PL195792B1 - Sposób i kompozycja do inhibitowania adsorpcji sodu do powierzchni obwodów scalonych podczas usuwania fotomaski lub oczyszczania po trawieniu metalu za pomocą kompozycji zawierającej organiczny rozpuszczalnik - Google Patents
Sposób i kompozycja do inhibitowania adsorpcji sodu do powierzchni obwodów scalonych podczas usuwania fotomaski lub oczyszczania po trawieniu metalu za pomocą kompozycji zawierającej organiczny rozpuszczalnikInfo
- Publication number
- PL195792B1 PL195792B1 PL01357383A PL35738301A PL195792B1 PL 195792 B1 PL195792 B1 PL 195792B1 PL 01357383 A PL01357383 A PL 01357383A PL 35738301 A PL35738301 A PL 35738301A PL 195792 B1 PL195792 B1 PL 195792B1
- Authority
- PL
- Poland
- Prior art keywords
- composition
- weight
- weak acid
- amount
- acid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19007100P | 2000-03-20 | 2000-03-20 | |
| PCT/US2001/008772 WO2001071429A1 (en) | 2000-03-20 | 2001-03-19 | Method and composition for removing sodium-containing material from microcircuit substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PL357383A1 PL357383A1 (en) | 2004-07-26 |
| PL195792B1 true PL195792B1 (pl) | 2007-10-31 |
Family
ID=22699906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL01357383A PL195792B1 (pl) | 2000-03-20 | 2001-03-19 | Sposób i kompozycja do inhibitowania adsorpcji sodu do powierzchni obwodów scalonych podczas usuwania fotomaski lub oczyszczania po trawieniu metalu za pomocą kompozycji zawierającej organiczny rozpuszczalnik |
Country Status (15)
| Country | Link |
|---|---|
| EP (1) | EP1307786B1 (enExample) |
| JP (1) | JP4671575B2 (enExample) |
| KR (1) | KR100876067B1 (enExample) |
| CN (1) | CN1230718C (enExample) |
| AT (1) | ATE467154T1 (enExample) |
| AU (1) | AU2001245861A1 (enExample) |
| CA (1) | CA2403730C (enExample) |
| DE (1) | DE60142054D1 (enExample) |
| ES (1) | ES2345872T3 (enExample) |
| IL (2) | IL151792A0 (enExample) |
| MY (1) | MY129673A (enExample) |
| NZ (1) | NZ522079A (enExample) |
| PL (1) | PL195792B1 (enExample) |
| TW (1) | TWI239435B (enExample) |
| WO (1) | WO2001071429A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6326130B1 (en) | 1993-10-07 | 2001-12-04 | Mallinckrodt Baker, Inc. | Photoresist strippers containing reducing agents to reduce metal corrosion |
| PL207297B1 (pl) * | 2002-06-07 | 2010-11-30 | Mallinckrodt Baker Inc | Bezkrzemianowa kompozycja czyszcząca i zastosowanie bezkrzemianowej kompozycji czyszczącej |
| AU2003257636A1 (en) | 2002-08-22 | 2004-03-11 | Daikin Industries, Ltd. | Removing solution |
| JP4005092B2 (ja) * | 2004-08-20 | 2007-11-07 | 東京応化工業株式会社 | 洗浄除去用溶剤 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5417802A (en) | 1994-03-18 | 1995-05-23 | At&T Corp. | Integrated circuit manufacturing |
| JPH10171130A (ja) * | 1996-12-10 | 1998-06-26 | Fuji Film Oorin Kk | フォトレジスト剥離液 |
| ATE436043T1 (de) | 1998-05-18 | 2009-07-15 | Mallinckrodt Baker Inc | Alkalische, silikat enthaltende reinigungslösungen für mikroelektronische substrate |
-
2001
- 2001-02-08 MY MYPI20010558A patent/MY129673A/en unknown
- 2001-02-21 TW TW090103920A patent/TWI239435B/zh not_active IP Right Cessation
- 2001-03-19 KR KR1020027012303A patent/KR100876067B1/ko not_active Expired - Fee Related
- 2001-03-19 CN CNB018067050A patent/CN1230718C/zh not_active Expired - Fee Related
- 2001-03-19 AT AT01918830T patent/ATE467154T1/de active
- 2001-03-19 JP JP2001569560A patent/JP4671575B2/ja not_active Expired - Fee Related
- 2001-03-19 IL IL15179201A patent/IL151792A0/xx active IP Right Grant
- 2001-03-19 WO PCT/US2001/008772 patent/WO2001071429A1/en not_active Ceased
- 2001-03-19 EP EP01918830A patent/EP1307786B1/en not_active Expired - Lifetime
- 2001-03-19 ES ES01918830T patent/ES2345872T3/es not_active Expired - Lifetime
- 2001-03-19 PL PL01357383A patent/PL195792B1/pl not_active IP Right Cessation
- 2001-03-19 DE DE60142054T patent/DE60142054D1/de not_active Expired - Lifetime
- 2001-03-19 CA CA002403730A patent/CA2403730C/en not_active Expired - Fee Related
- 2001-03-19 NZ NZ522079A patent/NZ522079A/en not_active IP Right Cessation
- 2001-03-19 AU AU2001245861A patent/AU2001245861A1/en not_active Abandoned
-
2002
- 2002-09-17 IL IL151792A patent/IL151792A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE60142054D1 (de) | 2010-06-17 |
| CN1230718C (zh) | 2005-12-07 |
| KR100876067B1 (ko) | 2008-12-26 |
| EP1307786A1 (en) | 2003-05-07 |
| PL357383A1 (en) | 2004-07-26 |
| JP2003528353A (ja) | 2003-09-24 |
| CN1418330A (zh) | 2003-05-14 |
| AU2001245861A1 (en) | 2001-10-03 |
| EP1307786B1 (en) | 2010-05-05 |
| JP4671575B2 (ja) | 2011-04-20 |
| IL151792A0 (en) | 2003-04-10 |
| MY129673A (en) | 2007-04-30 |
| CA2403730C (en) | 2009-09-08 |
| IL151792A (en) | 2006-07-05 |
| KR20030051416A (ko) | 2003-06-25 |
| NZ522079A (en) | 2004-06-25 |
| ATE467154T1 (de) | 2010-05-15 |
| ES2345872T3 (es) | 2010-10-05 |
| WO2001071429A1 (en) | 2001-09-27 |
| CA2403730A1 (en) | 2001-09-27 |
| TWI239435B (en) | 2005-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100323326B1 (ko) | 플라즈마 에칭 잔류물 제거용 비부식성 세정 조성물 | |
| EP0596515B1 (en) | Alkaline photoresist stripping composition producing reduced metal corrosion | |
| US7807613B2 (en) | Aqueous buffered fluoride-containing etch residue removers and cleaners | |
| US20060063687A1 (en) | Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate | |
| JP5886946B2 (ja) | 銅、タングステンおよび多孔質低κ誘電体に対する増強された相溶性を有する半水溶性ポリマー除去組成物 | |
| EP1178359A2 (en) | Stripping composition | |
| JP2006505629A (ja) | 水性ストリッピング及びクリーニング組成物 | |
| CA2590325A1 (en) | Resist, barc and gap fill material stripping chemical and method | |
| US6432209B2 (en) | Composition and method for removing resist and etching residues using hydroxylazmmonium carboxylates | |
| KR101999641B1 (ko) | 구리/아졸 중합체 억제를 갖는 마이크로일렉트로닉 기판 세정 조성물 | |
| KR101221560B1 (ko) | 변성된 포토레지스트 제거를 위한 반도체 소자용 박리액조성물 | |
| US20020068684A1 (en) | Stripping and cleaning compositions | |
| JP4698123B2 (ja) | レジスト除去剤組成物 | |
| PL195792B1 (pl) | Sposób i kompozycja do inhibitowania adsorpcji sodu do powierzchni obwodów scalonych podczas usuwania fotomaski lub oczyszczania po trawieniu metalu za pomocą kompozycji zawierającej organiczny rozpuszczalnik | |
| US6899818B2 (en) | Method and composition for removing sodium-containing material from microcircuit substrates | |
| KR101319217B1 (ko) | 포토레지스트 박리액 조성물 및 이를 이용하는포토레지스트의 박리방법 | |
| CN115895800A (zh) | 半水基晶圆基底清洗液组合物及其使用方法 | |
| KR102836356B1 (ko) | 포토레지스트 박리 조성물 | |
| KR100378551B1 (ko) | 레지스트 리무버 조성물 | |
| KR100410612B1 (ko) | 스트립후 세정제 | |
| KR20080017848A (ko) | 포토레지스트 박리액 및 이를 이용한 박리 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Decisions on the lapse of the protection rights |
Effective date: 20120319 |