expired - Fee Related
- 2004-08-06 CA CA002510635A patent/CA2510635A1/en not_active Abandoned
- 2004-08-06 EP EP04771646.9A patent/EP1667174B1/en not_active Revoked
- 2004-08-06 WO PCT/JP2004/011679 patent/WO2005029512A1/ja active Application Filing
- 2004-08-06 KR KR1020057012535A patent/KR101056227B1/ko active IP Right Grant
- 2004-08-06 CN CNB2004800023614A patent/CN100472670C/zh not_active Expired - Fee Related
- 2004-08-06 NZ NZ540721A patent/NZ540721A/en not_active IP Right Cessation
- 2004-08-06 AU AU2004275128A patent/AU2004275128B8/en not_active Ceased
- 2004-08-06 RU RU2005119004/09A patent/RU2332738C2/ru not_active IP Right Cessation
-
2006
- 2006-05-08 HK HK06105357.0A patent/HK1085304A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| AU2004275128A1 (en) | 2005-03-31 |
| KR20060115956A (ko) | 2006-11-13 |
| US7371586B2 (en) | 2008-05-13 |
| CA2510635A1 (en) | 2005-03-31 |
| NZ540721A (en) | 2008-04-30 |
| CN1739171A (zh) | 2006-02-22 |
| AU2004275128B8 (en) | 2009-12-03 |
| EP1667174A1 (en) | 2006-06-07 |
| HK1085304A1 (en) | 2006-08-18 |
| EP1667174B1 (en) | 2013-10-09 |
| AU2004275128B2 (en) | 2009-05-28 |
| JP4626134B2 (ja) | 2011-02-02 |
| KR101056227B1 (ko) | 2011-08-11 |
| JP2005093205A (ja) | 2005-04-07 |
| EP1667174A4 (en) | 2010-11-24 |
| RU2332738C2 (ru) | 2008-08-27 |
| CN100472670C (zh) | 2009-03-25 |
| US20060014304A1 (en) | 2006-01-19 |
| WO2005029512A1 (ja) | 2005-03-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20120807 |